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STMicroelectronics H3LIS331DL
- Part No.:
- H3LIS331DL
- Manufacturer:
- STMicroelectronics
- Category:
- Accelerometers
- Package:
- 16-VFLGA
- Datasheet:
-
H3LIS331DL.pdf
- Description:
- ACCEL 100-400G I2C/SPI 16TFLGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,094
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Product details
Overview
H3LIS331DL from STMicroelectronics is a high-g, low-power 3-axis digital MEMS accelerometer with I²C/SPI interface, ±100g/±200g/±400g dynamically selectable full scale, 0.5 Hz–1 kHz output data rate, and 7 µA low-power mode current. It delivers shock detection and impact logging in wearables, sports concussion monitors, and asset tracking systems.
For engineers reviewing the H3LIS331DL datasheet, H3LIS331DL pinout, H3LIS331DL application, or H3LIS331DL equivalent, key selection criteria include programmable inertial interrupts (INT1/INT2), factory-calibrated sensitivity (49–195 mg/digit), 10000 g shock survivability, and dual-supply operation (Vdd = 2.16–3.6 V, Vdd_IO = 1.71–Vdd+0.1 V).
Technical Context
The H3LIS331DL integrates a surface-micromachined capacitive sensing element with a low-noise charge amplifier and 12-bit ADC, enabling DC-coupled acceleration measurement across three orthogonal axes. Its digital interface supports both I²C (up to 400 kHz) and SPI (up to 10 MHz), with CS pin selecting protocol mode and SA0 configuring I²C slave address (0x30/0x32 or 0x31/0x33).
Sleep-to-wake-up functionality operates in low-power mode (7 µA at 0.5 Hz ODR), where internal logic continuously monitors acceleration thresholds and triggers INT1/INT2 to wake the host MCU. Factory-trimmed sensitivity and zero-g offset are stored in nonvolatile memory and auto-loaded at power-on, eliminating field calibration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Full Scale Range | ±100g / ±200g / ±400g - user-selectable via register bits; enables optimal resolution for low-impact logging or high-shock event capture |
| Sensitivity | 49 mg/digit (±100g) / 98 mg/digit (±200g) / 195 mg/digit (±400g) - determines LSB-to-g conversion accuracy for raw register interpretation |
| Output Data Rate | 0.5 Hz–1 kHz - configurable in normal (50/100/400/1000 Hz) and low-power (0.5/1/2/5/10 Hz) modes for dynamic power/performance trade-offs |
| Supply Current | 7 µA (low-power mode, 0.5 Hz) / 260–370 µA (normal mode, 50–1000 Hz) - defines battery life in always-on wearable or IoT edge nodes |
| Shock Survivability | 10000 g for 0.1 ms - ensures operational integrity during severe mechanical impacts like crash events or sports collisions |
| Operating Temperature | −40°C to +85°C - validated for automotive cabin, industrial equipment, and outdoor sports gear environments |
| Interface Voltage | Vdd_IO = 1.71–Vdd+0.1 V (1.8 V compatible) - allows direct interfacing with 1.8 V microcontrollers without level shifters |
Pinout & Package
The H3LIS331DL is housed in a 3 × 3 × 1.0 mm³ TFLGA-16L (Thin Fine-Pitch Land Grid Array) package with exposed pad for thermal and mechanical stability. Pin 1 is marked by a dot on the top view; all NC pins must remain unconnected.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Vdd_IO | Independent I/O supply rail - powers digital interface logic; decoupled separately from core sensor supply (Vdd) |
| 4 | SCL/SPC | Shared clock input - functions as I²C SCL or SPI SPC depending on CS state; requires external pull-up to Vdd_IO |
| 6 | SDA/SDI/SDO | Multi-function bidirectional data line - serves as I²C SDA, SPI SDI (input), or 3-wire SDO (output) |
| 7 | SDO/SA0 | Dual-role terminal - SPI serial data output (SDO) or I²C slave address LSB (SA0); sets device address to 0x30/0x32 or 0x31/0x33 |
| 8 | CS | Protocol select enable - high = I²C mode, low = SPI mode; must be tied high for I²C-only applications |
| 9, 11 | INT2, INT1 | Programmable inertial interrupt outputs - configurable for motion detection, free-fall, click/double-click, or threshold exceedance events |
| 14 | Vdd | Analog core supply - powers MEMS sensing element and signal chain; requires 100 nF ceramic + 10 µF aluminum decoupling |
Key Features
| Feature | Design Value |
|---|---|
| Dynamic Full-Scale Selection | Runtime reconfiguration of ±100g/±200g/±400g range via control register - enables single BOM for multi-application deployment (e.g., concussion vs. crash detection) |
| Factory-Calibrated Offset & Sensitivity | Trim values stored in nonvolatile memory and auto-loaded at boot - eliminates need for system-level calibration in production test or field use |
| Programmable High-Pass Filter | Configurable cut-off frequency to remove gravity component - enables accurate tilt-independent motion detection and zero-g offset cancellation |
| Low-Power Sleep-to-Wake | 7 µA operation with continuous acceleration monitoring and interrupt-driven wake-up - extends battery life in always-on impact logging devices |
| Dual Supply Architecture | Separate Vdd (2.16–3.6 V) and Vdd_IO (1.71–Vdd+0.1 V) rails - permits 1.8 V host MCU interfacing while maintaining full sensor performance |
Applications
| Car Crash Detection | Concussion Monitoring |
|---|---|
|
Use Scenario: Mounted inside vehicle cabin or seatbelt assembly to detect rapid deceleration exceeding 50 g within 10 ms. IC Role / Device Role / Timing Role: Primary high-g event trigger feeding real-time airbag deployment logic or emergency call activation. Use Value: 10000 g shock survivability ensures reliable operation post-impact; ±400g full scale captures peak crash transients without saturation. |
Use Scenario: Integrated into football helmet or hockey mouthguard to log head accelerations > 80 g over sub-10 ms duration. IC Role / Device Role / Timing Role: Edge-sensing node capturing biomechanical impact metrics for real-time alerting and post-event analysis. Use Value: Programmable INT1/INT2 with independent thresholds enables dual-trigger validation (e.g., magnitude + duration) to reduce false positives. |
| Asset Impact Logging | Wearable Fall Detection |
|
Use Scenario: Embedded in shipping container or logistics pallet to record drop events > 200 g during transit. IC Role / Device Role / Timing Role: Standalone shock logger with timestamped event storage and wake-on-impact capability. Use Value: 7 µA low-power mode enables multi-month battery life; ±400g range captures freight-handling impacts without clipping. |
Use Scenario: Used in smartwatch or medical pendant to identify rapid vertical displacement (> 3 g) followed by prolonged immobility. IC Role / Device Role / Timing Role: Motion classifier feeding fall-detection algorithm with validated acceleration vector and timing profile. Use Value: 0.5 Hz–1 kHz ODR configurability balances background monitoring (low power) and responsive detection (high bandwidth). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-g accelerometer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ADXL372 | 2000 g full scale, 22 µA typical current at 1.6 kHz ODR, integrated FFT engine | Targets higher-g industrial shock testing; lacks ±100g/±200g/±400g dynamic scaling | Choose ADXL372 for ultra-high-g (>500 g) transient capture with onboard spectral analysis |
| LSM303AGR | Integrated 3-axis accelerometer + magnetometer, ±2/±4/±8/±16 g range, 10 µA LP mode | Optimized for compass-assisted navigation; insufficient for >100 g impact detection | Choose LSM303AGR for orientation-aware wearables requiring magnetic heading, not high-g event capture |
Compared with ADXL372 and LSM303AGR, the H3LIS331DL uniquely balances wide dynamic full-scale selection (±100g to ±400g), ultra-low 7 µA sleep current, and 10000 g survivability-making it the only option qualified for both concussion-level impact logging and automotive crash detection in a single footprint.
Availability
H3LIS331DL is available at Aetrix Electronics and suitable for car crash detection systems, sports concussion monitors, asset impact loggers, and wearable fall detectors requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for H3LIS331DL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, MEMS, power, and microcontroller solutions for industrial, automotive, and consumer markets.
The H3LIS331DL belongs to ST's high-g MEMS accelerometer product line, engineered specifically for reliable shock and impact detection in safety-critical and portable electronic applications where robustness, low power, and factory-trimmed accuracy are mandatory.
FAQ
What is the minimum supply voltage required for H3LIS331DL operation?
The H3LIS331DL requires Vdd between 2.16 V and 3.6 V for core sensor operation, and Vdd_IO between 1.71 V and Vdd+0.1 V for I/O functionality. Operation below 2.16 V risks incomplete initialization, invalid register reads, or failure to enter low-power mode - verified per DS9012 Rev 5 absolute maximum ratings and electrical characteristics tables.
How does the sleep-to-wake-up function operate without host intervention?
The H3LIS331DL continuously monitors acceleration in low-power mode using dedicated hardware comparators and threshold registers. When configured interrupt conditions (e.g., INT1 on high-pass filtered Z-axis > 2 g for 5 ms) occur, the device asserts the INT1 pin and automatically transitions to full-performance mode - no host firmware polling or clock gating is required.
Can H3LIS331DL be used with a 1.8 V microcontroller without level shifters?
Yes - the Vdd_IO rail accepts 1.8 V directly (within 1.71–Vdd+0.1 V range), and all digital I/O pins (SCL/SPC, SDA/SDI/SDO, CS, INT1, INT2) are 1.8 V compatible. The internal pull-ups connect to Vdd_IO, ensuring correct logic levels when interfaced to 1.8 V MCUs via I²C or SPI.
What is the purpose of the SA0 pin beyond I²C addressing?
The SA0 pin serves exclusively as the least-significant bit of the I²C slave address (0x30/0x32 or 0x31/0x33) and has no secondary function. In SPI mode, SA0 becomes SDO (serial data output) and is not used for addressing - this dual role is defined in Table 7 and Figure 2 of DS9012 Rev 5, with no alternate configurations supported.
H3LIS331DL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- ECOPACK®
- Package/Case:
- 16-VFLGA
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- Digital
- Axis:
- X, Y, Z
- Acceleration Range:
- ±100g, ±200g, ±400g
- Sensitivity (LSB/g):
- 20 (±100g) ~ 5 (±400g)
- Sensitivity (mV/g):
- -
- Bandwidth:
- 25Hz ~ 500Hz
- Output Type:
- I2C, SPI
- Voltage - Supply:
- 2.16V ~ 3.6V
- Features:
- Selectable Scale
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-TFLGA (3x3)
H3LIS331DL FAQ
1.How can I place an order for H3LIS331DL through Aetrix?
Please submit a Request for Quotation (RFQ) for H3LIS331DL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for H3LIS331DL reliable?
The price and inventory of H3LIS331DL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for H3LIS331DL is usually 5 days.
3.What payment methods are accepted for H3LIS331DL?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for H3LIS331DL transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for H3LIS331DL?
H3LIS331DL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your H3LIS331DL order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for H3LIS331DL?
For technical support, including H3LIS331DL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your H3LIS331DL requirements.
6.How does Aetrix verify that H3LIS331DL is sourced from the original manufacturer or authorized distributors?
All H3LIS331DL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that H3LIS331DL meets industry standards.
7.What is the process for return or replacement of H3LIS331DL?
All H3LIS331DL units undergo pre-shipment inspection (PSI). If there is an issue with H3LIS331DL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The H3LIS331DL part is unused and in its original packaging.
Return procedure for H3LIS331DL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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