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STMicroelectronics HSP051-4M10
- Part No.:
- HSP051-4M10
- Manufacturer:
- STMicroelectronics
- Category:
- TVS Diodes
- Package:
- 10-XFDFN
- Datasheet:
-
HSP051-4M10.pdf
- Description:
- TVS DIODE 3.6VWM 10VC 10UQFN
- Quantity:
- Payment:
- Shipping:
Inventory:88,831
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Product details
Overview
HSP051-4M10 from STMicroelectronics is a 4-channel, rail-to-rail ESD protection array in µQFN-10L (2.5 mm × 1.0 mm) for high-speed differential interfaces. It delivers ultralow I/O-to-I/O capacitance (0.2 pF typ.), 10 GHz bandwidth, 0.48 Ω dynamic resistance (I/O-to-GND), 100 Ω differential impedance, and ±8 kV IEC 61000-4-2 contact discharge protection - enabling HDMI 2.0 (5.94 Gbps), USB 3.1 (10 Gbps), and DisplayPort line protection without signal integrity degradation.
For engineers reviewing the HSP051-4M10 datasheet, HSP051-4M10 pinout, HSP051-4M10 application, or HSP051-4M10 equivalent, key selection criteria include differential impedance matching (85–115 Ω), sub-0.3 pF channel capacitance stability up to 9 GHz, clamping voltage ≤13 V at 16 A (IEC +8 kV), junction temperature range (–40 °C to +150 °C), and µQFN-10L footprint compatibility with high-density PCB layouts.
Technical Context
The HSP051-4M10 employs a symmetric rail-to-rail diode architecture with matched I/O paths to preserve differential signal skew and timing integrity. Its ultralow, frequency-stable capacitance (0.2 pF I/O–I/O, 0.35 pF I/O–GND up to 9 GHz) and 10 GHz –3 dB bandwidth ensure minimal insertion loss (<0.5 dB up to 10 GHz per S21 measurement) on HDMI 2.0 and USB 3.1 Gen2 lanes.
Dynamic resistance is specified at 0.48 Ω (I/O-to-GND) and 0.96 Ω (GND-to-I/O) under 100 ns TLP pulses, enabling fast clamping response with peak voltage limited to 13 V at 30 ns during +8 kV IEC contact discharge. The device operates across –40 °C to +150 °C junction temperature, supporting automotive infotainment and industrial display modules.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating | ±8 kV contact / ±15 kV air (IEC 61000-4-2 Level 4); meets MIL-STD-883G Class 3B for rugged system-level ESD immunity |
| Capacitance (I/O–I/O) | 0.2 pF typ. @ 200 MHz–9 GHz; ensures <0.1 UI jitter impact on 10 Gbps USB 3.1 eye diagrams |
| Capacitance (I/O–GND) | 0.35 pF typ. @ 2.5–9 GHz; maintains balanced differential impedance and minimizes common-mode noise coupling |
| Clamping Voltage | 13 V @ 30 ns, +8 kV contact (16 A pulse); protects 3.3 V/3.6 V interface ICs from overvoltage stress |
| Differential Impedance | 100 Ω typ. (85–115 Ω range); matches HDMI/USB/DP transmission lines to reduce reflections and return loss |
| Operating Temperature | –40 °C to +150 °C junction; supports under-hood automotive displays and industrial panel PCs |
| Package | µQFN-10L (2.5 mm × 1.0 mm, 0.5 mm pitch, 0.5 mm max height); enables <1.2 mm² board area per 4-line protection channel |
Pinout & Package
Package: µQFN-10L, 2.5 mm × 1.0 mm body, 0.5 mm pitch, exposed thermal pad (pin 7), RoHS-compliant lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | I/O 1 | Protected high-speed differential input/output channel (e.g., HDMI TMDS+) |
| 2 | I/O 2 | Paired differential channel (e.g., HDMI TMDS–); matched path length and capacitance to Pin 1 |
| 3 | GND | Signal reference ground; connects to PCB ground plane via exposed thermal pad (Pin 7) |
| 4 | I/O 3 | Second protected differential pair (e.g., USB 3.1 TX+) |
| 5 | I/O 4 | Complementary channel to Pin 4 (e.g., USB 3.1 TX–); rail-to-rail symmetry preserves common-mode rejection |
| 6 | GND | Secondary ground terminal; enhances low-inductance return path for multi-channel ESD current dissipation |
| 7 | Exposed Pad | Thermal and electrical ground connection; must be soldered to solid PCB ground plane for optimal clamping performance |
| 8, 9, 10 | Internally not connected | No internal bond wires; unused pins electrically isolated to prevent parasitic coupling or layout constraints |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through routing | Linear I/O–I/O signal path minimizes stub length and discontinuity, preserving >90% signal energy up to 10 GHz |
| Ultralow capacitance variation | ≤0.1 pF deviation across 200 MHz–9 GHz; eliminates frequency-dependent skew in multi-gigabit serial links |
| Rail-to-rail architecture | Equal forward/reverse conduction thresholds (VBR = 4.5–5.8 V); ensures symmetrical clamping on bidirectional differential signals |
| 100 Ω differential impedance match | Validated by TDR (Zdiff = 85–115 Ω); reduces insertion loss to <–0.3 dB at 5 GHz and maintains HDMI 2.0 mask compliance |
| High-temperature operation | Full electrical specs guaranteed to +150 °C junction; supports display modules in sealed enclosures without derating |
Applications
| HDMI 2.0 Interface Protection | USB 3.1 Gen2 Line Protection |
|---|---|
|
Use Scenario: Protecting HDMI 2.0 source (GPU, SoC) and sink (monitor, projector) ports against ESD during hot-plug and handling. IC Role / Device Role / Timing Role: 4-channel ESD clamp placed inline on all four TMDS differential pairs (clock + three data lanes), maintaining <0.2 pF loading per path. Use Value: Enables full 5.94 Gbps per-lane operation with open-eye margin >30% (per DS9805 Fig. 5–6), eliminating post-ESD link training failures. |
Use Scenario: Safeguarding USB 3.1 Gen2 host controller and peripheral ports in docking stations and external SSD enclosures. IC Role / Device Role / Timing Role: Bidirectional rail-to-rail protection on SuperSpeed TX/RX differential pairs, with matched I/O capacitance to avoid lane skew. Use Value: Maintains USB-IF compliance at 10 Gbps (Fig. 9–10), clamps transients within 30 ns to <13 V, preventing PHY latch-up or SERDES reset. |
| DisplayPort 1.4 Link Protection | Embedded Display Interface (eDP) |
|
Use Scenario: ESD hardening of DisplayPort 1.4 sources (laptop GPU) and sinks (ultrabook displays) in thin-form-factor systems. IC Role / Device Role / Timing Role: Low-capacitance shunt protection on all four main link lanes and AUX channel, leveraging flow-through routing for minimal trace stubs. Use Value: Supports HBR3 (8.1 Gbps) with <0.5 dB insertion loss at 4 GHz, meeting VESA DP1.4 electrical compliance without re-timing. |
Use Scenario: Protecting eDP interfaces in automotive digital instrument clusters where space and thermal constraints limit discrete TVS use. IC Role / Device Role / Timing Role: Integrated 4-line protection on eDP main link (4 lanes), operating at –40 °C to +105 °C ambient (Tj ≤ +150 °C). Use Value: Reduces BOM count by 75% vs. discrete diodes, achieves 0.5 mm profile compatibility with rigid-flex PCB stacks in tight dashboards. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD4E05U06DQAR (TI) | 0.3 pF I/O–I/O, 6-pin X2SON, 5.5 V VBR, 12 V clamping @ 8 kV | Lower bandwidth (5 GHz), no dedicated GND pins; suited for USB 2.0/3.0 but marginal for HDMI 2.0 eye opening | Select when cost sensitivity outweighs 10 Gbps support; requires layout de-embedding for 5+ Gbps channels |
| SZESD7371MUTAG (ON Semi) | 0.25 pF I/O–I/O, 10-pin UQFN, 5.6 V VBR, 14 V clamping @ 8 kV, 8 GHz bandwidth | Higher dynamic resistance (0.65 Ω), wider Zdiff tolerance (75–125 Ω); may require pre-emphasis tuning in USB 3.1 links | Prefer for legacy HDMI 1.4/USB 3.0 designs where 10 GHz headroom is unnecessary and supply chain diversification is critical |
Compared with TPD4E05U06DQAR and SZESD7371MUTAG, the HSP051-4M10 provides superior 10 GHz bandwidth and tighter 100 Ω impedance control - directly enabling HDMI 2.0 4K60 and USB 3.1 Gen2 10 Gbps compliance without signal conditioning, while its dual-GND pins and exposed pad improve thermal dissipation during repetitive ESD events.
Availability
HSP051-4M10 is available at Aetrix Electronics and suitable for HDMI 2.0 video interfaces, USB 3.1 Gen2 docking solutions, and DisplayPort 1.4 embedded displays requiring stable component supply across automotive, industrial, and consumer electronics programs.
Supply support for HSP051-4M10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for automotive, industrial, and consumer markets.
The HSP051-4M10 belongs to ST's high-speed ESD protection product line, engineered specifically to safeguard multi-gigabit differential interfaces - including HDMI, USB, and DisplayPort - without compromising signal fidelity or PCB real estate.
FAQ
What is the maximum data rate supported by the HSP051-4M10?
The HSP051-4M10 supports up to 10 Gbps per differential lane, validated via eye diagram testing at USB 3.1 Gen2 (10.0 Gbps), HDMI 2.0 (5.94 Gbps), and DisplayPort HBR3 (8.1 Gbps) speeds. Its 10 GHz –3 dB bandwidth and <0.2 pF I/O–I/O capacitance ensure <0.1 UI jitter addition, preserving signal integrity without equalization.
How should the exposed thermal pad (Pin 7) be connected on the PCB?
The exposed pad (Pin 7) must be soldered to a solid, low-impedance PCB ground plane using ≥4 thermal vias (0.3 mm diameter, spaced ≤1 mm apart). This connection establishes the primary ESD current return path and lowers thermal resistance to maintain junction temperature ≤150 °C during repeated 8 kV discharges.
Does the HSP051-4M10 require external biasing or control signals?
No. The HSP051-4M10 is a passive, rail-to-rail ESD protection array with no external power, enable, or configuration pins. It operates inherently across the full –40 °C to +150 °C range and requires only correct PCB layout - including matched trace lengths, controlled impedance routing, and proper grounding of Pins 3, 6, and 7.
Can the HSP051-4M10 be used for single-ended interfaces like PCIe or SATA?
While optimized for differential signaling, the HSP051-4M10 can protect single-ended high-speed lines such as SATA III (6 Gbps) or PCIe Gen2 (5 GT/s) if applied per-lane with careful attention to ground referencing. However, its 100 Ω differential impedance specification means single-ended use requires validation of reflection coefficient (S11 < –10 dB) and clamping behavior under asymmetric transients.
HSP051-4M10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 10-XFDFN
- Series:
- HSP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3.6V
- Voltage - Breakdown (Min):
- 4.5V
- Voltage - Clamping (Max) @ Ipp:
- 10V
- Current - Peak Pulse (10/1000µs):
- 1A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- Yes
- Applications:
- HDMI
- Capacitance @ Frequency:
- 0.4pF @ 200MHz ~ 2.5GHz
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 10-UQFN (2.5x1)
HSP051-4M10 FAQ
1.How can I place an order for HSP051-4M10 through Aetrix?
Please submit a Request for Quotation (RFQ) for HSP051-4M10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HSP051-4M10 reliable?
The price and inventory of HSP051-4M10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HSP051-4M10 is usually 5 days.
3.What payment methods are accepted for HSP051-4M10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HSP051-4M10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HSP051-4M10?
HSP051-4M10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HSP051-4M10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HSP051-4M10?
For technical support, including HSP051-4M10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HSP051-4M10 requirements.
6.How does Aetrix verify that HSP051-4M10 is sourced from the original manufacturer or authorized distributors?
All HSP051-4M10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HSP051-4M10 meets industry standards.
7.What is the process for return or replacement of HSP051-4M10?
All HSP051-4M10 units undergo pre-shipment inspection (PSI). If there is an issue with HSP051-4M10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HSP051-4M10 part is unused and in its original packaging.
Return procedure for HSP051-4M10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
HSP051-4M10 Tags
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DESD3V3E1BL-7B
Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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Nexperia USA Inc.
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Toshiba Semiconductor and Storage
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Diodes Incorporated
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