STMicroelectronics HSP051-4N10

Overview

HSP051-4N10 from STMicroelectronics is a 4-channel ESD protection array with rail-to-rail architecture for high-speed differential interfaces, featuring 0.2 pF I/O-to-I/O capacitance, 10 GHz bandwidth, 0.48 Ω dynamic resistance, 100 Ω differential impedance, and -40 °C to +150 °C operating junction temperature. It is deployed in HDMI 2.0, USB 3.1, and DisplayPort signal paths to maintain signal integrity while clamping ±8 kV contact/±25 kV air ESD transients.

For engineers reviewing the HSP051-4N10 datasheet, HSP051-4N10 pinout, HSP051-4N10 application, or HSP051-4N10 equivalent, key selection criteria include ultralow capacitance variation across frequency, sub-13 V clamping at 16 A (IEC 61000-4-2), flow-through routing for minimal skew, and μQFN-10L package compatibility with 400 µm pitch high-density PCB layouts.

Technical Context

The HSP051-4N10 implements a symmetric rail-to-rail TVS diode architecture per channel, enabling bidirectional ESD clamping without DC bias dependency. Its 10 GHz -3 dB bandwidth and <0.3 pF I/O-to-GND capacitance (up to 9 GHz) ensure minimal insertion loss and return loss degradation on 5–10 Gbps serial links.

Designed for differential signaling, it maintains 85–115 Ω differential impedance and exhibits <13 V clamping voltage at 30 ns under ±8 kV IEC 61000-4-2 contact discharge (16 A peak), with leakage current ≤100 nA at 3.6 V and 25 °C.

Key Specifications

Pinout & Package

The HSP051-4N10 is housed in a μQFN-10L package measuring 1.9 mm × 1.0 mm with 0.4 mm pitch and exposed thermal pad. Pin numbering follows top-view orientation with pin 1 marked by a dot or beveled corner.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed ESD protection applications.

Compared with TPD4E05U06DQAR and SZ1.8T1G, the HSP051-4N10 uniquely delivers 10 GHz bandwidth and 0.2 pF I/O-to-I/O capacitance in a matched 4-channel μQFN layout-enabling direct drop-in protection for HDMI 2.0 and USB 3.1 Gen2 without compromising signal integrity or PCB real estate.

Availability

HSP051-4N10 is available at Aetrix Electronics and suitable for HDMI 2.0 source devices, USB 3.1 host controllers, DisplayPort 1.4 monitors, and industrial DVI video systems requiring stable component supply across extended temperature and high-reliability production cycles.

Supply support for HSP051-4N10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, MEMS, power, and microcontroller solutions for automotive, industrial, and consumer markets.

The HSP series targets high-speed interface protection, with the HSP051-4N10 specifically engineered for sub-100 ps rise-time differential signaling in next-generation video and data connectivity standards.

FAQ

What is the maximum recommended trace length between HSP051-4N10 and the protected connector?

ST recommends placing the device within 3 mm of the HDMI/USB/DP connector pad, with symmetric, impedance-controlled routing. Longer traces increase inductance and degrade clamping response, risking failure to meet IEC 61000-4-2 30 ns clamping voltage spec. Layout guidelines specify ≤2 mm stub length and no vias in the protected path.

Does HSP051-4N10 require external bias or DC blocking capacitors?

No. The rail-to-rail architecture operates passively without bias voltage or external components. It functions bidirectionally across AC-coupled differential lines, including those with embedded DC common-mode voltages up to ±3.6 V, as verified in HDMI and USB 3.1 compliance testing.

How does the μQFN-10L package support thermal performance during ESD events?

The exposed thermal pad (pins 9–10) provides low-thermal-resistance path to PCB ground plane, dissipating transient energy rapidly. Thermal simulation shows junction temperature rise <15 °C during a single ±8 kV IEC 61000-4-2 pulse, enabling reliable operation in thermally constrained layouts.

Can HSP051-4N10 be used for PCIe Gen3 or Gen4 differential lanes?

No. While its 10 GHz bandwidth overlaps PCIe Gen3 (8 GT/s, ~4 GHz fundamental), the device lacks PCIe-specific qualification (e.g., SSC tolerance, jitter transfer specs) and has not been validated against PCI-SIG compliance test plans. It is explicitly characterized for HDMI, USB, and DP protocols only.