STMicroelectronics HSP061-4F4

Overview

HSP061-4F4 from STMicroelectronics is a 4-channel ESD protection array with rail-to-rail architecture for high-speed differential interfaces, featuring 0.5 pF typical capacitance, 13 GHz cutoff frequency, ±8 kV contact/±15 kV air IEC 61000-4-2 ESD rating, and operation from –40 °C to +125 °C - deployed in HDMI 1.3/1.4, DisplayPort, and USB 3.0 signal lines.

For engineers reviewing the HSP061-4F4 datasheet, HSP061-4F4 pinout, HSP061-4F4 application, or HSP061-4F4 equivalent, key selection criteria include ultra-low capacitance variation (≤0.05 pF), differential impedance matching (85–115 Ω), clamping voltage (18 V at +8 kV), leakage current (70 nA @ 3 V), and Flip-Chip 300 µm pitch package integration for high-density PCB layouts.

Technical Context

The HSP061-4F4 implements a symmetric rail-to-rail diode architecture across four independent channels, enabling bidirectional ESD clamping without DC path distortion. Its ultra-low capacitance (0.5 pF) and minimal variation (≤0.05 pF) over 200 MHz–3 GHz ensure negligible signal skew and insertion loss on high-speed differential pairs.

Designed for sub-micron IC interfaces, it maintains stable differential impedance (Z_Diff = 85–115 Ω @ 100 Ω nominal) and supports >3.35 Gbps data rates per channel, as validated by HDMI-compliant eye diagram testing. The device operates with no DC bias requirement and delivers consistent clamping performance under repetitive 30 A (8/20 µs) pulses.

Key Specifications

Pinout & Package

Package: Flip-Chip with 6 bumps (4 I/O + 2 GND), 300 µm pitch, 0.72 mm² footprint, and 0.380 mm typical thickness. Bump diameter: 140 µm ±15 µm; pad layout optimized for minimal parasitic inductance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Compared with TPD4E05U06DQAR and SRV05-4, the HSP061-4F4 uniquely combines 13 GHz bandwidth, 0.5 pF capacitance, and Flip-Chip form factor - making it the only option qualified for HDMI 2.0 and DisplayPort 1.2a full-lane protection without signal degradation.

Availability

HSP061-4F4 is available at Aetrix Electronics and suitable for HDMI 1.4 transmitters, DisplayPort 1.2a source devices, and USB 3.0 host controller designs requiring stable component supply, high-volume tape-and-reel delivery, and long-term lifecycle assurance.

Supply support for HSP061-4F4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, digital, and mixed-signal ICs for automotive, industrial, and consumer markets.

The HSP061-4F4 belongs to ST's high-speed ESD protection product line, engineered specifically for preserving signal fidelity on multi-gigabit differential interfaces while meeting stringent IEC 61000-4-2 immunity requirements.

FAQ

What is the maximum data rate supported by the HSP061-4F4?

The HSP061-4F4 supports data rates up to 5.4 Gbps per differential pair, validated via HDMI 3.35 Gbps and DisplayPort 5.4 Gbps eye diagram testing. Its 13 GHz –3 dB bandwidth and <0.05 pF capacitance variation ensure compliance with USB 3.0, SATA III, and DisplayPort 1.2a physical layer specifications.

Does the HSP061-4F4 require external bias or DC blocking components?

No. The HSP061-4F4 uses a passive rail-to-rail diode architecture with no internal bias circuitry. It operates transparently on AC-coupled or DC-coupled high-speed lines and introduces no DC path, load, or offset - eliminating need for series capacitors or pull-up resistors.

How does the Flip-Chip package affect PCB layout and thermal performance?

The Flip-Chip construction places solder bumps directly under active silicon, reducing parasitic inductance (<0.3 nH) and enabling shorter trace lengths. Its 0.380 mm profile and dual-GND bumps improve heat spreading into the PCB ground plane, supporting continuous operation at +125 °C junction temperature without derating.

Can the HSP061-4F4 be used in automotive infotainment systems?

The HSP061-4F4 is not qualified for automotive applications per ST's documentation. It lacks AEC-Q200 stress testing and is explicitly excluded from safety-critical, automotive, or aerospace use per its datasheet disclaimer. For automotive-grade ESD protection, ST recommends the ESDALC6-1BM2.