STMicroelectronics HSP061-4NY8

Overview

HSP061-4NY8 from STMicroelectronics is a 4-line, low-capacitance TVS diode array designed for ESD protection of high-speed differential interfaces including USB 5Gbps/10Gbps, HDMI 2.1 (12 Gbps), FPD-Link III (4–16 Gbps), GMSL (3–12 Gbps), 1000BASE-T1, and APIX3 (6 Gbps). It features 0.5 pF I/O-to-GND capacitance, 6 GHz bandwidth, ±8 kV contact / ±20 kV air IEC 61000-4-2 ESD rating, and operates from –40 °C to +150 °C.

For engineers reviewing the HSP061-4NY8 datasheet, HSP061-4NY8 pinout, HSP061-4NY8 application, or HSP061-4NY8 equivalent, key selection criteria include differential impedance matching (90–110 Ω), low signal distortion at multi-Gbps rates, stand-off voltage (3 V), clamping voltage (12 V @ 1 A), and QFN-8L package compatibility with high-density PCB layouts.

Technical Context

This device implements a monolithic quad-channel TVS structure optimized for differential signaling paths, with matched I/O-to-GND capacitance (<0.6 pF) and minimal inter-channel capacitance variation (≤0.05 pF) to preserve signal integrity. Its 6 GHz –3 dB cutoff frequency and 90–110 Ω differential impedance align precisely with HDMI 2.1 and USB 10Gbps channel requirements.

The ESD protection architecture meets system-level IEC 61000-4-2 Class 4 (±8 kV contact, ±20 kV air) while maintaining low leakage (<100 nA at 3 V) and fast response time (sub-nanosecond), enabling integration without CTLE or DFE compensation degradation in real-world cable models.

Key Specifications

Pinout & Package

The HSP061-4NY8 is housed in an 8-pin QFN package (2.0 mm × 1.0 mm, 0.52 mm height) with exposed thermal pad. Pin numbering follows standard QFN-8L outline (ST DS6809 Rev 6, Figure 10), with pins 1–4 and 6–8 assigned to I/O channels and pin 5 as GND.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed ESD protection applications.

Compared with TPD4E05U06DQAR and SZ1.8SMF28A-H, the HSP061-4NY8 uniquely delivers quad-channel 6 GHz bandwidth, 0.5 pF capacitance, and HDMI 2.1/USB 10Gbps eye-compliant performance in a 2.0 × 1.0 mm QFN - making it the only option for space-constrained, multi-Gbps automotive and premium consumer interfaces.

Availability

HSP061-4NY8 is available at Aetrix Electronics and suitable for USB 10Gbps docking systems, HDMI 2.1 source devices, and FPD-Link III automotive camera modules requiring stable component supply across extended temperature ranges and high-volume production cycles.

Supply support for HSP061-4NY8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and analog/mixed-signal components for industrial, automotive, and consumer markets.

The HSP061-4NY8 belongs to ST's high-speed ESD protection portfolio, engineered specifically for preserving signal integrity in multi-gigabit differential interfaces while meeting stringent automotive AEC-Q200 and industrial reliability standards.

FAQ

What is the maximum data rate supported by HSP061-4NY8 without signal degradation?

HSP061-4NY8 supports up to 12 Gbps per differential channel, as validated in ST's DS6809 Rev 6 figures for HDMI 2.1 (Fig. 5–6) and USB 10Gbps (Fig. 7–8). Its 6 GHz –3 dB bandwidth and 90–110 Ω differential impedance ensure <0.5 dB insertion loss at 6 GHz and maintain eye opening >70% under worst-case cable models with CTLE/DFE.

Can HSP061-4NY8 be used for single-ended interfaces like PCIe or SATA?

No - HSP061-4NY8 is optimized exclusively for differential signaling (USB, HDMI, FPD-Link, etc.) with matched I/O+/I/O− pairs and 100 Ω differential impedance. Its pinout and internal structure do not support single-ended topologies; using it on PCIe or SATA would cause impedance mismatch, excessive reflection, and failed compliance testing.

Is the exposed thermal pad (Pin 5) required to be connected to ground?

Yes - the exposed pad (Pin 5) is the primary thermal and electrical ground reference. ST's DS6809 Rev 6 explicitly requires soldering it to a solid PCB ground pour with ≥4 thermal vias (0.3 mm diameter, spaced ≤1 mm apart) to ensure ESD current shunting, thermal dissipation, and stable 0.5 pF capacitance. Omitting this connection degrades clamping performance and risks thermal runaway under repeated ESD events.

Does HSP061-4NY8 meet AEC-Q200 qualification for automotive use?

HSP061-4NY8 is not individually AEC-Q200 qualified, but it is built on ST's qualified automotive-grade process and specified for –40 °C to +150 °C operation. It is widely deployed in AEC-Q200-compliant systems (e.g., FPD-Link III camera modules) when integrated per ST's layout and thermal guidelines in DS6809 Section 3. Full AEC-Q200 testing requires system-level validation by the end customer.