NXP Semiconductors HTCICC6402FUG/AM,0
- Part No.:
- HTCICC6402FUG/AM,0
- Manufacturer:
- NXP Semiconductors
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- Die
- Datasheet:
-
HTCICC6402FUG/AM,0.pdf
- Description:
- IC RFID TRANSP 100-150KHZ DIE
- Quantity:
- Payment:

- Shipping:

Inventory:1,149
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
HTCICC6402FUG/AM from NXP Semiconductors is a preprogrammed, read-only contactless transponder IC operating in Transponder Talks First (TTF) mode at 100–150 kHz. It integrates a 210 pF ±3% resonance capacitor, delivers a fixed 64-bit TTF response, supports passive inductive coupling with no external power, and guarantees 10-year data retention for RFID tag applications in access control and asset identification.
For engineers reviewing the HTCICC6402FUG/AM datasheet, HTCICC6402FUG/AM pinout, HTCICC6402FUG/AM application, or HTCICC6402FUG/AM equivalent, this page provides verified package dimensions, confirmed wafer-level mega-bump terminal mapping, functional timing (tTTF = 250–400 × 8 µs), memory layout, and real-world deployment context for LF RFID system integration.
Technical Context
The HTCICC6402FUG/AM implements a fully passive analog RF interface that harvests energy and generates clock via inductive coupling to a reader device. Its digital core includes EEPROM-based non-volatile memory, TTF sequencer, and modulation/demodulation logic - all powered solely by the magnetic field.
No external components are required: the integrated 210 pF ±3% resonance capacitor enables direct connection to an antenna coil. The IC operates exclusively in continuous TTF mode, transmitting its preprogrammed 64-bit ID without command or collision arbitration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Operating Frequency | 100–150 kHz - defines compatible reader field frequency range and coil design constraints |
| Resonance Capacitance | 210 pF ±3% - integrated on-die capacitor enabling self-resonant antenna tuning without external parts |
| TTF Response Length | 64-bit preprogrammed ID - fixed, factory-written memory content continuously transmitted upon field activation |
| Data Retention | 10 years - guaranteed EEPROM data integrity under specified storage conditions |
| Power Source | Inductively coupled only - zero external supply or battery required; full operation powered by reader field |
| tTTF Delay | 250–400 × 8 µs (2–3.2 ms) - deterministic startup latency before first TTF transmission begins |
Pinout & Package
HTCICC6402FUG/AM is supplied as a sawn, megabumped wafer die (150 µm thickness, 8-inch wafer, UV-treated), with chip size 550 µm × 550 µm. Only LA and LB terminals are electrically active; all other pads are disconnected after dicing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| LA | Antenna terminal A | Primary RF input/output node for inductive coupling; connects directly to one end of external antenna coil |
| LB | Antenna terminal B | Secondary RF input/output node; completes resonant LC tank with LA and integrated 210 pF capacitor |
Key Features
| Feature | Design Value |
|---|---|
| Mega-bump assembly interface | Enables direct flip-chip bonding onto antenna substrates without wire bonding or solder bumps |
| Preprogrammed TTF memory | Eliminates post-manufacturing programming steps, reducing tag production cost and cycle time |
| Integrated resonance capacitor | 210 pF ±3% tolerance ensures consistent coil resonance across production lots without trimming |
| Passive operation | No external power, clock, or control signals needed - simplifies tag construction and improves reliability |
| Continuous TTF protocol | Guarantees immediate ID broadcast on field presence - ideal for proximity detection and low-latency access systems |
Applications
| Access Control Tags | Asset Tracking Labels |
|---|---|
|
Use Scenario: Contactless door entry cards used in office buildings and secure facilities. IC Role / Device Role / Timing Role: Passive transponder providing immutable UID on field activation; operates in TTF mode for instant response. Use Value: Eliminates battery dependency and programming infrastructure while ensuring reliable, low-cost credential delivery. |
Use Scenario: Reusable inventory tags attached to tools, equipment, or medical devices. IC Role / Device Role / Timing Role: Factory-programmed identifier enabling rapid scanning during check-in/check-out cycles. Use Value: 10-year data retention and robust wafer-level packaging ensure long-term readability in industrial handling environments. |
| Industrial Equipment ID | Library Book Tags |
|
Use Scenario: Permanent identification markers embedded in machinery housings or calibration tools. IC Role / Device Role / Timing Role: Read-only transponder delivering fixed 64-bit ID via magnetic field modulation at 125 kHz. Use Value: Integrated 210 pF capacitor allows compact, single-layer antenna design - critical for space-constrained metal-adjacent mounting. |
Use Scenario: Circulation tags laminated inside book covers for automated checkout kiosks. IC Role / Device Role / Timing Role: Low-frequency (100–150 kHz) transponder optimized for near-field reading through paper and plastic. Use Value: Mega-bump terminals enable high-yield, low-profile attachment to flexible substrates without wire bond damage risk. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar read-only LF transponder applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HTCICC6403FUG/AM | 280 pF ±5% integrated resonance capacitor vs. 210 pF ±3% in HTCICC6402FUG/AM | Requires antenna redesign for lower resonant frequency (~106 kHz nominal); suited for longer-range or noise-immune deployments | Select HTCICC6403FUG/AM when coil inductance exceeds 1.5 mH or ambient EMI necessitates lower operating frequency |
| HTCICC6402FUG/AM-TR | Same die, tape-and-reel packaging instead of UV-treated wafer; identical electrical specs | Designed for automated pick-and-place assembly rather than wafer-level bonding | Choose HTCICC6402FUG/AM-TR for SMT-based tag manufacturing where flip-chip is not feasible |
Compared with HTCICC6402FUG/AM, HTCICC6403FUG/AM shifts resonant frequency downward and requires antenna recalibration, while HTCICC6402FUG/AM-TR offers identical functionality in a surface-mountable format - neither is pin-compatible due to differing mechanical form factors and interconnection methods.
Availability
HTCICC6402FUG/AM is available at Aetrix Electronics and suitable for access control systems, industrial asset tracking, and library RFID tagging requiring stable component supply, wafer-level integration capability, and long-term data integrity.
Supply support for HTCICC6402FUG/AM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The HITAG µ RO64 product line - including HTCICC6402FUG/AM - was designed specifically for cost-sensitive, battery-free LF RFID transponder applications demanding high-volume manufacturability and field-proven reliability in access and identification systems.
FAQ
What is the function of the LA and LB terminals on the HTCICC6402FUG/AM?
The LA and LB terminals on the HTCICC6402FUG/AM serve as the two connection points for the external antenna coil. They form the resonant LC tank together with the integrated 210 pF capacitor. All other bond pads are electrically disconnected after dicing, making LA and LB the sole functional interfaces for RF energy harvesting and TTF data transmission in the HTCICC6402FUG/AM.
Does the HTCICC6402FUG/AM require external programming during system integration?
No, the HTCICC6402FUG/AM does not require external programming. It is delivered with a factory-preprogrammed 64-bit TTF response stored in non-volatile memory. This fixed ID is transmitted continuously upon field activation, eliminating the need for programming infrastructure, firmware, or host interaction during tag manufacturing or deployment - a key feature of the HTCICC6402FUG/AM.
Can the HTCICC6402FUG/AM operate with standard 125 kHz readers?
Yes, the HTCICC6402FUG/AM operates within 100–150 kHz, fully covering the 125 kHz ISM band used by most LF RFID readers. Its tTTF delay (250–400 × 8 µs) and ASK-modulated TTF response are compliant with ISO/IEC 18000-2 and legacy HITAG protocols, ensuring interoperability with commercial 125 kHz access control and reader systems using the HTCICC6402FUG/AM.
What is the significance of the "FUG/AM" suffix in HTCICC6402FUG/AM?
The "FUG/AM" suffix in HTCICC6402FUG/AM denotes NXP's internal wafer fabrication and assembly variant code: "FUG" indicates the specific process flow and mask set for the HITAG µ RO64 die, while "/AM" signifies the sawn, megabumped wafer format with 150 µm thickness and UV treatment - confirming the exact mechanical and interconnect specification of the HTCICC6402FUG/AM delivered part.
How does the integrated 210 pF capacitor affect antenna design for the HTCICC6402FUG/AM?
The integrated 210 pF ±3% capacitor in the HTCICC6402FUG/AM sets the resonant frequency together with the external antenna coil inductance (f₀ ≈ 1/(2π√(LC))). Designers select coil inductance - typically 1.0–1.4 mH - to achieve target resonance near 125 kHz. This eliminates discrete capacitor placement, reduces BOM count, and improves consistency, directly shaping the physical layout and performance envelope of any system using the HTCICC6402FUG/AM.
HTCICC6402FUG/AM,0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- HITAG™
- Package/Case:
- Die
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Type:
- RFID Transponder
- Frequency:
- 100kHz ~ 150kHz
- Standards:
- -
- Interface:
- -
- Voltage - Supply:
- 5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Die
HTCICC6402FUG/AM,0 FAQ
1.How can I place an order for HTCICC6402FUG/AM,0 through Aetrix?
Please submit a Request for Quotation (RFQ) for HTCICC6402FUG/AM,0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HTCICC6402FUG/AM,0 reliable?
The price and inventory of HTCICC6402FUG/AM,0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HTCICC6402FUG/AM,0 is usually 5 days.
3.What payment methods are accepted for HTCICC6402FUG/AM,0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HTCICC6402FUG/AM,0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HTCICC6402FUG/AM,0?
HTCICC6402FUG/AM,0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HTCICC6402FUG/AM,0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HTCICC6402FUG/AM,0?
For technical support, including HTCICC6402FUG/AM,0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HTCICC6402FUG/AM,0 requirements.
6.How does Aetrix verify that HTCICC6402FUG/AM,0 is sourced from the original manufacturer or authorized distributors?
All HTCICC6402FUG/AM,0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HTCICC6402FUG/AM,0 meets industry standards.
7.What is the process for return or replacement of HTCICC6402FUG/AM,0?
All HTCICC6402FUG/AM,0 units undergo pre-shipment inspection (PSI). If there is an issue with HTCICC6402FUG/AM,0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HTCICC6402FUG/AM,0 part is unused and in its original packaging.
Return procedure for HTCICC6402FUG/AM,0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
HTCICC6402FUG/AM,0 Tags

-
SL2S2602FTBX
NXP Semiconductors

-
ST25DV04K-IER6S3
STMicroelectronics

-
ST25DV04K-IER6C3
STMicroelectronics

-
LXMSJZNCMD-217
Murata Electronics

-
NT3H2111W0FTTJ
NXP Semiconductors

-
NT3H2111W0FHKH
NXP Semiconductors

-
M24LR04E-RMC6T/2
STMicroelectronics

-
ST25DV04KC-JF6D3
STMicroelectronics

-
ST25DV64KC-IE6S3
STMicroelectronics
-
ST25DV64K-IER6T3
STMicroelectronics

-
NT3H2211W0FTTJ
NXP Semiconductors

-
NT3H2211W0FHKH
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
