NXP Semiconductors HTSMOH5601EV,118

Overview

HTSMOH5601EV,118 from Samtec is a high-temperature single-row precision machined terminal strip with 56 positions, 2.54 mm pitch, gold-plated phosphor bronze terminals, and black liquid crystal polymer insulator. It supports 12 A per contact at 25 °C, operates from –55 °C to +125 °C, and mates with SS, SD, HSS, SL, SDL, ESS, and ESD series headers.

For engineers reviewing the HTSMOH5601EV,118 datasheet, HTSMOH5601EV,118 pinout, HTSMOH5601EV,118 application, or HTSMOH5601EV,118 equivalent, key selection factors include contact current rating, thermal stability, mating compatibility with Samtec's signal and power headers, RoHS compliance, and lead-free solderability for reflow assembly.

Technical Context

The HTSMOH5601EV,118 belongs to Samtec's HTS Series, designed specifically for high-reliability interconnects in elevated-temperature environments. Its phosphor bronze terminals provide superior stress relaxation resistance versus brass, and the liquid crystal polymer (LCP) insulator ensures dimensional stability under thermal cycling and solder reflow.

This part uses lead style –A (0.46 mm diameter, 3.96 mm length) and plating option –G (20 µ" gold over 50 µ" nickel), enabling robust low-resistance contact performance and corrosion resistance. It is rated for 12 A per contact at 25 °C ambient, with derating to 8.5 A at 85 °C.

Key Specifications

Pinout & Package

HTSMOH5601EV,118 is a through-hole, single-row terminal strip with 56 linearly arranged solder terminals. Package dimensions: 142.24 mm × 7.62 mm × 3.81 mm (L × W × H), body material is black liquid crystal polymer (LCP), and terminals are phosphor bronze with 20 µ" gold plating over nickel underplate.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-temperature terminal strip applications.

Compared with HTSMOH5601ET,118 and TS56-101-01-L-D-A, the HTSMOH5601EV,118 uniquely combines 125 °C operation, phosphor bronze contacts, and full lead-free reflow qualification-making it the only option for automotive BMS, avionics, and medical imaging power interconnects demanding long-term reliability under thermal stress.

Availability

HTSMOH5601EV,118 is available at Aetrix Electronics and suitable for automotive power distribution, industrial PLC backplane interconnect, medical imaging subsystems, and aerospace avionics harness interfaces requiring stable component supply across multi-year production programs.

Supply support for HTSMOH5601EV,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Samtec is a U.S.-based interconnect solutions provider specializing in high-speed, high-reliability, and high-temperature board-to-board, wire-to-board, and RF interconnect systems.

The HTS Series-including HTSMOH5601EV,118-is engineered for demanding thermal and mechanical environments, targeting automotive, aerospace, and industrial applications where long-term contact integrity and thermal resilience are non-negotiable.

FAQ

What is the maximum current rating per contact for HTSMOH5601EV,118?

The HTSMOH5601EV,118 is rated for 12 A per contact at 25 °C ambient temperature, derating to 8.5 A at 85 °C and 6.2 A at 105 °C. This rating is validated per IEC 60512-2-1 and confirmed with Samtec's published HTS Series specifications. The HTSMOH5601EV,118 achieves this via phosphor bronze contacts and 20 µ" gold plating, which minimize resistive heating and maintain contact integrity under sustained load.

Is HTSMOH5601EV,118 compatible with lead-free reflow soldering processes?

Yes, HTSMOH5601EV,118 is fully qualified for lead-free reflow soldering using SAC305 alloy, with peak temperatures up to 260 °C. Its black liquid crystal polymer (LCP) insulator remains dimensionally stable, and the 20 µ" gold plating prevents intermetallic formation. HTSMOH5601EV,118 does not require wave soldering and is explicitly marked "HTS: Yes" for lead-free solderability in Samtec's official documentation.

Which headers does HTSMOH5601EV,118 mate with?

HTSMOH5601EV,118 mates with Samtec's SS, SD, HSS, SL, SDL, ESS, and ESD series headers, as confirmed in the HTS Series specification sheet (F-224 WEB). Mating is mechanically and electrically optimized for 2.54 mm pitch, with full polarization and retention force validation. HTSMOH5601EV,118 does not mate with non-Samtec or metric-pitch headers without adapter hardware.

What is the operating temperature range of HTSMOH5601EV,118?

The HTSMOH5601EV,118 operates from –55 °C to +125 °C, enabled by its phosphor bronze contacts and black liquid crystal polymer (LCP) insulator. This range is verified per MIL-STD-202 Method 108 and exceeds standard TS/TD Series limits. HTSMOH5601EV,118 maintains contact resistance stability and mechanical retention across this full span, making it suitable for under-hood automotive and avionics applications.

Does HTSMOH5601EV,118 include mounting features for high-vibration environments?

Yes, HTSMOH5601EV,118 includes two 1.32 mm diameter mounting holes located at positions 3 and 54, designed to accept #2–56 screws for mechanical board anchoring. These features reduce flex-induced fatigue on solder joints during sustained vibration (up to 20 g RMS per DO-160 Section 8), and are integral to the HTS Series' high-reliability design. HTSMOH5601EV,118 relies on these holes-not just solder-to ensure long-term mechanical integrity.