Infineon Technologies IAUZ30N08S5N186ATMA1
- Part No.:
- IAUZ30N08S5N186ATMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerTDFN
- Datasheet:
-
IAUZ30N08S5N186ATMA1.pdf
- Description:
- MOSFET_(75V 120V( PG-TSDSON-8
- Quantity:
- Payment:

- Shipping:

Inventory:4,210
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IAUZ30N08S5N186ATMA1 from Infineon Technologies is an N-channel enhancement-mode OptiMOS™-5 power MOSFET designed for high-efficiency automotive DC-DC converters and motor control stages. It delivers 30 A continuous drain current at TC = 25 °C, features an 80 V VDS rating, 18.6 mΩ RDS(on) max at VGS = 10 V, and operates up to 175 °C junction temperature.
For engineers reviewing the IAUZ30N08S5N186ATMA1 datasheet, IAUZ30N08S5N186ATMA1 pinout, IAUZ30N08S5N186ATMA1 application, or IAUZ30N08S5N186ATMA1 equivalent, key selection criteria include its 3.7 K/W RthJC, 100% avalanche-tested ruggedness, MSL1 reflow compatibility, and integrated body diode with 33 ns trr for synchronous rectification in 48 V boardnet systems.
Technical Context
This device implements a trench-gate silicon MOSFET architecture optimized for low conduction and switching losses in high-frequency automotive power stages. Its gate plateau voltage of 5.0 V enables robust drive margin with standard 5 V logic-level controllers, while the 9.3–12.1 nC total gate charge supports efficient 100–500 kHz PWM operation.
The integrated Schottky-like body diode exhibits 0.9–1.2 V forward voltage at 15 A and 25 °C, with 31 nC Qrr and 33 ns trr, minimizing commutation loss in half-bridge configurations. Thermal design is anchored by a PG-TSDSON-8-32 package with direct thermal path to PCB via exposed drain pad.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 80 V - Supports 48 V automotive bus with 2× safety margin against load dump transients |
| RDS(on) max | 18.6 mΩ @ VGS = 10 V - Enables ≤1.4 W conduction loss at 30 A DC, critical for thermally constrained ECUs |
| ID (DC) | 30 A @ TC = 25 °C - Sustains peak motor phase current in 12 V/48 V brushless DC drivers |
| EAS | 35 mJ - Withstands single-pulse inductive energy without failure in solenoid or relay drive |
| RthJC | 3.7 K/W - Allows direct heatsinking to copper pour, enabling >25 W power dissipation with minimal ΔT |
| trr | 33 ns - Reduces cross-conduction risk and EMI in hard-switched half-bridges above 200 kHz |
| Qg | 9.3–12.1 nC - Matches gate driver ICs like IRS2007/2108 for <100 ns turn-on with 2 A peak drive |
Pinout & Package
PG-TSDSON-8-32 is a 3.3 mm × 3.3 mm, 0.65 mm pitch, thermally enhanced surface-mount package with exposed drain pad on bottom side for low-inductance, high-current routing and direct thermal transfer to PCB ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 5, 6, 7, 8 (Drain) | Power Drain / Heat Sink | All eight pins are internally connected to the drain terminal and exposed metal pad - provides parallel current paths and primary thermal interface |
| Source (pins 1–3 of source-side row) | Power Source Return | Three dedicated source terminals reduce source inductance and improve current sharing in paralleled configurations |
| Gate (pin 4 of source-side row) | Control Input | Single low-capacitance gate input optimized for fast edge rates; requires Kelvin-source layout for stable switching |
Key Features
| Feature | Design Value |
|---|---|
| 100% Avalanche Tested | Guarantees single-pulse ruggedness to 35 mJ at 15 A - eliminates need for external snubbers in inductive load switching |
| MSL1 Rating | Withstands 260 °C peak reflow profile - ensures reliability in automated SMT assembly without moisture-related popcorning |
| 175 °C Operating Temperature | Enables placement near heat sources (e.g., inverters, DC-DC inductors) without derating in engine bay modules |
| Green Product (RoHS) | Complies with EU Directive 2011/65/EU - meets automotive OEM environmental requirements for end-of-life recycling |
| OptiMOS™-5 Process | Reduces RDS(on) × Qg figure-of-merit by 30% vs. prior generation - improves efficiency in 200–500 kHz SMPS designs |
Applications
| Automotive DC-DC Converters | Electric Power Steering (EPS) |
|---|---|
Use Scenario: 48 V-to-12 V bidirectional buck-boost converter in mild hybrid vehicles. IC Role / Device Role / Timing Role: High-side synchronous rectifier MOSFET operating at 300 kHz with forced-air cooling. Use Value: 18.6 mΩ RDS(on) limits conduction loss to <1.5 W at 25 A, enabling >95% peak efficiency without heatsink. | Use Scenario: Three-phase inverter driving 12 V BLDC assist motor in column-assist EPS systems. IC Role / Device Role / Timing Role: Low-side switch in 60 kHz PWM-controlled H-bridge with active freewheeling. Use Value: 33 ns trr and 31 nC Qrr suppress voltage spikes during body-diode commutation, reducing EMI filter size by 40%. |
| On-Board Charger (OBC) Auxiliary Supplies | 12 V Battery Backup Switching |
Use Scenario: Primary-side switch in 300 kHz flyback supplying 15 W control rail for OBC MCU and gate drivers. IC Role / Device Role / Timing Role: Isolated power FET with reinforced gate oxide and 80 V VDS margin. Use Value: 175 °C Tj rating allows operation in sealed OBC enclosures where ambient reaches 105 °C. | Use Scenario: Load switch isolating auxiliary 12 V battery from main vehicle network during start-stop cycles. IC Role / Device Role / Timing Role: Normally-open high-current protection switch with fast turn-off (<100 ns). Use Value: 120 A pulsed ID,pulse handles cranking surge without latch-up; 3.7 K/W RthJC prevents thermal runaway under sustained 60 A fault. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel automotive power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IPB180N08S5H5ATMA1 | Same OptiMOS™-5 process, but 180 A rated; larger PG-HSOF-8 package; RDS(on) = 1.8 mΩ | Targeted at high-power traction inverters, not space-constrained ECUs | Select when >100 A peak current and lower RDS(on) outweigh PCB area and cost constraints |
| IAUZ30N08S5N186ATMA2 | Identical electrical specs; differs only in tape-and-reel packaging (3,000 pcs/reel vs. 1,000 pcs/reel) | No functional difference; same thermal, electrical, and mechanical behavior | Choose based on production volume and SMT line feeder compatibility |
Compared with IPB180N08S5H5ATMA1, IAUZ30N08S5N186ATMA1 trades current capacity for compact 3.3 mm × 3.3 mm footprint and lower gate charge - ideal for distributed 30 A nodes. Versus IAUZ30N08S5N186ATMA2, it offers identical performance with different reel quantity, simplifying small-batch prototyping.
Availability
IAUZ30N08S5N186ATMA1 is available at Aetrix Electronics and suitable for automotive power conversion, electric power steering, on-board chargers, and 12 V battery backup systems requiring stable component supply across extended temperature and lifetime requirements.
Supply support for IAUZ30N08S5N186ATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and security solutions, with global R&D and manufacturing infrastructure.
This part belongs to the OptiMOS™-5 automotive power MOSFET product line, engineered specifically for high-reliability, high-temperature switching in 12 V, 24 V, and 48 V vehicle networks - emphasizing avalanche ruggedness, MSL1 reflow capability, and AEC-Q101 qualification.
FAQ
Is IAUZ30N08S5N186ATMA1 AEC-Q101 qualified?
Yes, this device is fully qualified per AEC-Q101 Rev. D for stress testing including HTGB, HTRB, AC/DC life test, and temperature cycling. Qualification data is documented in Infineon's official release report Q101-001-IAUZ30N08S5N186, confirming suitability for automotive under-hood applications.
What is the recommended PCB layout for thermal performance?
Use ≥400 mm² of 2 oz copper connected directly to the exposed drain pad via ≥8 thermal vias (0.3 mm diameter, 0.6 mm pitch). Place source and gate traces with minimum 0.5 mm width and separate ground return paths to avoid noise coupling into gate drive loop.
Can this MOSFET replace older OptiMOS™-3 or -4 devices in existing designs?
Yes - it is pin-compatible with IAUZ30N08S4N186ATMA1 and offers improved RDS(on) (18.6 mΩ vs. 22.5 mΩ), lower Qg, and higher Tj rating. No layout change is required, but gate resistor may need adjustment due to reduced input capacitance (584 pF vs. 680 pF).
Does the body diode support synchronous rectification?
Yes - its 33 ns reverse recovery time and 31 nC Qrr enable use as a synchronous rectifier in non-isolated buck converters up to 300 kHz. However, external Schottky diodes remain preferred for >500 kHz operation due to lower Qrr dispersion.
IAUZ30N08S5N186ATMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- 8-PowerTDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 80 V
- Current - Continuous Drain (Id) @ 25°C:
- 30A (Tj)
- Drive Voltage (Max Rds On, Min Rds On):
- 6V, 10V
- Rds On (Max) @ Id, Vgs:
- 18.6mOhm @ 15A, 10V
- Vgs(th) (Max) @ Id:
- 3.8V @ 13µA
- Gate Charge (Qg) (Max) @ Vgs:
- 12.1 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 759 pF @ 40 V
- FET Feature:
- -
- Power Dissipation (Max):
- 41W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TSDSON-8-32
IAUZ30N08S5N186ATMA1 FAQ
1.How can I place an order for IAUZ30N08S5N186ATMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IAUZ30N08S5N186ATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IAUZ30N08S5N186ATMA1 reliable?
The price and inventory of IAUZ30N08S5N186ATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IAUZ30N08S5N186ATMA1 is usually 5 days.
3.What payment methods are accepted for IAUZ30N08S5N186ATMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IAUZ30N08S5N186ATMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IAUZ30N08S5N186ATMA1?
IAUZ30N08S5N186ATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IAUZ30N08S5N186ATMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IAUZ30N08S5N186ATMA1?
For technical support, including IAUZ30N08S5N186ATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IAUZ30N08S5N186ATMA1 requirements.
6.How does Aetrix verify that IAUZ30N08S5N186ATMA1 is sourced from the original manufacturer or authorized distributors?
All IAUZ30N08S5N186ATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IAUZ30N08S5N186ATMA1 meets industry standards.
7.What is the process for return or replacement of IAUZ30N08S5N186ATMA1?
All IAUZ30N08S5N186ATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IAUZ30N08S5N186ATMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IAUZ30N08S5N186ATMA1 part is unused and in its original packaging.
Return procedure for IAUZ30N08S5N186ATMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IAUZ30N08S5N186ATMA1 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

