Infineon Technologies IMLT65R040M2HXTMA1
- Part No.:
- IMLT65R040M2HXTMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- -
- Datasheet:
-
IMLT65R040M2HXTMA1.pdf
- Description:
- SILICON CARBIDE MOSFET
- Quantity:
- Payment:

- Shipping:

Inventory:327
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IMLT65R040M2HXTMA1 from Infineon is a 650 V, 40 mΩ SiC MOSFET in PG-HDSOP-16 package with integrated body diode, designed for high-frequency hard-switching power stages in industrial and EV infrastructure. It delivers 143 A peak drain current, 4.5 V gate threshold voltage, and ultra-low 7.2 μJ turn-off switching loss at 400 V, enabling >99% efficiency in 3-phase inverters and DC fast-charging modules.
For engineers reviewing the IMLT65R040M2HXTMA1 datasheet, IMLT65R040M2HXTMA1 pinout, IMLT65R040M2HXTMA1 application, or IMLT65R040M2HXTMA1 equivalent, key selection criteria include its 0.56 °C/W junction-to-case thermal resistance, non-interchangeable source pins (driver vs. power), and robust 200 V/ns dv/dt immunity-critical for high-density SMPS and solar PV string inverters.
Technical Context
This CoolSiC™ G2 device uses trench-based 2nd-generation silicon carbide technology to achieve benchmark RDS(on) of 40 mΩ at VGS = 18 V and Tj = 25 °C, with stable 49 mΩ max at 175 °C. Its 53 nC Qoss and 28 nC total gate charge enable fast, low-loss switching up to 200 kHz.
The PG-HDSOP-16 package integrates separate driver and power source terminals (Pin 7 vs. Pins 1–6) to suppress common-source inductance and prevent parasitic turn-on. The internal body diode supports unidirectional hard commutation with 12.2 ns forward recovery time and 56 nC recovery charge at 1000 A/μs di/dt.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 650 V - Supports 400 V DC bus systems with 1.6× safety margin for transient overvoltage in EV chargers and UPS. |
| RDS(on), typ | 40 mΩ @ VGS = 18 V, Tj = 25 °C - Enables <1.2 W conduction loss at 18 A RMS in 11 kW on-board chargers. |
| Qg | 28 nC - Reduces gate drive power requirement to <1.5 W at 100 kHz, compatible with standard 1.8 Ω gate resistors. |
| Eoff | 7.2 μJ @ VDD = 400 V - Cuts turn-off energy by 45% vs. comparable Si MOSFETs, lowering heatsink size in solar inverters. |
| Tj,max | 175 °C - Allows operation at full rated current without derating in sealed motor drive enclosures. |
| Rth(j-c) | 0.56 °C/W - Enables 268 W power dissipation with ≤100 °C case temperature using standard copper-clad PCB mounting. |
Pinout & Package
Package: PG-HDSOP-16 with exposed thermal tab (Drain-connected), optimized for low-inductance layout and high-power density mounting.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (Pins 9–16 + Tab) | Main current return path | Low-inductance parallel connection reduces voltage overshoot during 143 A peak switching events. |
| Gate (Pin 8) | Control input | Isolated from source pins to minimize Miller coupling; requires dedicated gate loop routing. |
| Power Source (Pins 1–6) | High-current source reference | Connects to main DC bus ground; carries full load current, must be routed with ≥3 mm trace width. |
| Driver Source (Pin 7) | Gate driver reference | Separate low-noise return for gate driver IC; prevents false turn-on during dV/dt transients. |
| Internal Body Diode | Integrated freewheeling path | Enables synchronous rectification in LLC resonant converters without external diode. |
Key Features
| Feature | Design Value |
|---|---|
| Non-interchangeable source pins | Eliminates common-source inductance-induced shoot-through in half-bridge configurations. |
| VGS(th) = 4.5 V (typ) | Ensures reliable turn-on with 15 V gate drivers while rejecting noise below 3.5 V min threshold. |
| dv/dt immunity = 200 V/ns | Prevents unintended turn-on during 400 V bus transients in high-speed motor drives. |
| Robust body diode | Withstands 12.2 ns forward recovery and 21.6 A peak recovery current under 4000 A/μs di/dt stress. |
| .XT interconnection | Reduces thermal resistance by 22% vs. standard HDSOP, improving long-term reliability at 175 °C junction. |
Applications
| Solar PV String Inverters | EV DC Fast Charging Modules |
|---|---|
Use Scenario: 10–25 kW three-level NPC inverters converting DC from photovoltaic arrays to grid-synchronized AC. IC Role / Device Role / Timing Role: High-side and low-side switching element in T-type topology with 100 kHz PWM frequency. Use Value: 40 mΩ RDS(on) and 7.2 μJ Eoff reduce system losses by 1.8 W per switch versus Si alternatives, enabling passive cooling. | Use Scenario: 15–30 kW isolated DC-DC stage in liquid-cooled charging stations delivering 400–1000 V output. IC Role / Device Role / Timing Role: Primary-side switch in phase-shifted full-bridge converter operating at 120 kHz. Use Value: 0.56 °C/W Rth(j-c) allows 268 W dissipation with ≤95 °C case temp, eliminating need for forced-air cooling. |
| Industrial UPS Systems | High-Power Motor Drives |
Use Scenario: Online double-conversion UPS with bidirectional 650 V DC link supporting 20 kVA output. IC Role / Device Role / Timing Role: Inverter leg switch handling 143 A peak current during battery discharge mode. Use Value: 175 °C Tj,max and JEDEC-qualified industrial reliability ensure >10-year field life at full load. | Use Scenario: 30–50 kW servo drives for CNC machines requiring precise torque control and regenerative braking. IC Role / Device Role / Timing Role: Active clamp switch and freewheeling path via integrated body diode in active front-end rectifier. Use Value: 53 nC Qoss enables soft-switching transitions below 50 ns, reducing EMI filter size by 35%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SiC MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Wolfspeed C3M0040065K | Same 650 V/40 mΩ rating but TO-247-4L package; higher Rth(j-c) = 0.75 °C/W; no separate driver source pin. | Limited to lower-power designs (<15 kW) due to thermal constraints; requires external Kelvin source routing. | Select when legacy TO-247 footprint compatibility is required and board space permits larger heatsink. |
| ROHM SCT3040KL | 650 V/42 mΩ; 32 nC Qg; PG-HSOP-8 package; lacks driver/power source separation. | Not suitable for >100 kHz hard-switching due to higher gate charge and no Kelvin source; limited to <10 kW applications. | Choose only for cost-sensitive, lower-frequency (<50 kHz) PFC stages where thermal margin is ample. |
Compared with C3M0040065K and SCT3040KL, IMLT65R040M2HXTMA1 provides superior thermal performance (0.56 vs. ≥0.75 °C/W), guaranteed dv/dt immunity, and built-in source separation-making it the only option qualified for 100+ kW modular EV charger stacks and 25 kW solar inverters with passive cooling.
Availability
IMLT65R040M2HXTMA1 is available at Aetrix Electronics and suitable for solar PV inverters, EV DC fast charging infrastructure, and industrial UPS systems requiring stable component supply across multi-year production programs.
Supply support for IMLT65R040M2HXTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and sensor solutions for industrial, automotive, and renewable energy markets.
This part belongs to the CoolSiC™ G2 family, engineered specifically for high-efficiency, high-power-density switching applications in 650 V industrial and EV infrastructure-emphasizing ruggedness, ease of use, and system-level cost reduction.
FAQ
What is the maximum continuous drain current rating for IMLT65R040M2HXTMA1?
The maximum continuous DC drain current is 57 A at Tc = 25 °C and 40 A at Tc = 100 °C, as specified in Table 2 of the Infineon datasheet. This rating assumes proper thermal management with the PG-HDSOP-16 package mounted on a 4-layer PCB with 2 oz copper and ≥10 cm² thermal pad area.
Can the driver source (Pin 7) and power source (Pins 1–6) be shorted together?
No-Infineon explicitly warns that exchanging or shorting these pins may cause malfunction. Pin 7 serves as the low-inductance reference for the gate driver, while Pins 1–6 carry high-current return paths. Mixing them introduces common-source inductance that degrades switching speed and risks parasitic turn-on during high dv/dt events.
Does IMLT65R040M2HXTMA1 support bipolar gate driving?
Yes-the device supports flexible gate driving including bipolar schemes (e.g., +18 V turn-on / –5 V turn-off), enabled by its robust gate oxide and 23 V absolute maximum VGS. This capability improves noise immunity and reduces Miller-induced oscillations in high-frequency motor drives, as confirmed in Section 1.2 of the datasheet.
What is the avalanche energy rating for single-pulse conditions?
The single-pulse avalanche energy rating is 132 mJ at ID = 4.9 A and VDS = 50 V, per Table 2. This rating validates ruggedness against inductive load switching faults in UPS and motor drive applications, though repetitive avalanche operation is not recommended per Infineon's design guidelines.
IMLT65R040M2HXTMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- -
- Technology:
- -
- Drain to Source Voltage (Vdss):
- -
- Current - Continuous Drain (Id) @ 25°C:
- -
- Drive Voltage (Max Rds On, Min Rds On):
- -
- Rds On (Max) @ Id, Vgs:
- -
- Vgs(th) (Max) @ Id:
- -
- Gate Charge (Qg) (Max) @ Vgs:
- -
- Vgs (Max):
- -
- Input Capacitance (Ciss) (Max) @ Vds:
- -
- FET Feature:
- -
- Power Dissipation (Max):
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
IMLT65R040M2HXTMA1 FAQ
1.How can I place an order for IMLT65R040M2HXTMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IMLT65R040M2HXTMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IMLT65R040M2HXTMA1 reliable?
The price and inventory of IMLT65R040M2HXTMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IMLT65R040M2HXTMA1 is usually 5 days.
3.What payment methods are accepted for IMLT65R040M2HXTMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IMLT65R040M2HXTMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IMLT65R040M2HXTMA1?
IMLT65R040M2HXTMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IMLT65R040M2HXTMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IMLT65R040M2HXTMA1?
For technical support, including IMLT65R040M2HXTMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IMLT65R040M2HXTMA1 requirements.
6.How does Aetrix verify that IMLT65R040M2HXTMA1 is sourced from the original manufacturer or authorized distributors?
All IMLT65R040M2HXTMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IMLT65R040M2HXTMA1 meets industry standards.
7.What is the process for return or replacement of IMLT65R040M2HXTMA1?
All IMLT65R040M2HXTMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IMLT65R040M2HXTMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IMLT65R040M2HXTMA1 part is unused and in its original packaging.
Return procedure for IMLT65R040M2HXTMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IMLT65R040M2HXTMA1 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

