My Inquiry
My Account
NXP Semiconductors IP4221CZ6-XS132
- Part No.:
- IP4221CZ6-XS132
- Manufacturer:
- NXP Semiconductors
- Category:
- TVS Diodes
- Package:
- 6-XFDFN
- Datasheet:
-
IP4221CZ6-XS132.pdf
- Description:
- TRANS VOLTAGE SUPPRESSOR DIODE
- Quantity:
- Payment:
- Shipping:
Inventory:3,899
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IP4221CZ6-XS from NXP Semiconductors is a quad-channel ESD protection diode array designed for high-speed signal lines in USB 2.0, IEEE 1394, DVI, and Gigabit Ethernet interfaces. It delivers ±8 kV IEC 61000-4-2 contact ESD protection per channel, features ultra-low 1 pF line-to-ground capacitance, operates from −0.5 V to +5.5 V input voltage range, and uses rail-to-rail clamping with integrated Zener biasing independent of supply voltage.
For engineers reviewing the IP4221CZ6-XS datasheet, IP4221CZ6-XS pinout, IP4221CZ6-XS application, or IP4221CZ6-XS equivalent, this device is selected for high-fidelity signal integrity preservation in compact portable and display interface designs where sub-1.2 pF channel capacitance and guaranteed ±8 kV ESD robustness are critical selection criteria.
Technical Context
The IP4221CZ6-XS implements four independent ESD protection paths using rail-to-rail diode clamps tied to a common Zener diode referenced to VCC, enabling supply-independent clamping behavior. Each I/O channel exhibits symmetrical bidirectional breakdown with 6 V to 9 V Zener voltage (VBRzd) at 1 mA and ≤100 nA reverse leakage (IRM) at 3 V.
Its architecture supports direct integration into high-speed differential pairs without signal degradation: C(I/O–GND) is specified at 1 pF typical (max 1.2 pF) at 1 MHz and 0 V bias, and forward voltage (VF) is 0.7 V max at 10 mA test current - ensuring low dynamic impedance during ESD transients.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating | ±8 kV per I/O line per IEC 61000-4-2 Contact Discharge (Level 4) |
| Line Capacitance | 1 pF typical (max 1.2 pF) per channel - preserves signal integrity up to 480 Mbps USB 2.0 |
| Zener Breakdown Voltage | 6 V to 9 V at 1 mA - sets precise clamping threshold independent of VCC |
| Input Voltage Range | −0.5 V to +5.5 V - compatible with 3.3 V and 5 V interface rails |
| Reverse Leakage Current | ≤100 nA at 3 V - negligible DC loading on high-impedance data lines |
| Operating Temperature | −40 °C to +85 °C ambient - suitable for consumer and industrial end equipment |
Pinout & Package
IP4221CZ6-XS is housed in a leadless DFN1010-6 (SOT891) package measuring 1.0 mm × 1.0 mm × 0.5 mm with 0.5 mm pitch. The ultra-compact footprint enables placement directly at connector entry points for optimal ESD transient suppression.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | I/O 1 | Protected high-speed signal line (e.g., USB D+) |
| 2 | GND | Signal and ESD return path - must be low-inductance connection to system ground |
| 3 | I/O 2 | Protected high-speed signal line (e.g., USB D−) |
| 4 | I/O 3 | Protected high-speed signal line (e.g., USB ID or SIM CLK) |
| 5 | VCC | Zener bias reference - connects to local 3.3 V or 5 V rail to enable rail-to-rail clamping |
| 6 | I/O 4 | Protected high-speed signal line (e.g., USB VBUS sense or SD CMD) |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail clamping diodes | Enables symmetric ESD protection across full signal swing without reliance on VCC level for clamp activation |
| 1 pF channel capacitance | Maintains signal rise/fall time integrity for USB 2.0 (480 Mbps), DVI, and IEEE 1394a/b applications |
| Integrated Zener biasing | Provides stable 6–9 V clamping threshold regardless of VCC variation - critical for mixed-voltage systems |
| DFN1010-6 package | 1.0 × 1.0 mm footprint minimizes PCB area and parasitic inductance - ideal for space-constrained mobile ports |
| ±8 kV IEC 61000-4-2 compliance | Meets highest industrial ESD immunity requirement without external components or layout compromises |
Applications
| USB 2.0 Port Protection | IEEE 1394a/b Interface |
|---|---|
|
Use Scenario: Protecting mini/micro-USB receptacles in smartphones and tablets against user-hand ESD events during cable insertion. IC Role / Device Role / Timing Role: Quad-channel ESD suppressor placed between USB connector pins (D+, D−, ID, VBUS) and host controller PHY. Use Value: Prevents latch-up or damage to USB transceivers while maintaining <1.2 pF loading - no signal eye diagram degradation at 480 Mbps. |
Use Scenario: Shielding FireWire (IEEE 1394) physical layer transceivers in camcorders and audio interfaces from connector-based ESD. IC Role / Device Role / Timing Role: Bidirectional ESD clamp on TPB+/TPB− and TPA+/TPA− differential pairs before PHY termination resistors. Use Value: Ensures >10⁶ connect/disconnect cycles without performance drift - verified with 56 Ω series termination and 1 nF AC coupling per line. |
| Gigabit Ethernet PHY | Universal SIM Card Interface |
|
Use Scenario: Safeguarding transformer-coupled Ethernet magnetics and PHY pins in routers, switches, and PoE-powered devices. IC Role / Device Role / Timing Role: ESD protection on all four twisted-pair lines (TPONA/TPONB/TPOPC/TPOPD) upstream of common-mode chokes. Use Value: Maintains 1000BASE-T signal fidelity by limiting added capacitance to ≤1.2 pF per line - avoids return loss violations above 100 MHz. |
Use Scenario: Securing SIM card slots in mobile handsets and IoT modules against ESD during hot-swap insertion. IC Role / Device Role / Timing Role: Simultaneous protection of SIM CLK, RESET, I/O, and VCC lines with single-device integration. Use Value: Eliminates need for five discrete TVS diodes - reduces BOM count and ensures matched clamping thresholds across all SIM signals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SP1002-04UTG | 0.35 pF typical capacitance; lower 3.3 V clamping voltage; SOT-23-6 package (2.9 × 2.8 mm) | Better suited for >1 Gbps interfaces (e.g., USB 3.0 Gen1); larger footprint limits placement at ultra-compact connectors | Select when sub-0.4 pF loading is mandatory and board space allows larger package |
| ESD5V3U4-2/TR | 0.8 pF typical capacitance; ±15 kV ESD rating; same DFN1010-6 footprint but higher leakage (500 nA) | Higher ESD margin useful in harsh industrial environments; elevated leakage may affect battery-powered SIM detection circuits | Select when extreme ESD immunity (>±12 kV) is required and leakage sensitivity is low |
Compared with SP1002-04UTG and ESD5V3U4-2/TR, the IP4221CZ6-XS offers optimal balance of 1 pF capacitance, ±8 kV robustness, and minimal 1.0 × 1.0 mm footprint - making it preferred for cost-sensitive, space-constrained USB 2.0 and DVI receiver protection where strict signal integrity and compactness are prioritized over ultra-high ESD rating or sub-0.5 pF loading.
Availability
IP4221CZ6-XS is available at Aetrix Electronics and suitable for mobile phone port protection, display interface hardening, and embedded memory card slot safeguarding requiring stable component supply across high-volume production cycles.
Supply support for IP4221CZ6-XS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer electronics.
The IP4221CZ6-XS belongs to NXP's IP42xx family of ultra-low-capacitance ESD protection arrays, engineered specifically for preserving signal integrity in high-speed digital interfaces while delivering certified IEC 61000-4-2 Level 4 immunity.
FAQ
What is the maximum operating voltage for IP4221CZ6-XS?
The IP4221CZ6-XS supports an input voltage range of −0.5 V to +5.5 V, making it compatible with both 3.3 V and 5 V logic systems. This range ensures safe operation across USB 2.0 data lines, VBUS monitoring, and SIM card interface voltages without risk of forward conduction or breakdown under normal bias conditions. The Zener-based clamping remains effective within this full range.
Does IP4221CZ6-XS require an external power supply to function?
No, the IP4221CZ6-XS does not require active power to provide ESD protection. Its rail-to-rail diode structure operates passively, but the VCC pin (Pin 5) must be connected to the local supply rail (3.3 V or 5 V) to bias the internal Zener diode and enable precise clamping. Without VCC connection, clamping threshold becomes undefined and ESD performance is not guaranteed per specification.
Can IP4221CZ6-XS protect USB 2.0 high-speed (480 Mbps) signals without distortion?
Yes, the IP4221CZ6-XS is explicitly validated for USB 2.0 high-speed operation. With only 1 pF typical line-to-ground capacitance and ≤1.2 pF maximum, it introduces negligible group delay or signal attenuation - preserving eye diagram margins and meeting USB-IF compliance requirements when placed within 5 mm of the connector. Application diagrams in the datasheet confirm successful implementation on D+ and D− lines.
What is the thermal resistance (RθJA) of IP4221CZ6-XS in its DFN1010-6 package?
The datasheet does not specify RθJA for IP4221CZ6-XS, as ESD protection devices operate in transient, non-continuous power mode. Under ESD stress (e.g., 8 kV contact discharge), peak power dissipation is brief (<100 ns) and localized, so steady-state thermal metrics are not applicable. The DFN1010-6 package relies on PCB copper pour for transient heat sinking rather than long-term thermal management.
Is IP4221CZ6-XS compliant with RoHS and REACH regulations?
Yes, IP4221CZ6-XS is RoHS-compliant (lead-free, halogen-free) and meets REACH SVHC requirements, as confirmed in NXP's official product change notices and material declarations. The DFN1010-6 package uses matte tin (Sn) termination finish and complies with JEDEC J-STD-020 moisture sensitivity level 1 (MSL1) for unlimited floor life at ≤30 °C/60% RH.
IP4221CZ6-XS132 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 6-XFDFN
- Series:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5.5V
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- Yes
- Applications:
- DVI, Ethernet, USB
- Capacitance @ Frequency:
- 1pF @ 1MHz
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-XSON (1x1)
IP4221CZ6-XS132 FAQ
1.How can I place an order for IP4221CZ6-XS132 through Aetrix?
Please submit a Request for Quotation (RFQ) for IP4221CZ6-XS132 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IP4221CZ6-XS132 reliable?
The price and inventory of IP4221CZ6-XS132 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IP4221CZ6-XS132 is usually 5 days.
3.What payment methods are accepted for IP4221CZ6-XS132?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IP4221CZ6-XS132 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IP4221CZ6-XS132?
IP4221CZ6-XS132 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IP4221CZ6-XS132 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IP4221CZ6-XS132?
For technical support, including IP4221CZ6-XS132 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IP4221CZ6-XS132 requirements.
6.How does Aetrix verify that IP4221CZ6-XS132 is sourced from the original manufacturer or authorized distributors?
All IP4221CZ6-XS132 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IP4221CZ6-XS132 meets industry standards.
7.What is the process for return or replacement of IP4221CZ6-XS132?
All IP4221CZ6-XS132 units undergo pre-shipment inspection (PSI). If there is an issue with IP4221CZ6-XS132, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IP4221CZ6-XS132 part is unused and in its original packaging.
Return procedure for IP4221CZ6-XS132:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IP4221CZ6-XS132 Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
