Nexperia USA Inc. IP4284CZ10-TBR,115

Overview

IP4284CZ10-TBR from NXP Semiconductors is a 4-channel ESD protection diode array designed for ultra-high-speed differential interfaces including HDMI 1.4, DisplayPort, USB SuperSpeed 3.0, eSATA, and LVDS. It delivers ±8 kV IEC 61000-4-2 contact ESD protection per channel, features 0.5 pF typical line capacitance, and uses rail-to-rail clamping diodes in an XSON10 (SOT1176-1) package measuring 1 × 2.5 × 0.5 mm.

For engineers reviewing the IP4284CZ10-TBR datasheet, IP4284CZ10-TBR pinout, IP4284CZ10-TBR application, or IP4284CZ10-TBR equivalent, key selection criteria include sub-0.55 pF channel capacitance matching, ≤0.05 pF inter-pair capacitance delta, dynamic clamping voltage under 8 V at 8 kV ESD stress, and compatibility with 5 Gbit/s signal integrity requirements in HDMI/USB3.0 receiver port layouts.

Technical Context

This device implements integrated bidirectional rail-to-rail clamping diodes on all four signal channels, enabling symmetric ESD protection without DC bias dependency. Each channel maintains matched trace spacing (0.5 mm) and exhibits ≤0.05 pF capacitance mismatch between differential pairs-critical for maintaining TMDS and LVDS signal integrity.

The XSON10 package supports high-density PCB routing with pass-thru signal paths and zero lead inductance, while its 0.5 pF typical channel capacitance and 0.07 pF mutual capacitance minimize insertion loss up to 5 GHz, as validated by Sdd21 and NEXT crosstalk measurements in reference HDMI layouts.

Key Specifications

Pinout & Package

XSON10 (SOT1176-1) is a leadless, extremely thin small outline package with 10 terminals, optimized for high-speed layout: no leads reduce parasitic inductance, and the 0.5 mm pitch enables direct routing beneath the device.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Compared with IP4284CZ10-TBR, IP4286CZ12-TBR extends channel count without sacrificing capacitance or clamping performance, while TPD4E05U06DQAR trades lower dynamic resistance for higher ESD rating-making the NXP device optimal for bandwidth-critical consumer HDMI/USB3.0 designs where sub-1 Ω clamping and 0.5 pF loading are non-negotiable.

Availability

IP4284CZ10-TBR is available at Aetrix Electronics and suitable for HDMI 1.4 receiver ports, DisplayPort 1.2 transmitter outputs, and USB 3.0 SuperSpeed interfaces requiring stable component supply, consistent ESD performance across production lots, and long-term lifecycle support for consumer electronics programs.

Supply support for IP4284CZ10-TBR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer markets.

IP4284CZ10-TBR belongs to NXP's IP42xx family of ultra-low-capacitance ESD protection arrays, engineered specifically for preserving signal integrity in multi-gigabit serial interfaces while meeting stringent IEC 61000-4-2 Level 4 system ESD requirements.

FAQ

What is the maximum data rate supported by IP4284CZ10-TBR without signal degradation?

IP4284CZ10-TBR supports up to 5 Gbit/s data rates, as verified by eye diagram testing with USB 3.0 CP0 pattern and HDMI 1.4 compliance. Its 0.5 pF channel capacitance and 0.07 pF mutual capacitance ensure <0.5 dB insertion loss at 2.5 GHz, preserving signal integrity for HDMI 1.4, DisplayPort 1.2, and USB 3.0 SuperSpeed applications.

Can IP4284CZ10-TBR be used for both HDMI and USB 3.0 protection on the same PCB?

Yes-IP4284CZ10-TBR is qualified for simultaneous use on HDMI 1.4 (TMDS lanes) and USB 3.0 SuperSpeed (TX/RX differential pairs) due to its rail-to-rail clamping, 0.5 pF capacitance, and matched differential pair design. Layout best practices require separate ground planes and controlled-impedance routing for each interface to prevent coupling.

How does the XSON10 package affect thermal performance during ESD events?

The XSON10 package provides low thermal resistance (θ_JA ≈ 220 °C/W) and direct silicon-to-PCB conduction via exposed die paddle (though not explicitly labeled in SOT1176-1). During 8 kV ESD transients, heat is dissipated rapidly through the dual GND pins (Pins 3 and 8) into internal ground planes, preventing localized overheating that could degrade clamping performance over repeated strikes.

Are the n.c. pins on IP4284CZ10-TBR required to be grounded or left floating?

All n.c. pins (6, 7, 9, 10) must remain unconnected-neither grounded nor tied to any voltage. They are electrically isolated internal pads with no bond wires. Connecting them risks introducing parasitic capacitance or unintended current paths that could compromise ESD performance or signal integrity in high-speed lanes.