My Inquiry
My Account
NXP Semiconductors IP4303CX4/LF,135
- Part No.:
- IP4303CX4/LF,135
- Manufacturer:
- NXP Semiconductors
- Category:
- TVS Diodes
- Package:
- 4-WFBGA, WLCSP
- Datasheet:
-
IP4303CX4/LF,135.pdf
- Description:
- TVS DIODE 4CSP
- Quantity:
- Payment:
- Shipping:
Inventory:5,606
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IP4303CX4/LF,135 from NXP is a quad-channel unidirectional ESD protection diode array in a 4-pin chip-scale package (CSP), rated for 5.5 V reverse stand-off voltage, 12 A peak pulse current (8/20 µs), and < 0.5 pF line capacitance per channel. It protects high-speed USB 2.0, HDMI, and SD-card interfaces against IEC 61000-4-2 Level 4 (±15 kV contact / ±20 kV air) transients.
For engineers reviewing the IP4303CX4/LF,135 datasheet, IP4303CX4/LF,135 pinout, IP4303CX4/LF,135 application, or IP4303CX4/LF,135 equivalent, this device serves as a femtofarad-level ESD clamp for space-constrained portable electronics requiring sub-1 pF signal integrity preservation and rail-to-rail transient suppression without loading high-frequency data lines.
Technical Context
The IP4303CX4/LF,135 integrates four independent low-capacitance silicon avalanche diodes in a single CSP with anode-cathode-anode-cathode (A-C-A-C) terminal configuration. Each channel features a dedicated cathode tied to VCC (supply rail), enabling rail-to-rail clamping between I/O and VCC or ground.
It operates with a typical leakage current of 10 nA at 5.5 V and triggers at 6.5 V (VBR), clamping to ≤12 V at 12 A (8/20 µs). The device is qualified to AEC-Q101 and supports reflow soldering per JEDEC J-STD-020D.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating | IEC 61000-4-2 Level 4: ±15 kV contact, ±20 kV air – ensures robust system-level ESD immunity without external shielding. |
| Reverse Stand-off Voltage (VRWM) | 5.5 V – matches standard 3.3 V and 5 V I/O rails while maintaining safe margin below logic VCC. |
| Clamping Voltage (VC) | ≤12 V at 12 A (8/20 µs) – limits transient overvoltage to safe levels for downstream 3.3 V tolerant receivers. |
| Line Capacitance (Cline) | 0.35 pF typ @ 0 V – preserves signal integrity on USB 2.0 (480 Mbps) and SDIO interfaces without jitter or rise-time degradation. |
| Leakage Current (IR) | 10 nA max @ 5.5 V – avoids DC loading of high-impedance sensor or audio bias networks. |
| Package | 4-pin CSP (chip-scale package), 1.0 × 0.6 × 0.4 mm – enables direct placement under connectors or in tight board areas near I/O ports. |
Pinout & Package
Package: CX4 (4-pin chip-scale package), dimensions 1.0 mm × 0.6 mm × 0.4 mm, bottom-side solder pads, no leads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Anode 1 | Protected I/O line 1 input; connects to data line (e.g., USB D+). |
| 2 | Cathode 1 / VCC | Clamp rail connection; ties to local 3.3 V or 5 V supply for rail-to-rail protection. |
| 3 | Anode 2 | Protected I/O line 2 input; connects to second data line (e.g., USB D−). |
| 4 | Cathode 2 / VCC | Shared clamp rail; electrically common with Pin 2 for dual-line protection with single supply tie. |
Key Features
| Feature | Design Value |
|---|---|
| Femtofarad-level capacitance | 0.35 pF typical per channel enables full-speed USB 2.0 compliance without equalization or layout compensation. |
| Rail-to-rail clamping architecture | Dual cathode pins tied to VCC allow bidirectional transient suppression between I/O and power rail, eliminating need for ground-return path. |
| AEC-Q101 qualification | Validated for automotive infotainment and telematics modules requiring extended temperature operation (−40 °C to +125 °C). |
| Chip-scale footprint | 1.0 × 0.6 mm area occupies < 25% of SOT23-6 area, enabling placement directly beneath micro-USB or micro-SD connectors. |
| Low leakage & high VRWM | 10 nA leakage at 5.5 V prevents battery drain in always-on mobile accessories; 5.5 V VRWM supports 5 V tolerant I/O without derating. |
Applications
| USB 2.0 Interface Protection | HDMI DDC Channel Protection |
|---|---|
|
Use Scenario: Protecting USB 2.0 D+/D− differential pair in smartphone docking stations against repeated hot-plug ESD events. IC Role / Device Role / Timing Role: Quad-channel ESD clamp placed immediately before USB connector, with Pins 1/3 on D+/D− and Pins 2/4 tied to 3.3 V rail. Use Value: 0.35 pF capacitance prevents signal rise-time degradation (< 1 ns impact), preserving eye diagram integrity at 480 Mbps. |
Use Scenario: Safeguarding HDMI DDC (I²C) SDA/SCL lines in portable media players during cable insertion/removal. IC Role / Device Role / Timing Role: Dual-channel protection where each channel guards one DDC line, leveraging rail-clamp topology to avoid adding pull-up load. Use Value: 10 nA leakage avoids compromising I²C bus timing or increasing pull-up resistor power dissipation. |
| microSD Card Slot Protection | Automotive Infotainment Display Link |
|
Use Scenario: ESD hardening of 4-bit SDIO bus (CMD, CLK, DAT0–DAT3) in wearable health monitors with exposed card slots. IC Role / Device Role / Timing Role: Two IP4303CX4/LF,135 devices used in parallel (8 channels total) to cover all five SDIO lines with minimal board area. Use Value: 1.0 × 0.6 mm CSP allows placement within 2 mm of card edge connector, minimizing stub length and impedance discontinuity. |
Use Scenario: Protecting LVDS or FPD-Link II display interface lines in automotive head units subjected to ISO 10605 discharge events. IC Role / Device Role / Timing Role: Single IP4303CX4/LF,135 deployed on clock and data pairs, with cathodes connected to 1.8 V or 3.3 V display supply rail. Use Value: AEC-Q101 qualification ensures reliability across −40 °C to +125 °C junction temperature range in sealed dashboard environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESD5V3U2U-2/TR | 0.5 pF typ capacitance; 5.3 V VRWM; SOD-882 package (1.0 × 0.6 mm, but 0.37 mm height) | Higher capacitance limits use to ≤ 240 Mbps interfaces; taller profile may interfere with shield cans. | Prefer when existing layout uses SOD-882 footprints and 5.3 V VRWM suffices for 3.3 V systems. |
| TPD2E001DRYR | 1.0 pF typ capacitance; 5.5 V VRWM; 6-pin SOT-563 package; includes two additional ground pins | Higher capacitance degrades USB 2.0 eye margin; larger 1.6 × 1.2 mm footprint requires PCB redesign. | Choose only if design already uses SOT-563 and can accommodate higher Cline with receiver equalization. |
Compared with ESD5V3U2U-2/TR and TPD2E001DRYR, the IP4303CX4/LF,135 delivers the lowest verified line capacitance (0.35 pF) in the smallest volume (0.24 mm³), making it uniquely suitable for next-generation ultra-thin mobile and automotive displays where both signal fidelity and board space are constrained.
Availability
IP4303CX4/LF,135 is available at Aetrix Electronics and suitable for USB 2.0 interface protection, microSD card slot hardening, and automotive display link safeguarding requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.
Supply support for IP4303CX4/LF,135 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer electronics.
The IP4303CX4/LF,135 belongs to NXP's Integrated Protection (IP) family of ultra-low-capacitance ESD arrays, designed specifically for high-speed digital interfaces where signal integrity and miniaturization are critical constraints.
FAQ
What is the maximum operating temperature for the IP4303CX4/LF,135?
The IP4303CX4/LF,135 is rated for junction temperatures from −40 °C to +125 °C and is AEC-Q101 qualified, making it suitable for under-hood automotive applications and thermally dense portable electronics where ambient temperatures exceed 85 °C. Its thermal resistance (RθJA) is 290 °C/W in standard JEDEC 2-layer board conditions.
Does the IP4303CX4/LF,135 require external decoupling capacitors for ESD clamping?
No, the IP4303CX4/LF,135 does not require external decoupling capacitors. Its rail-to-rail architecture uses internal diode paths between I/O pins and the VCC rail (Pins 2 and 4), relying on the system's existing power rail capacitance (typically ≥100 nF near the connector) to absorb transient energy. Adding extra capacitance may slow clamping response.
Can the IP4303CX4/LF,135 protect bidirectional data lines like I²C without affecting communication?
Yes - the IP4303CX4/LF,135 supports bidirectional protocols such as I²C because its unidirectional diodes clamp transients toward VCC, not ground. This preserves the open-drain pull-up behavior: normal logic 'high' is maintained by the external resistor, while ESD events are shunted to VCC without disrupting bus arbitration or clock stretching. Leakage remains below 10 nA at 3.3 V.
Is the IP4303CX4/LF,135 compatible with lead-free reflow profiles?
Yes, the IP4303CX4/LF,135 is fully compatible with lead-free reflow soldering per JEDEC J-STD-020D, supporting peak temperatures up to 260 °C for 30 seconds. Its CX4 chip-scale package uses NiPdAu surface finish and withstands multiple reflow cycles without delamination or parameter shift.
How does the clamping voltage of IP4303CX4/LF,135 compare to standard TVS diodes in the same application?
The IP4303CX4/LF,135 clamps to ≤12 V at 12 A (8/20 µs), significantly lower than generic 5.5 V TVS diodes (often >18 V at same current). This tighter clamping window ensures downstream 3.3 V logic ICs remain within absolute maximum ratings during ESD strikes, reducing risk of latent damage or functional interruption in real-world use.
IP4303CX4/LF,135 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 4-WFBGA, WLCSP
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 2
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- -
- Voltage - Breakdown (Min):
- -
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- -
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-CSP
IP4303CX4/LF,135 FAQ
1.How can I place an order for IP4303CX4/LF,135 through Aetrix?
Please submit a Request for Quotation (RFQ) for IP4303CX4/LF,135 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IP4303CX4/LF,135 reliable?
The price and inventory of IP4303CX4/LF,135 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IP4303CX4/LF,135 is usually 5 days.
3.What payment methods are accepted for IP4303CX4/LF,135?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IP4303CX4/LF,135 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IP4303CX4/LF,135?
IP4303CX4/LF,135 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IP4303CX4/LF,135 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IP4303CX4/LF,135?
For technical support, including IP4303CX4/LF,135 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IP4303CX4/LF,135 requirements.
6.How does Aetrix verify that IP4303CX4/LF,135 is sourced from the original manufacturer or authorized distributors?
All IP4303CX4/LF,135 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IP4303CX4/LF,135 meets industry standards.
7.What is the process for return or replacement of IP4303CX4/LF,135?
All IP4303CX4/LF,135 units undergo pre-shipment inspection (PSI). If there is an issue with IP4303CX4/LF,135, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IP4303CX4/LF,135 part is unused and in its original packaging.
Return procedure for IP4303CX4/LF,135:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IP4303CX4/LF,135 Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
