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NXP Semiconductors IP4309CX9,135
- Part No.:
- IP4309CX9,135
- Manufacturer:
- NXP Semiconductors
- Category:
- TVS Diodes
- Package:
- 9-WFBGA, CSPBGA
- Datasheet:
-
IP4309CX9,135.pdf
- Description:
- TVS DIODE 5.5VWM 9-CSP
- Quantity:
- Payment:
- Shipping:
Inventory:8,533
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Product details
Overview
IP4309CX9 from NXP Semiconductors is an 8-channel monolithic silicon ESD protection diode array in WLCSP9 package, delivering ±15 kV contact/air discharge protection per IEC 61000-4-2 Level 4, 1.3 pF typical I/O-to-ground capacitance, and 0.45 Ω dynamic resistance - engineered for HDMI, DVI, and USB high-speed data lines where signal integrity and miniaturization are critical.
For engineers reviewing the IP4309CX9 datasheet, IP4309CX9 pinout, IP4309CX9 application, or IP4309CX9 equivalent, this device supports high-frequency interface protection with electrically isolated channels, ultra-low capacitive loading, and wafer-level chip-scale packaging optimized for mobile handset PCB layouts.
Technical Context
The IP4309CX9 integrates eight independent rail-to-rail ESD protection diodes in a single die, each featuring Zener breakdown voltage of 6–11 V and forward voltage of 0.7 V, with all channels sharing only a common ground connection to prevent current backdrive between adjacent signal paths.
Its electrical isolation architecture ensures crosstalk below –80 dB across pin combinations (e.g., A1–C3) up to 100 MHz, while insertion loss remains under –1 dB up to 1 GHz - enabling transparent integration into HDMI 1.4 and DVI-D compliant interfaces without degrading eye diagrams or jitter budgets.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD rating | ±15 kV contact & air discharge - exceeds IEC 61000-4-2 Level 4 by >87% margin, ensuring robust field reliability in handheld devices. |
| I/O capacitance | 1.3 pF typical (1.0–1.5 pF range) at 1 MHz - preserves signal rise/fall times on HDMI TMDS lines operating up to 3.4 Gbps. |
| Dynamic resistance | 0.45 Ω (positive transient) - minimizes clamping voltage overshoot during fast ESD events, reducing downstream IC stress. |
| Breakdown voltage | 6–11 V at 1 mA - safely clamps transients above system VCC while avoiding false triggering on 3.3 V or 5 V logic rails. |
| Package | WLCSP9 (3×3 bumps, 0.4 mm pitch, 1.16×1.16×0.61 mm) - enables direct placement beneath HDMI connectors in space-constrained mobile PCBs. |
| Leakage current | <50 nA at 3 V - prevents DC loading on high-impedance receiver inputs, maintaining signal threshold margins. |
Pinout & Package
IP4309CX9 uses a 3×3 Wafer Level Chip-Scale Package (WLCSP9) with solder bumps on bottom side; package dimensions are 1.16 mm × 1.16 mm × 0.61 mm, 0.4 mm bump pitch, and index area marking bump A1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | ESD protection channel 1 anode | Input node for first protected signal line; connects directly to HDMI/DVI data lane (e.g., TMDS clock or data+). |
| A2 | ESD protection channel 2 anode | Independent protection path for second high-speed signal; no shared conduction path with A1 except ground. |
| A3 | ESD protection channel 3 anode | Dedicated clamping node for third interface line; maintains <–80 dB crosstalk to A1 at 100 MHz. |
| B1 | ESD protection channel 4 anode | Fourth isolated protection terminal; routed to separate PCB trace to avoid coupling with B2 ground return. |
| B2 | Ground reference | Common cathode connection for all eight channels; must be tied to low-inductance buried ground plane via laser-drilled micro-vias. |
| B3 | ESD protection channel 5 anode | Fifth independent channel; electrically decoupled from adjacent pins to prevent latch-up in multi-lane interfaces. |
| C1 | ESD protection channel 6 anode | Sixth channel with identical electrical characteristics; supports full HDMI 1.4 4-lane + clock protection in one footprint. |
| C2 | ESD protection channel 7 anode | Seventh channel; validated for insertion loss <–1 dB up to 1 GHz in 50 Ω measurement setup. |
| C3 | ESD protection channel 8 anode | Eighth channel; completes octal protection set for dual-link DVI or HDMI with CEC/HEAC support. |
Key Features
| Feature | Design Value |
|---|---|
| 8-channel electrical isolation | Zero shared current paths between I/O pins except ground - eliminates cross-talk-induced false triggers in multi-lane video interfaces. |
| Ultra-low 1.3 pF capacitance | Preserves HDMI 1.4 eye opening at 3.4 Gbps; measured S21 insertion loss <–1 dB up to 1 GHz. |
| 0.45 Ω dynamic resistance | Reduces clamping voltage overshoot to <12 V during 8 A ESD pulse, protecting 3.3 V receivers without overvoltage damage. |
| WLCSP9 miniaturization | 1.16 mm² footprint - fits under standard HDMI Type A receptacle; enables direct routing from connector pads to protected ICs. |
| Pb-free & halogen-free | RoHS-compliant dark green finish; qualified for three Pb-free reflow cycles up to 260 °C peak temperature. |
Applications
| HDMI Interface Protection | DVI Signal Line Protection |
|---|---|
Use Scenario: Protecting TMDS clock and data lanes in smartphone-to-display docking adapters. IC Role / Device Role / Timing Role: ESD clamp placed between HDMI receptacle and SerDes PHY, absorbing ±15 kV transients before they reach the SoC. Use Value: Maintains 3.4 Gbps signal integrity with <1 dB insertion loss and <–80 dB crosstalk, preventing pixel corruption or link dropouts. |
Use Scenario: Shielding dual-link DVI signals in industrial control panel video outputs. IC Role / Device Role / Timing Role: Octal rail-to-rail diode array providing independent protection for 24-bit RGB + sync lines without shared conduction paths. Use Value: Prevents ESD-induced latch-up in FPGA-based video controllers by isolating all 8 channels to a single low-inductance ground. |
| USB 2.0 High-Speed Data Lines | Mobile Handset Display Interfaces |
Use Scenario: ESD hardening of USB OTG data pairs in portable medical devices. IC Role / Device Role / Timing Role: Low-capacitance shunt protector on D+/D− lines, placed immediately after USB connector to minimize stub length. Use Value: 1.3 pF loading avoids USB 2.0 eye diagram closure; ±15 kV rating meets IEC 61000-4-2 for handheld clinical equipment. |
Use Scenario: Protecting MIPI D-PHY lanes in foldable smartphone display modules. IC Role / Device Role / Timing Role: Miniaturized octal ESD array mounted adjacent to display flex connector, leveraging WLCSP9's 1.16 mm² footprint. Use Value: Enables direct routing from flex-to-PCB without vias or stubs, preserving 1.5 Gbps differential signal fidelity in tight hinge zones. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor ESD9X5.0ST5G | Single-channel, 5.0 V standoff, 1.0 pF capacitance, SOD-923 package | Requires 8 discrete placements vs. IP4309CX9's integrated octal solution; higher assembly cost and PCB area | Select when board space permits discrete layout and tighter 5.0 V clamping is required over IP4309CX9's 6–11 V range |
| Texas Instruments TPD4E001DRYR | 4-channel, 1.0 pF, 0.5 Ω Rdyn, DSBGA-10 package (1.4 × 1.4 mm) | Half the channel count; requires two units for full HDMI protection; larger footprint than IP4309CX9's 1.16 mm² | Choose when existing designs use TI ecosystem tools or require lower 1.0 pF capacitance at expense of channel density |
Compared with ESD9X5.0ST5G and TPD4E001DRYR, the IP4309CX9 delivers higher integration (8 channels in 1.16 mm²), superior ESD margin (±15 kV vs. ±12 kV typical), and optimized crosstalk isolation - making it the preferred choice for next-generation mobile video interfaces where PCB real estate and signal fidelity are constrained.
Availability
IP4309CX9 is available at Aetrix Electronics and suitable for HDMI interface protection, mobile handset display modules, and USB 2.0 high-speed data lines requiring stable component supply across production lifecycles.
Supply support for IP4309CX9 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer electronics.
The IP4309CX9 belongs to NXP's high-speed interface protection product line, designed specifically to address ESD vulnerability in miniaturized HDMI, DVI, and USB systems where traditional TVS arrays introduce unacceptable capacitive loading.
FAQ
What is the maximum operating voltage supported by the IP4309CX9?
The IP4309CX9 supports an input voltage range of –0.5 V to +5.5 V at its I/O pins, making it compatible with both 3.3 V and 5 V logic systems. Its Zener breakdown voltage is specified from 6 V to 11 V at 1 mA test current, ensuring reliable clamping above normal operating rails while avoiding false triggering during valid signal swings. This voltage window allows safe integration into HDMI, DVI, and USB 2.0 interfaces without compromising signal integrity or DC bias conditions.
Does the IP4309CX9 require external components for basic ESD protection functionality?
No, the IP4309CX9 operates as a standalone ESD protection device with no external components required. Each of its eight channels integrates rail-to-rail diode structures with grounded cathodes, eliminating the need for series resistors, ferrites, or additional TVS elements. The design relies solely on proper PCB layout - specifically laser-drilled micro-vias connecting the B2 ground bump to a buried ground plane - to achieve optimal high-frequency performance and low-inductance discharge paths.
How does the IP4309CX9's 1.3 pF capacitance impact HDMI 2.0 signal integrity?
The IP4309CX9's typical 1.3 pF I/O-to-ground capacitance introduces negligible degradation to HDMI 2.0 (6 Gbps) signals: measured insertion loss remains below –1 dB up to 1 GHz, and crosstalk stays under –80 dB across worst-case pin pairs. This performance preserves eye diagram opening and jitter budgets when placed within 3 mm of the HDMI connector, satisfying HDMI 2.0 compliance requirements for source-side protection without equalization or retiming.
Can the IP4309CX9 be used in automotive infotainment systems?
The IP4309CX9 is not automotive-qualified per NXP's documentation and lacks AEC-Q200 certification or extended temperature validation beyond –30 °C to +85 °C ambient. While its ±15 kV ESD rating and robust construction may suit some non-safety-critical infotainment subsystems, NXP explicitly states that non-automotive qualified products like the IP4309CX9 are not tested to automotive reliability standards and carry no warranty for such use. For certified automotive deployment, consult NXP's automotive-grade alternatives.
What is the recommended PCB pad layout for the IP4309CX9's WLCSP9 package?
NXP specifies a Non-Solder Mask Defined (NSMD) copper-defined pad layout with 250 µm diameter pads, 325 µm solder mask aperture, and laser-drilled 100 µm micro-vias to a buried ground plane. This configuration minimizes ground inductance and maximizes high-frequency ESD dissipation. The recommended copper thickness is 20–40 µm with AuNi finish on FR4 substrate - deviations increase impedance mismatch and reduce clamping effectiveness during fast transients.
IP4309CX9,135 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 9-WFBGA, CSPBGA
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 8
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5.5V
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- Yes
- Applications:
- HDMI
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -35°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 9-CSP
IP4309CX9,135 FAQ
1.How can I place an order for IP4309CX9,135 through Aetrix?
Please submit a Request for Quotation (RFQ) for IP4309CX9,135 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IP4309CX9,135 reliable?
The price and inventory of IP4309CX9,135 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IP4309CX9,135 is usually 5 days.
3.What payment methods are accepted for IP4309CX9,135?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IP4309CX9,135 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IP4309CX9,135?
IP4309CX9,135 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IP4309CX9,135 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IP4309CX9,135?
For technical support, including IP4309CX9,135 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IP4309CX9,135 requirements.
6.How does Aetrix verify that IP4309CX9,135 is sourced from the original manufacturer or authorized distributors?
All IP4309CX9,135 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IP4309CX9,135 meets industry standards.
7.What is the process for return or replacement of IP4309CX9,135?
All IP4309CX9,135 units undergo pre-shipment inspection (PSI). If there is an issue with IP4309CX9,135, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IP4309CX9,135 part is unused and in its original packaging.
Return procedure for IP4309CX9,135:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IP4309CX9,135 Tags
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ESD9B5.0ST5G
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DESD3V3E1BL-7B
Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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onsemi
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Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
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Nexperia USA Inc.
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Toshiba Semiconductor and Storage
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Diodes Incorporated
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