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NXP Semiconductors IP4350CX24/LF,135
- Part No.:
- IP4350CX24/LF,135
- Manufacturer:
- NXP Semiconductors
- Category:
- TVS Diodes
- Package:
- 24-WFBGA, WLCSP
- Datasheet:
-
IP4350CX24/LF,135.pdf
- Description:
- TVS DIODE 24WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:6,996
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Product details
Overview
IP4350CX24/LF,135 from Nexperia is a wafer-level chip-scale packaged ESD protection array for SD memory card interfaces, integrating 9 rail-to-rail diode pairs, 12 Zener diodes, and 15 resistors in a 1.95 mm × 2.11 mm WLCSP24 package. It delivers ±15 kV IEC 61000-4-2 air discharge ESD protection on 9 channels, supports electrical card detection and write protection biasing, and maintains ≤8.8 pF channel capacitance for high-speed SD signal integrity in mobile handsets.
For engineers reviewing the IP4350CX24/LF,135 datasheet, IP4350CX24/LF,135 pinout, IP4350CX24/LF,135 application, or IP4350CX24/LF,135 equivalent, key selection considerations include its 24-bump WLCSP footprint, integrated EMI/RF filtering on 9 SD data lines, dual-role WP+CD and SDWP+CD terminals, and guaranteed insertion loss <3 dB up to 400 MHz - critical for SD 2.0/3.0 interface compliance and board-level ESD robustness validation.
Technical Context
The IP4350CX24/LF,135 implements monolithic silicon-based rail-to-rail clamping with integrated pull-up (DAT3_PU), pull-down (DAT3_PD), and series resistors (R1–R15) across host and SD card sides of the interface. Its architecture separates host-side (GND_H) and card-side (GND_C, VSD) supply domains while enabling bidirectional signal routing on DATA0–DATA3, SDDATA0–SDDATA3, CMD/SDCMD, CLK/SDCLK, CD/SDCD, and WP/SDWP channels.
It provides simultaneous ESD protection and signal conditioning: each protected channel includes a low-capacitance diode pair (≤8.8 pF), series resistance (12–18 Ω for data paths), and optional RC filtering (50 kΩ/5–6 pF for DAT3_PU/DAT3_PD). The device supports electrical card detection via CD/SDCD and write protection via WP/SDWP, with combined WP+CD and SDWP+CD terminals reducing PCB trace count.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Protection Level | ±15 kV air discharge per IEC 61000-4-2 level 4 on 9 output terminals - ensures robustness against human-body-model ESD events in handheld devices. |
| Channel Capacitance | ≤8.8 pF per data channel at 1 MHz - preserves SD interface signal integrity up to 50 MHz clock rates without timing skew. |
| Series Resistance | 12–18 Ω for R1–R9 (data paths); 3.29–6.11 kΩ for R15 (VSD filter) - damps ringing and limits fault current during ESD transients. |
| Package Dimensions | 1.95 mm × 2.11 mm × 0.61 mm WLCSP24 - enables direct integration beneath SD card slots in space-constrained mobile PCBs. |
| Operating Temperature | −30 °C to +85 °C ambient - suitable for consumer-grade portable electronics without derating. |
| Insertion Loss | <3 dB up to 400 MHz; <6 dB up to 800 MHz - maintains SD bus signal amplitude within specification across full UHS-I frequency range. |
| Breakdown Voltage | 6 V minimum (VBR at 1 mA) - clamps transients before damaging 3.3 V SD I/O circuitry. |
Pinout & Package
IP4350CX24/LF,135 uses a 24-bump wafer-level chip-scale package (WLCSP24) with 0.4 mm pitch, measuring 1.95 mm × 2.11 mm × 0.61 mm. Bumps are arranged in a 5×5 grid with four corner bumps omitted (A1, A5, E1, E5 present; A2–A4, B1–B5, C1–C5, D1–D5, E2–E4 populated).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DATA0–DATA3 | Host-side SD data I/O | Bidirectional data lines connecting to host controller; protected by rail-to-rail diodes and 12–18 Ω series resistors. |
| SDDATA0–SDDATA3 | SD card-side data I/O | Corresponding card-side data terminals; isolated from host side by internal diode clamps and RC networks. |
| CMD / SDCMD | Command line I/O | Host and card command interface with integrated ESD protection and 12–18 Ω series resistance. |
| CLK / SDCLK | Clock signal I/O | Low-capacitance (7.8 pF) path for 50 MHz SD clock; maintains edge integrity under ESD stress. |
| CD / SDCD | Card detect I/O | Host outputs card presence status; SD card provides input - supports electrical card detection without external components. |
| WP / SDWP | Write protect I/O | Host controls write lock; SD card reports status - integrated pull-up/pull-down resistors eliminate need for discrete biasing. |
| WP+CD / SDWP+CD | Combined WP/CD terminal | Reduces pin count by merging write protect and card detect functions on single bump - simplifies routing in tight layouts. |
| VSD | SD card supply voltage | 3.3 V power input for internal filtering network (R15/Cch = 4.7 kΩ/37 pF); decouples card-side noise. |
| GND_H / GND_C | Separate ground returns | Dedicated host and card ground planes prevent noise coupling between domains - essential for EMI suppression. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail ESD clamping | 9-channel protection with ±15 kV air discharge rating - exceeds IEC 61000-4-2 level 4 without external TVS diodes. |
| Integrated SD signal conditioning | On-die 12–18 Ω series resistors and ≤8.8 pF capacitance per data line - eliminates need for discrete RC filters on SD bus traces. |
| Electrical card detection support | Dedicated CD/SDCD pins with internal biasing - enables reliable hot-plug detection without external pull resistors or microcontroller GPIO overhead. |
| Combined WP+CD functionality | Single-terminal implementation of write protect and card detect - reduces SD interface pin count by two and saves PCB real estate. |
| Wafer-level chip-scale packaging | 1.95 mm × 2.11 mm footprint with 0.4 mm bump pitch - allows placement directly under SD card connector, minimizing trace inductance and ESD coupling paths. |
Applications
| Mobile Handset SD Interfaces | Digital Camera Card Slots |
|---|---|
Use Scenario: SD card interface in LTE smartphone with shared PCB area for SIM, microSD, and USB-C connectors. IC Role / Device Role / Timing Role: ESD protection and signal conditioning IC placed between application processor SDIO controller and microSD card slot. Use Value: Prevents field failures from user-handling ESD while maintaining 50 MHz SD clock edge fidelity and eliminating 12 discrete RC components per data line. | Use Scenario: High-resolution digital still/video camera requiring hot-swappable SDXC cards in compact body design. IC Role / Device Role / Timing Role: Integrated ESD filter on SD bus with electrical card detect and write protect biasing. Use Value: Enables reliable card insertion/removal detection and prevents accidental writes during video capture - all within 1.95 mm × 2.11 mm area. |
| Portable Media Player Storage | Embedded Card Reader Modules |
Use Scenario: Bluetooth-enabled media player supporting UHS-I SD cards for lossless audio playback. IC Role / Device Role / Timing Role: Signal integrity enhancer and transient suppressor on 4-bit SD data bus operating at 100 MB/s. Use Value: Maintains <3 dB insertion loss below 400 MHz to preserve data eye opening, while providing ±15 kV ESD immunity on all 9 active lines. | Use Scenario: Industrial IoT gateway with embedded SD card for firmware logging and OTA updates. IC Role / Device Role / Timing Role: Robust SD interface protector with separate host/card ground domains and VSD decoupling. Use Value: Isolates noisy card power domain from host logic, suppresses conducted EMI, and ensures >100,000 insert/eject cycles without degradation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SD memory card interface ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IP4352CX24/LF,135 | Different RC filter configuration: R11–R14 = 35–65 kΩ (vs. 35–65 kΩ same), but R15 = 3.29–6.11 kΩ (same), and DAT3_PD/DAT3_PU values differ - optimized for alternate SD timing profiles. | Same WLCSP24 footprint and pinout; intended for designs requiring modified EMI filtering on DAT3 lines. | Select IP4352CX24/LF,135 only when application-specific SD timing analysis shows benefit from altered pull-down/pull-up resistor values. |
| TPD3F003DPKR | 3-channel device (vs. 9-channel); 5.5 V breakdown; 12 pF typical capacitance; SOT-563 package (2.1 mm × 1.6 mm) - larger footprint, lower channel density. | Requires three devices to cover full SD bus; lacks integrated WP+CD, CD/SDCD separation, and VSD filtering. | Use TPD3F003DPKR only in legacy designs constrained to SOT-563 assembly processes or where partial SD lane protection suffices. |
Compared with IP4350CX24/LF,135, IP4352CX24/LF,135 offers identical mechanical compatibility but retuned RC values for specific SD timing margins, whereas TPD3F003DPKR requires triple placement and adds 6 extra passives to achieve equivalent coverage - increasing BOM cost and PCB area by >300%.
Availability
IP4350CX24/LF,135 is available at Aetrix Electronics and suitable for mobile handset SD interfaces, digital camera card slots, portable media player storage, embedded card reader modules, and industrial IoT gateways requiring stable component supply and long-term lifecycle support.
Supply support for IP4350CX24/LF,135 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global leader in discrete, logic, and PowerMOS semiconductors, spun off from NXP in 2017 and focused on automotive, industrial, computing, consumer, and wearable markets.
The IP4350CX24/LF,135 belongs to Nexperia's ESD protection portfolio targeting high-density SD memory card interfaces, designed to replace discrete diode-resistor networks with monolithic, wafer-level solutions that reduce PCB area and improve ESD reliability.
FAQ
What is the maximum ESD voltage rating for IP4350CX24/LF,135 on SD data lines?
The IP4350CX24/LF,135 provides ±15 kV air discharge ESD protection on its 9 output terminals (A4, A5, B4, B5, C4, C5, D4, D5, E4, E5) per IEC 61000-4-2 level 4. This rating is verified with 1000 pulses of ±15 kV contact discharge, exceeding the standard requirement. The device achieves this using monolithic rail-to-rail diode clamps integrated into the WLCSP24 die.
Does IP4350CX24/LF,135 support both SD host and SD card side signal conditioning?
Yes, IP4350CX24/LF,135 explicitly supports dual-domain signal conditioning: it provides separate DATA0–DATA3 and SDDATA0–SDDATA3 I/O pairs, distinct CMD/SDCMD and CLK/SDCLK paths, and independent GND_H and GND_C grounds. This architecture isolates host and card signal domains while applying matched ESD protection and RC filtering to both sides - critical for bidirectional SD bus compliance.
How does the WP+CD terminal function in IP4350CX24/LF,135?
The WP+CD terminal (pin D1) in IP4350CX24/LF,135 combines write protect and card detect functions into a single bump. It operates as an open-drain output on the host side and accepts input from the SD card side, enabling simplified routing in space-constrained layouts. This dual-role design eliminates one dedicated pin versus discrete implementations, reducing SD interface complexity without sacrificing functionality.
What is the channel capacitance of IP4350CX24/LF,135 and why does it matter for SD interfaces?
IP4350CX24/LF,135 exhibits ≤8.8 pF channel capacitance on SD data lines (measured at 1 MHz, VI = 0 V), 7.8 pF on CLK/SDCLK, and 37 pF on VSD. This low capacitance preserves signal rise/fall times and prevents data eye closure on high-speed SD buses - especially critical for UHS-I modes where 50 MHz clocks demand minimal added load to maintain setup/hold timing margins.
Is IP4350CX24/LF,135 compatible with lead-free reflow soldering processes?
Yes, IP4350CX24/LF,135 is qualified for lead-free reflow soldering with a peak temperature of 260 °C (per J-STD-020C). Its WLCSP24 package has a thickness of 0.61 mm and volume <350 mm³, placing it in the highest thermal class for lead-free processing. Moisture sensitivity level (MSL) compliance must be observed, and reflow profiles must follow Nexperia's AN10365 guidelines to ensure reliable solder joint formation without bump voiding.
IP4350CX24/LF,135 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 24-WFBGA, WLCSP
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 9
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- -
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- Yes
- Applications:
- Multimedia Card Interface
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -35°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-WLCSP (1.95x2.11)
IP4350CX24/LF,135 FAQ
1.How can I place an order for IP4350CX24/LF,135 through Aetrix?
Please submit a Request for Quotation (RFQ) for IP4350CX24/LF,135 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IP4350CX24/LF,135 reliable?
The price and inventory of IP4350CX24/LF,135 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IP4350CX24/LF,135 is usually 5 days.
3.What payment methods are accepted for IP4350CX24/LF,135?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IP4350CX24/LF,135 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IP4350CX24/LF,135?
IP4350CX24/LF,135 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IP4350CX24/LF,135 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IP4350CX24/LF,135?
For technical support, including IP4350CX24/LF,135 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IP4350CX24/LF,135 requirements.
6.How does Aetrix verify that IP4350CX24/LF,135 is sourced from the original manufacturer or authorized distributors?
All IP4350CX24/LF,135 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IP4350CX24/LF,135 meets industry standards.
7.What is the process for return or replacement of IP4350CX24/LF,135?
All IP4350CX24/LF,135 units undergo pre-shipment inspection (PSI). If there is an issue with IP4350CX24/LF,135, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IP4350CX24/LF,135 part is unused and in its original packaging.
Return procedure for IP4350CX24/LF,135:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IP4350CX24/LF,135 Tags
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ESD9B5.0ST5G
onsemi
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DESD3V3E1BL-7B
Diodes Incorporated
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ESD5Z3.3T1G
onsemi
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D5V0H1B2LP-7B
Diodes Incorporated
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D5V0P1B2LP-7B
Diodes Incorporated
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DESD5V0U1BA-7
Diodes Incorporated
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ESD5Z5.0T1G
onsemi
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DESD5V0U1BB-7
Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
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PESD2V0Y1BSFYL
Nexperia USA Inc.
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DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
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D5V0L1B2WS-7
Diodes Incorporated
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