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Nexperia USA Inc. IP4365CX11/P,135
- Part No.:
- IP4365CX11/P,135
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- 11-UFBGA, WLCSP
- Datasheet:
-
IP4365CX11/P,135.pdf
- Description:
- TVS DIODE 5.5VWM 11WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:2,356
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Product details
Overview
IP4365CX11/P,135 from Nexperia is a monolithic Wafer-Level Chip-Scale Package (WLCSP11) smart card interface device compliant with ISO/IEC 7816-3 (SIM) and ISO/IEC 7816-12 (USIM/USB). It integrates three RC-filtered channels (100 Ω / 100 Ω / 47 Ω), 10 pF channel capacitance, ±15 kV IEC 61000-4-2 contact ESD protection on six pins, and supports USB Full Speed ESD protection for mobile handset SIM/USIM interfaces.
For engineers reviewing the IP4365CX11/P,135 datasheet, IP4365CX11/P,135 pinout, IP4365CX11/P,135 application, or IP4365CX11/P,135 equivalent, this device serves as a miniaturized passive filter array + ESD protection solution for high-density SIM card routing in space-constrained portable electronics - with verified insertion loss suppression from 800 MHz to 3 GHz and crosstalk < −40 dB up to 1 GHz.
Technical Context
The IP4365CX11/P,135 implements three independent RC low-pass filter paths (A1–A3, B1–B3, C1–C3) with integrated series resistors (100 Ω, 100 Ω, 47 Ω) and 10 pF capacitance per channel, targeting RF interference suppression in the 800 MHz–3 GHz band. Its ESD protection diodes are rated for ±15 kV contact discharge on pins A3/B3/C3/D1/D2/D3, exceeding IEC 61000-4-2 Level 4.
It separates ESD robustness domains: six pins (A3, B3, C3, D1, D2, D3) support full-speed USB and USIM card-side protection at ±15 kV, while three baseband-side pins (A1, B1, C1) are rated for ±2 kV - enabling differential routing flexibility and minimizing signal integrity impact on host controller lines.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Protection Level | ±15 kV contact discharge (IEC 61000-4-2) on 6 pins - enables direct card-side connection without external TVS diodes |
| Channel Resistance | 100 Ω / 100 Ω / 47 Ω (R1/R3/R2) - provides impedance matching and transient current limiting for CLK/RST/I/O lines |
| Channel Capacitance | 10 pF (typical) - maintains signal integrity for USB Full Speed (12 Mbps) and SIM clock (up to 5 MHz) |
| Insertion Loss | ≥20 dB attenuation from 800 MHz to 3 GHz - suppresses cellular/WiFi/Bluetooth RF coupling into SIM interface traces |
| Package | WLCSP11 (3 × 4 grid, missing B2 bump) - 0.4 mm pitch, 1.16 mm × 1.56 mm footprint ideal for ultra-thin mobile PCBs |
| Crosstalk | < −40 dB at 1 GHz between adjacent channels - prevents mutual interference among RST/CLK/I/O and USB D+/D−/VBUS |
| Operating Temperature | −35 °C to +85 °C - qualified for consumer handheld and wireless modem environments |
Pinout & Package
Wafer-Level Chip-Scale Package (WLCSP11) with 11 solder bumps arranged in a 3 × 4 grid (B2 position omitted); 0.4 mm pitch; overall dimensions 1.16 mm × 1.56 mm; recommended NSMD PCB pad design with laser-drilled micro-vias to ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | Internal RST or I/O channel (baseband side) | ±2 kV ESD-rated input to baseband processor; connects to RST or I/O line before filtering |
| A2 | Ground | Dedicated GND terminal; must be connected to low-inductance ground plane via micro-via |
| A3 | External RST or I/O channel (card side) | ±15 kV ESD-rated output to SIM/USIM card; paired with A1 through 100 Ω resistor + 10 pF cap |
| B1 | Internal CLK channel (baseband side) | ±2 kV ESD-rated CLK input from baseband; connects to internal oscillator driver |
| B2 | Not connected | Missing bump - no electrical function; mechanical void in WLCSP layout |
| B3 | External CLK channel (card side) | ±15 kV ESD-rated CLK output to SIM/USIM; filtered path with 100 Ω + 10 pF |
| C1 | Internal I/O or RST channel (baseband side) | ±2 kV ESD-rated bidirectional line; supports flexible routing with A1/C3 swap capability |
| C2 | Ground | Second dedicated GND terminal; improves grounding symmetry and reduces loop inductance |
| C3 | External I/O or RST channel (card side) | ±15 kV ESD-rated bidirectional card interface; 47 Ω series resistor optimizes rise/fall time for I/O |
| D1, D2, D3 | External USB/USIM supply or data ESD protection | Three identical ±15 kV ESD-protected terminals - assignable to USB D+, D−, and VSIM/SPU per layout needs |
Key Features
| Feature | Design Value |
|---|---|
| Triple-channel RC filter array | Three independent 100 Ω / 100 Ω / 47 Ω + 10 pF paths enable simultaneous filtering of RST, CLK, and I/O without discrete components |
| USB Full Speed ESD protection | Two dedicated ±15 kV ESD-protected pins (D1/D2) support USB 1.1 D+/D− routing directly to USIM slot |
| Card supply ESD protection | Third ±15 kV protected pin (D3) safeguards VSIM/SPU line against ESD-induced latch-up or overvoltage |
| EMI/RFI suppression bandwidth | Validated ≥20 dB insertion loss from 800 MHz to 3 GHz - blocks LTE/WiFi/Bluetooth harmonics from corrupting SIM signaling |
| Routing flexibility | A1↔A3 and C1↔C3 channels are interchangeable; allows optimized trace routing without sacrificing ESD performance |
Applications
| Mobile Handset SIM Interface | Wireless Modem USIM Integration |
|---|---|
|
Use Scenario: SIM card interface in slim-profile 4G/LTE smartphones with tight board area and aggressive EMI requirements. IC Role / Device Role / Timing Role: Passive RC filter + ESD protector placed between baseband SoC and SIM connector; conditions CLK (5 MHz), RST, and I/O signals while suppressing RF ingress. Use Value: Eliminates need for 9 discrete RC filters + 6 TVS diodes - saves >2.5 mm² PCB area and reduces BOM count by 15 parts. |
Use Scenario: Embedded USIM interface in industrial LTE modems requiring robust operation in noisy RF environments. IC Role / Device Role / Timing Role: Dual-domain protector: baseband-side pins (A1/B1/C1) interface with modem controller; card-side pins (A3/B3/C3/D1–D3) connect to USIM slot and USB interface. Use Value: Enables single-chip protection for both ISO/IEC 7816-3 digital and 7816-12 USB Full Speed protocols - simplifies compliance testing for dual-mode USIM modules. |
| Personal Communication System (PCS) Devices | Compact Wearable Cellular Modules |
|
Use Scenario: SIM interface in cordless DECT phones and PCS handsets where ESD exposure occurs during frequent battery/SIM swaps. IC Role / Device Role / Timing Role: ESD-hardened signal conditioner on RST/CLK/I/O lines; withstands repeated ±15 kV contact discharges without degradation. Use Value: Extends field reliability beyond IEC 61000-4-2 Level 4 - validated for 1000+ ±15 kV pulses, reducing warranty returns from SIM port failures. |
Use Scenario: Miniaturized cellular IoT wearable (e.g., smartwatch) with integrated eSIM/USIM requiring sub-2 mm² protection solution. IC Role / Device Role / Timing Role: Ultra-compact WLCSP11 device placed directly at SIM pad; provides co-located filtering and ESD protection without trace stubs. Use Value: Achieves 1.16 mm × 1.56 mm footprint - 60% smaller than discrete RC+TVS solutions - critical for <100 mm² wearable mainboards. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SIM/USIM interface protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IP4366CX8 | 3-channel EMI/ESD filter only; no USB ESD protection (D1/D2/D3 absent); identical RC values and WLCSP11 package | Lacks USB Full Speed support - suitable only for legacy SIM-only designs without USIM/USB functionality | Select when USB interface is unused and cost optimization is prioritized over dual-protocol support |
| TPD4S012DRBR | 4-channel ±15 kV ESD protector (no integrated RC filtering); SOIC-8 package; requires external 100 Ω resistors | Higher board area (3.0 mm × 3.0 mm vs. 1.16 mm × 1.56 mm); no built-in low-pass filtering - needs external capacitors | Choose only if WLCSP assembly capability is unavailable and discrete RC placement is acceptable |
Compared with IP4365CX11/P,135, IP4366CX8 omits USB protection but matches SIM filtering performance in identical form factor, while TPD4S012DRBR trades integration for package compatibility - making IP4365CX11/P,135 the sole monolithic WLCSP solution combining SIM RC filtering, USIM USB ESD, and 3 GHz RF suppression.
Availability
IP4365CX11/P,135 is available at Aetrix Electronics and suitable for mobile handset design, wireless modem integration, and compact wearable cellular modules requiring stable component supply, long-term lifecycle assurance, and wafer-level packaging compatibility.
Supply support for IP4365CX11/P,135 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global leader in discrete, logic, and PowerMOS semiconductors, formed in 2017 from the former NXP Standard Products division, with core focus on automotive, industrial, computing, and consumer markets.
The IP4365CX11/P,135 belongs to Nexperia's Smart Card Interface Protection product line, engineered specifically to consolidate ESD hardening, EMI filtering, and USB Full Speed compliance into a single WLCSP for next-generation miniaturized cellular devices.
FAQ
What is the maximum operating voltage for IP4365CX11/P,135?
The absolute maximum input voltage is −0.5 V to +5.5 V across all functional pins (A1–C3, D1–D3), with continuous power dissipation limited to 60 mW per channel and 180 mW total at 70 °C ambient. This rating ensures safe operation with standard 3.0 V and 5.0 V SIM/USIM supply rails and baseband I/O voltages.
Can pins A1 and C3 be swapped in PCB layout?
Yes - the datasheet explicitly permits exchanging channel A1↔A3 and C1↔C3 to simplify routing. This flexibility arises from identical RC characteristics (100 Ω + 10 pF for A-path, 47 Ω + 10 pF for C-path) and matched ESD ratings (±2 kV on baseband side, ±15 kV on card side), enabling optimized trace length and layer transitions without performance penalty.
Does IP4365CX11/P,135 support USB 2.0 High-Speed operation?
No - it is specified only for USB Full Speed (12 Mbps), as confirmed by its 10 pF channel capacitance and insertion loss validation up to 3 GHz (aligned with USB 1.1 harmonics). The device lacks the bandwidth and low-capacitance design required for 480 Mbps High-Speed signaling, and its USB protection pins are not characterized for that mode.
Is reflow compatible with standard Pb-free profiles?
Yes - the device is qualified for Pb-free reflow with peak temperature up to 260 °C (10 s max), and supports at least three reflow cycles. Recommended profile includes pre-heat ramp rate of 2.5–4.0 °C/s, soak time of 60–180 s, and time above 217 °C of 30–150 s - fully compliant with IPC/JEDEC J-STD-020D.
IP4365CX11/P,135 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- 11-UFBGA, WLCSP
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- 5
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5.5V
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- Yes
- Applications:
- Multimedia Card Interface
- Capacitance @ Frequency:
- 10pF @ 1MHz
- Operating Temperature:
- -35°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 11-WLCSP (1.56x1.16)
IP4365CX11/P,135 FAQ
1.How can I place an order for IP4365CX11/P,135 through Aetrix?
Please submit a Request for Quotation (RFQ) for IP4365CX11/P,135 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IP4365CX11/P,135 reliable?
The price and inventory of IP4365CX11/P,135 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IP4365CX11/P,135 is usually 5 days.
3.What payment methods are accepted for IP4365CX11/P,135?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IP4365CX11/P,135 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IP4365CX11/P,135?
IP4365CX11/P,135 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IP4365CX11/P,135 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IP4365CX11/P,135?
For technical support, including IP4365CX11/P,135 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IP4365CX11/P,135 requirements.
6.How does Aetrix verify that IP4365CX11/P,135 is sourced from the original manufacturer or authorized distributors?
All IP4365CX11/P,135 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IP4365CX11/P,135 meets industry standards.
7.What is the process for return or replacement of IP4365CX11/P,135?
All IP4365CX11/P,135 units undergo pre-shipment inspection (PSI). If there is an issue with IP4365CX11/P,135, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IP4365CX11/P,135 part is unused and in its original packaging.
Return procedure for IP4365CX11/P,135:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IP4365CX11/P,135 Tags
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ESD9B5.0ST5G
onsemi
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DESD3V3E1BL-7B
Diodes Incorporated
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ESD5Z3.3T1G
onsemi
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D5V0H1B2LP-7B
Diodes Incorporated
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D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
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DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
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D5V0L1B2WS-7
Diodes Incorporated
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