Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies IPA60R099P6XKSA1

Part No.:
IPA60R099P6XKSA1
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-220-3 Full Pack
Datasheet:
AetrixIPA60R099P6XKSA1.pdf
Description:
MOSFET N-CH 600V 37.9A TO220-FP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:318

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

IPA60R099P6XKSA1 from Infineon Technologies is a 600 V, 99 mΩ superjunction MOSFET in TO-220 FullPAK package, optimized for high-efficiency PFC and hard-switching PWM stages. It delivers 32.9 A continuous diode current, 109 A pulsed drain current, and 8.8 µJ output energy at 400 V, enabling compact, cooler-running server power supplies and telecom rectifiers.

For engineers reviewing the IPA60R099P6XKSA1 datasheet, IPA60R099P6XKSA1 pinout, IPA60R099P6XKSA1 application, or IPA60R099P6XKSA1 equivalent, key selection criteria include RDS(on) vs. Qg trade-off (70 nC total gate charge), dv/dt ruggedness (100 V/ns), body diode commutation capability (300 A/µs), and industrial-grade JEDEC qualification.

Technical Context

This CoolMOS™ P6 device implements a charge-compensated superjunction structure with trench-gate design, delivering low RDS(on) × Qg figure-of-merit (FOM) and reduced Eoss. Its gate threshold voltage is tightly specified at 3.5–4.5 V, and plateau voltage remains stable at 6.1 V under 400 V switching conditions.

The integrated body diode supports fast recovery (trr = 470 ns, Qrr = 9 µC) and high di/dt (300 A/µs), making it suitable for resonant topologies where reverse conduction and soft switching are critical. Thermal resistance from junction-to-case is 3.65 °C/W in TO-220FP package.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 600 V - Rated blocking voltage for primary-side switching in 400 V DC bus applications (e.g., PFC, telecom rectifiers).
RDS(on),max 99 mΩ at Tj = 150°C - Enables low conduction loss in high-current, thermally constrained TO-220FP layouts.
Qg,typ 70 nC - Determines gate drive power and switching speed; compatible with standard 13 V gate drivers without excessive losses.
Eoss@400V 8.8 µJ - Reduces turn-on switching loss in hard-switched converters operating near 400 V input.
ID,pulse 109 A - Supports peak load handling in short-duration surge events (e.g., startup, overload) without thermal runaway.
dv/dt ruggedness 100 V/ns - Ensures reliable operation under fast voltage transients in high-noise industrial environments.
Body diode di/dt 300 A/µs - Allows robust commutation in LLC and ZVS-PWM circuits without parasitic turn-on or oscillation.

Pinout & Package

IPA60R099P6XKSA1 is housed in a TO-220 FullPAK (TO-220FP) package with insulated case and creepage-enhanced leadframe. The package provides 2500 Vrms insulation withstand voltage and 50 Ncm mounting torque rating.

Pin/Terminal Circuit Role Design Meaning
Pin 1 (Gate) Control electrode Receives gate drive signal; requires ≤20 V static and ≤30 V dynamic voltage per JEDEC spec.
Pin 2 (Drain) High-voltage power terminal Connected to AC line or high-side switch node; electrically tied to insulated tab in FullPAK.
Pin 3 (Source) Power return and reference Serves as common reference for gate drive and current sensing; low-inductance layout critical for EMI control.

Key Features

Feature Design Value
Superjunction architecture Enables 600 V rating with 99 mΩ RDS(on), reducing conduction loss by ~35% vs. planar MOSFETs of same die size.
Low Eoss and Qg 8.8 µJ Eoss and 70 nC Qg jointly minimize total switching loss in 65–100 kHz PFC stages.
High dv/dt ruggedness 100 V/ns rating prevents false triggering during fast voltage transitions in high-frequency bridge legs.
Industrial-grade qualification Qualified per JESD22-A108 (temperature cycling), J-STD-020 (reflow), and JESD22-A110 (highly accelerated stress test).
Insulated TO-220FP package 2500 Vrms isolation eliminates need for heatsink insulation washers in Class I safety designs.

Applications

Server Power Supply PFC Stage Telecom Rectifier Module

Use Scenario: Active PFC front-end in 1–3 kW redundant server PSUs operating from universal AC input.

IC Role / Device Role / Timing Role: High-side switching element in boost converter topology, switching at 65–100 kHz.

Use Value: 99 mΩ RDS(on) and 8.8 µJ Eoss reduce total losses by 1.2 W vs. prior-gen CoolMOS™ P5, improving efficiency to >98.5% at full load.

Use Scenario: Primary-side switch in 48 V telecom rectifier with hold-up time ≥20 ms.

IC Role / Device Role / Timing Role: Hard-switched PWM transistor in forward or half-bridge configuration.

Use Value: 109 A pulsed current rating and 300 A/µs body diode di/dt support reliable operation during transient overloads and hot-swap events.

LCD TV Backlight Inverter Industrial UPS Inverter Stage

Use Scenario: Resonant half-bridge driver for CCFL or LED backlight in large-format LCD TVs.

IC Role / Device Role / Timing Role: Low-loss switching device in ZVS-controlled resonant tank.

Use Value: 470 ns reverse recovery time and 9 µC Qrr minimize dead-time losses and EMI generation during zero-voltage switching transitions.

Use Scenario: Output H-bridge switch in online double-conversion UPS with 230 V AC output.

IC Role / Device Role / Timing Role: 600 V-rated power switch handling bidirectional current in inverter leg.

Use Value: 150 °C max junction temperature and 100 V/ns dv/dt ruggedness ensure reliability under grid disturbance conditions (e.g., voltage spikes, harmonics).

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage superjunction MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
IPP60R099P6 Same die, TO-220 (non-FullPAK) package; no internal insulation; RthJC = 0.45 °C/W vs. 3.65 °C/W. Requires external heatsink isolation; suited for cost-sensitive, non-safety-critical industrial SMPS. Select when board-level creepage clearance allows uninsulated mounting and thermal budget permits higher case temp rise.
IPW60R099P6 Same die, TO-247 package; higher power dissipation (278 W vs. 34 W); RthJC = 0.45 °C/W; no internal isolation. Used in high-power PFC modules (>5 kW); needs larger PCB area and mechanical mounting provisions. Choose for systems requiring >100 W continuous dissipation and where TO-247 footprint and thermal performance outweigh size constraints.

Compared with IPP60R099P6 and IPW60R099P6, IPA60R099P6 trades lower thermal performance for built-in safety isolation and compact TO-220FP form factor-ideal for space-constrained, safety-certified AC/DC adapters and telecom modules.

Availability

IPA60R099P6XKSA1 is available at Aetrix Electronics and suitable for server power supplies, telecom rectifiers, LCD TV inverters, and industrial UPS systems requiring stable component supply, JEDEC industrial qualification, and reinforced insulation.

Supply support for IPA60R099P6XKSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices.

The CoolMOS™ P6 series was engineered to deliver best-in-class RDS(on) × Qg FOM for 600 V superjunction MOSFETs in high-efficiency, high-density AC/DC and DC/DC conversion systems.

FAQ

What is the maximum continuous drain current for IPA60R099P6XKSA1 at 100°C case temperature?

The maximum continuous drain current is 24.0 A at TC = 100°C, as specified in Table 2 of the Rev. 2.1 datasheet. This rating assumes proper heatsinking and accounts for RDS(on) increase with junction temperature, limiting conduction loss to maintain Tj ≤ 150°C.

Does IPA60R099P6XKSA1 require a negative gate voltage for reliable turn-off?

No. The device specifies a gate-source voltage range of –20 V to +20 V (static) and –30 V to +30 V (dynamic). A gate drive of 0 V to 13 V is sufficient for full enhancement and safe turn-off; negative bias is not required for stability or noise immunity in typical applications.

Can IPA60R099P6XKSA1 be paralleled with identical units without gate resistors?

No. The datasheet explicitly recommends using ferrite beads on each gate or separate totem-pole drivers when paralleling. Without such measures, unequal gate loop inductance can cause dynamic current imbalance and thermal runaway due to positive temperature coefficient of RDS(on).

Is the TO-220FP package of IPA60R099P6XKSA1 compatible with standard TO-220 footprints?

No. Although outline dimensions are similar, the TO-220FP (FullPAK) has an insulated tab and modified lead spacing. Its leads are spaced for surface-mount or through-hole mounting with isolation requirements, and it cannot be substituted into a standard TO-220 land pattern without verifying creepage/clearance and thermal pad layout.

IPA60R099P6XKSA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
CoolMOS™ P6
Package/Case:
TO-220-3 Full Pack
Packaging:
Tube
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
600 V
Current - Continuous Drain (Id) @ 25°C:
37.9A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
99mOhm @ 14.5A, 10V
Vgs(th) (Max) @ Id:
4.5V @ 1.21mA
Gate Charge (Qg) (Max) @ Vgs:
70 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
3330 pF @ 100 V
FET Feature:
-
Power Dissipation (Max):
34W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
PG-TO220-FP

IPA60R099P6XKSA1 FAQ

1.How can I place an order for IPA60R099P6XKSA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for IPA60R099P6XKSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IPA60R099P6XKSA1 reliable?

The price and inventory of IPA60R099P6XKSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPA60R099P6XKSA1 is usually 5 days.

3.What payment methods are accepted for IPA60R099P6XKSA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPA60R099P6XKSA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IPA60R099P6XKSA1?

IPA60R099P6XKSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IPA60R099P6XKSA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IPA60R099P6XKSA1?

For technical support, including IPA60R099P6XKSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPA60R099P6XKSA1 requirements.

6.How does Aetrix verify that IPA60R099P6XKSA1 is sourced from the original manufacturer or authorized distributors?

All IPA60R099P6XKSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPA60R099P6XKSA1 meets industry standards.

7.What is the process for return or replacement of IPA60R099P6XKSA1?

All IPA60R099P6XKSA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPA60R099P6XKSA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IPA60R099P6XKSA1 part is unused and in its original packaging.

Return procedure for IPA60R099P6XKSA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

IPA60R099P6XKSA1 Tags

  • IPA60R099P6XKSA1
  • IPA60R099P6XKSA1 PDF
  • IPA60R099P6XKSA1 Datasheet
  • IPA60R099P6XKSA1 Specifications
  • IPA60R099P6XKSA1 Images
  • Infineon Technologies
  • Infineon Technologies IPA60R099P6XKSA1
  • Buy IPA60R099P6XKSA1
  • IPA60R099P6XKSA1 Price
  • IPA60R099P6XKSA1 Distributor
  • IPA60R099P6XKSA1 Supplier
  • IPA60R099P6XKSA1 Wholesale
Related Products
BSZ180P03NS3EGATMA1
BSZ180P03NS3EGATMA1

Infineon Technologies

SIRA14DP-T1-GE3
SIRA14DP-T1-GE3

Vishay Siliconix

AO4419
AO4419

Alpha & Omega Semiconductor Inc.

SISA14BDN-T1-GE3
SISA14BDN-T1-GE3

Vishay Siliconix

PSMN9R5-30YLC,115
PSMN9R5-30YLC,115

Nexperia USA Inc.

BUK9Y21-40E,115
BUK9Y21-40E,115

Nexperia USA Inc.

RTQ035N03HZGTR
RTQ035N03HZGTR

Rohm Semiconductor

FDMS7680
FDMS7680

onsemi

RQ3E180BNTB
RQ3E180BNTB

Rohm Semiconductor

STL6N2VH5
STL6N2VH5

STMicroelectronics

DMPH4029LFGQ-7
DMPH4029LFGQ-7

Diodes Incorporated

DMT6015LSS-13
DMT6015LSS-13

Diodes Incorporated

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER