Infineon Technologies IPB180N04S4H0ATMA1
- Part No.:
- IPB180N04S4H0ATMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-263-7, D2PAK (6 Leads + Tab)
- Datasheet:
-
IPB180N04S4H0ATMA1.pdf
- Description:
- MOSFET N-CH 40V 180A TO263-7-3
- Quantity:
- Payment:

- Shipping:

Inventory:1,573
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IPB180N04S4H0ATMA1 from Infineon Technologies is an AEC-Q101 qualified N-channel enhancement-mode power MOSFET in PG-TO263-7-3 package, rated for 40 V VDS, 180 A continuous drain current at TC = 100 °C, and ultra-low 0.9–1.1 mΩ RDS(on) at VGS = 10 V. It operates up to 175 °C junction temperature and is 100% avalanche tested for automotive motor control and high-current DC-DC converter applications.
For engineers reviewing the IPB180N04S4H0ATMA1 datasheet, IPB180N04S4H0ATMA1 pinout, IPB180N04S4H0ATMA1 application, or IPB180N04S4H0ATMA1 equivalent, key selection criteria include its 0.6 K/W RthJC, 173–225 nC total gate charge, 13.8–17.9 nF input capacitance, integrated body diode with 73 ns trr, and MSL1 reflow compatibility up to 260 °C.
Technical Context
This OptiMOS®-T2 device uses trench-gate superjunction technology optimized for low conduction and switching losses in high-duty-cycle automotive power stages. Its gate plateau voltage of 5.0 V enables robust drive margin with standard 5-V logic-level controllers, while the 100% single-pulse avalanche rating (EAS = 850 mJ at ID = 90 A) supports unclamped inductive switching in motor phase legs.
The MOSFET features a monolithic integrated Schottky-like body diode with VSD = 0.9–1.3 V at 100 A and Qrr = 108 nC, enabling efficient synchronous rectification and reduced reverse recovery loss in buck converters and H-bridge inverters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 40 V - Maximum blocking voltage for 12 V/24 V automotive battery systems with transient overvoltage margin. |
| RDS(on) | 0.9–1.1 mΩ @ VGS = 10 V - Enables <1.8 W conduction loss at 180 A, critical for thermal management in compact power modules. |
| ID (cont) | 180 A @ TC = 100 °C - Sustains full rated current under under-hood thermal conditions without derating. |
| EAS | 850 mJ @ ID = 90 A - Guarantees ruggedness against inductive kickback in motor driver half-bridges. |
| Qg | 173–225 nC - Determines gate driver power requirement and switching speed trade-off in 100–200 kHz DC-DC designs. |
| tr/tf | 24 ns / 49 ns - Supports fast switching with minimal overlap loss when paired with matched gate drivers. |
| RthJC | 0.6 K/W - Enables direct heatsink mounting for high-power density layouts with predictable thermal resistance. |
Pinout & Package
IPB180N04S4H0ATMA1 is housed in PG-TO263-7-3 (D²PAK-7) surface-mount package with exposed drain pad for thermal performance and 7 terminals: 3 parallel source pins, 1 gate, 1 sense gate, and 2 drain connections (main + Kelvin).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Source) | Main source connection | Primary current return path; three pins paralleled to reduce source inductance and resistive drop. |
| Pin 2 (Source) | Main source connection | Redundant low-inductance source node for high-frequency current loop integrity. |
| Pin 3 (Source) | Main source connection | Third parallel source terminal to support >180 A RMS current with minimal IR drop. |
| Pin 4 (Gate) | Control input | Standard gate drive node; requires 10 V for full enhancement and low RDS(on). |
| Pin 5 (Sense Gate) | Kelvin gate sensing | Provides feedback for gate driver ICs to compensate for gate loop inductance and ensure accurate VGS control. |
| Pin 6 (Drain) | Main power drain | Primary high-current drain path connected to exposed copper pad; electrically tied to Pin 7. |
| Pin 7 (Drain) | Kelvin drain sensing | Low-noise Kelvin connection for current-sense amplifiers or closed-loop protection circuits. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualification | Validated for automotive powertrain and chassis applications per stress test requirements including HTOL, TC, and UHAST. |
| MSL1 reflow rating | Withstands peak solder temperatures up to 260 °C without delamination or parametric shift, enabling standard SMT assembly. |
| 175 °C operating temperature | Supports operation in engine bay environments where ambient exceeds 125 °C, reducing need for forced cooling. |
| Ultra-low RDS(on) | 0.9 mΩ typical reduces conduction loss by >30% vs. prior-generation 40 V MOSFETs, improving system efficiency at high load. |
| Integrated Kelvin source/gate | Enables precise gate voltage control and current sensing independent of high-side switching noise in multi-phase inverters. |
Applications
| Automotive Motor Control | High-Current DC-DC Converters |
|---|---|
Use Scenario: Driving 12 V or 48 V brushed/BLDC motors in EPS, HVAC blowers, and radiator fans. IC Role / Device Role / Timing Role: High-side or low-side power switch in 3-phase inverter leg, handling 150–180 A peak currents with <1 µs dead-time tolerance. Use Value: Low RDS(on) and 100% avalanche rating eliminate external snubbers and improve fault tolerance during stall or short-circuit events. | Use Scenario: Primary switch in 12 V-to-48 V bidirectional DC-DC converters for mild hybrid vehicles. IC Role / Device Role / Timing Role: Synchronous rectifier or main switching FET operating at 100–150 kHz with hard-switched or ZVS topology. Use Value: 0.6 K/W RthJC and Kelvin drain enable stable thermal performance at >5 kW output with minimal heatsink volume. |
| On-Board Charger (OBC) Input Stage | Industrial Battery Management Systems |
Use Scenario: AC-DC PFC boost switch or DC-DC isolation stage in EV on-board chargers. IC Role / Device Role / Timing Role: Fast-switching 40 V power switch handling 100+ A RMS input current with low EMI due to controlled dV/dt. Use Value: Crss = 100–230 pF and Qgd/Qgs ratio < 0.8 suppress Miller-induced shoot-through in high-density PFC modules. | Use Scenario: Cell balancing or main contactor replacement in 48 V telecom and energy storage battery packs. IC Role / Device Role / Timing Role: Solid-state high-current switch replacing mechanical relays, supporting >100,000 cycles with zero arcing. Use Value: 180 A continuous rating and 720 A pulsed capability allow single-device replacement of dual 100 A relays with faster response and diagnostics. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel 40 V power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IPB180N04S4-02 | RDS(on) max = 1.2 mΩ; same package, no sense gate; lower cost. | Lacks Kelvin gate/sense pins; unsuitable for precision gate drive or high-noise motor control. | Select when gate loop inductance is negligible and cost sensitivity outweighs layout complexity. |
| STL220N4F7AG | 40 V, 220 A, RDS(on) = 0.75 mΩ typ; D2PAK-7, no Kelvin source. | Higher current rating but no Kelvin source or sense gate; higher Qg (250 nC). | Prefer for pure current-capacity upgrades where gate drive stability is managed externally. |
Compared with IPB180N04S4H0ATMA1, IPB180N04S4-02 trades Kelvin sensing for cost reduction, while STL220N4F7AG offers higher current headroom at the expense of gate drive complexity and lack of integrated sensing-making the original optimal for noise-sensitive automotive inverter designs requiring precise VGS control.
Availability
IPB180N04S4H0ATMA1 is available at Aetrix Electronics and suitable for automotive motor control, high-current DC-DC conversion, and on-board charger designs requiring stable component supply across extended temperature and lifetime requirements.
Supply support for IPB180N04S4H0ATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global R&D and manufacturing infrastructure.
This device belongs to the OptiMOS®-T2 product line, engineered specifically for high-efficiency, high-reliability automotive power conversion where low RDS(on), ruggedness, and AEC-Q101 compliance are mandatory.
FAQ
What is the maximum allowable gate-source voltage for IPB180N04S4H0ATMA1?
The absolute maximum gate-source voltage is ±20 V. Operation beyond ±15 V risks permanent gate oxide damage. For reliable enhancement, VGS must be ≥6 V; the gate threshold voltage range is 2.0–4.0 V at 180 µA, and the gate plateau occurs at 5.0 V, making 10 V the recommended drive level for minimum RDS(on) and robust noise immunity.
Does IPB180N04S4H0ATMA1 require a gate resistor, and what value is recommended?
Yes-a gate resistor is required to control dV/dt and prevent oscillation. For 100–200 kHz switching with a 2 A gate driver, a 3.5 Ω resistor is validated in the datasheet (td(on) = 44 ns, tr = 24 ns). Lower values increase switching speed but raise EMI risk; higher values reduce losses in gate driver ICs but extend transition times and increase switching loss.
How is the Kelvin source pin used in PCB layout?
The Kelvin source (Pin 1) must be routed separately from high-current source paths to the gate driver's reference ground. It carries only sensing current (<1 mA), so it should connect directly to the driver's source sense input with minimal trace length and no shared vias or planes with power return paths-ensuring accurate VGS regulation despite high di/dt in the main source loop.
Can IPB180N04S4H0ATMA1 replace mechanical relays in battery disconnect units?
Yes-it is rated for 180 A continuous and 720 A pulsed current, with 100% avalanche testing and 175 °C operation, making it suitable for solid-state contactor replacement in 48 V battery systems. Its low RDS(on) yields <2 W conduction loss at 180 A, eliminating arcing and enabling diagnostic current monitoring via Kelvin sense pins.
IPB180N04S4H0ATMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- TO-263-7, D2PAK (6 Leads + Tab)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 40 V
- Current - Continuous Drain (Id) @ 25°C:
- 180A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 1.1mOhm @ 100A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 180µA
- Gate Charge (Qg) (Max) @ Vgs:
- 225 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 17940 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 250W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TO263-7-3
IPB180N04S4H0ATMA1 FAQ
1.How can I place an order for IPB180N04S4H0ATMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IPB180N04S4H0ATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IPB180N04S4H0ATMA1 reliable?
The price and inventory of IPB180N04S4H0ATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPB180N04S4H0ATMA1 is usually 5 days.
3.What payment methods are accepted for IPB180N04S4H0ATMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPB180N04S4H0ATMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IPB180N04S4H0ATMA1?
IPB180N04S4H0ATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IPB180N04S4H0ATMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IPB180N04S4H0ATMA1?
For technical support, including IPB180N04S4H0ATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPB180N04S4H0ATMA1 requirements.
6.How does Aetrix verify that IPB180N04S4H0ATMA1 is sourced from the original manufacturer or authorized distributors?
All IPB180N04S4H0ATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPB180N04S4H0ATMA1 meets industry standards.
7.What is the process for return or replacement of IPB180N04S4H0ATMA1?
All IPB180N04S4H0ATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPB180N04S4H0ATMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPB180N04S4H0ATMA1 part is unused and in its original packaging.
Return procedure for IPB180N04S4H0ATMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IPB180N04S4H0ATMA1 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

