Infineon Technologies IPB60R125CFD7ATMA1
- Part No.:
- IPB60R125CFD7ATMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
IPB60R125CFD7ATMA1.pdf
- Description:
- MOSFET N-CH 600V 18A TO263-3
- Quantity:
- Payment:

- Shipping:

Inventory:345
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IPB60R125CFD7ATMA1 from Infineon Technologies is a 600 V, 125 mΩ ultra-fast body diode CoolMOS™ CFD7 superjunction MOSFET in D²PAK (PG-TO263-3) package, optimized for soft-switching resonant topologies including phase-shift full-bridge (ZVS) and LLC converters. It delivers 36 nC gate charge, 0.47–0.94 µC reverse recovery charge (Qrr), and 1300 A/µs diF/dt ruggedness, enabling high-efficiency, high-power-density server and EV charging power supplies.
For engineers reviewing the IPB60R125CFD7ATMA1 datasheet, IPB60R125CFD7ATMA1 pinout, IPB60R125CFD7ATMA1 application, or IPB60R125CFD7ATMA1 equivalent, this page provides verified technical context, validated pin functions, real-world application mappings, and confirmed alternatives for resonant SMPS design-in.
Technical Context
This MOSFET implements Infineon's CoolMOS™ CFD7 superjunction architecture with optimized charge balancing for reduced Qg (36 nC typ.) and best-in-class Qrr (0.47–0.94 µC). Its ultra-fast body diode supports hard commutation up to 1300 A/µs diF/dt and 70 V/ns reverse dv/dt at Tj = 25°C.
The device features low RDS(on) × Qg (FOM) and RDS(on) × Eoss figures, enabling minimal switching losses in ZVS and LLC operation. Its 1.36 °C/W junction-to-case thermal resistance and 62 °C/W junction-to-ambient rating (minimal PCB) support thermally constrained industrial power designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 600 V maximum blocking voltage - supports primary-side switching in 400 V DC bus telecom/server PSUs |
| RDS(on),max | 125 mΩ at Tj = 150°C - enables low conduction loss in high-current resonant half-bridge legs |
| Qg,typ | 36 nC - reduces gate drive power and enables faster turn-on in high-frequency LLC controllers |
| Qrr | 0.47–0.94 µC - minimizes body diode recovery loss and EMI in zero-voltage switching transitions |
| diF/dt | 1300 A/µs - ensures robust hard commutation without oscillation or failure during synchronous rectification |
| Eoss@400V | 4.1 µJ - lowers capacitive turn-off energy, critical for efficiency in >300 kHz resonant topologies |
| Tj,max | 150°C - qualified per JEDEC for industrial applications with sustained thermal stress |
Pinout & Package
IPB60R125CFD7ATMA1 uses the PG-TO263-3 (D²PAK) surface-mount package with exposed drain tab for enhanced thermal performance. The drain connects directly to the copper pad on PCB for low RthJC (1.36 °C/W).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Gate) | Control terminal | Receives PWM signal; low input capacitance (Ciss = 1503 pF) eases gate driver selection |
| Pin 2 (Drain) + Tab | High-voltage power output | Tab is electrically connected to Pin 2; requires isolated thermal pad and creepage clearance for 600 V |
| Pin 3 (Source) | Reference node / return path | Serves as local ground reference for gate drive; carries full load current and diode reverse recovery current |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-fast body diode | trr = 102–153 ns and Qrr = 0.47–0.94 µC - eliminates need for external SiC/Schottky anti-parallel diodes in ZVS designs |
| Low RDS(on) × Qg FOM | 125 mΩ × 36 nC = 4.5 Ω·nC - enables higher frequency operation without sacrificing conduction or switching loss balance |
| Improved dv/dt ruggedness | 70 V/ns reverse diode dv/dt - prevents false turn-on during high dV/dt commutation in high-side configurations |
| JEDEC industrial qualification | Qualified per JESD47 - ensures reliability under thermal cycling, humidity, and long-term bias stress in 24/7 power systems |
Applications
| Server Power Supply | Telecom Rectifier |
|---|---|
|
Use Scenario: Primary-side switch in 3.3 kW phase-shifted full-bridge (PSFB) PSU for AI server racks. IC Role / Device Role / Timing Role: High-side and low-side switching element operating at 100–200 kHz with ZVS, handling 48 A peak drain current. Use Value: Low Qrr and fast diF/dt prevent shoot-through and reduce dead-time losses, improving system efficiency by ≥0.8% at full load. |
Use Scenario: LLC resonant converter in 48 V telecom rectifier delivering 2.5 kW with <15 mV ripple. IC Role / Device Role / Timing Role: Half-bridge power switch synchronized to resonant tank frequency (250–500 kHz), managing 32 A RMS current. Use Value: Ultra-low Eoss (4.1 µJ) and low Coss nonlinearity minimize capacitive turn-off loss, enabling >97% peak efficiency. |
| EV Onboard Charger | Industrial UPS Inverter |
|
Use Scenario: AC/DC PFC + DC/DC stage in bi-directional 11 kW OBC supporting 400 V/800 V battery architectures. IC Role / Device Role / Timing Role: Active clamp flyback or CLLC switch operating with variable frequency control and soft transition across wide input range. Use Value: 1300 A/µs diF/dt rating ensures reliable commutation during regenerative braking transients without snubber redesign. |
Use Scenario: Three-phase inverter stage in 15 kVA industrial UPS with active front-end and IGBT replacement goal. IC Role / Device Role / Timing Role: 600 V bridge arm switch replacing 650 V IGBTs to reduce conduction loss and enable 20 kHz+ PWM without tail current penalty. Use Value: 125 mΩ RDS(on) at 150°C and 1.36 °C/W RthJC allow 25% smaller heatsink vs. comparable IGBTs in forced-air-cooled enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage resonant switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IPW60R125CFD7 | TO-247-3 through-hole package; identical die, higher RthJA (45 °C/W vs. 35–45 °C/W SMD), no exposed tab | Better suited for prototyping, high-reliability legacy designs, or where mechanical mounting torque >1.2 Ncm is required | Select when thermal interface to heatsink is superior to PCB copper area, or when wave-soldering is preferred over reflow |
| IPP60R125CFD7 | TO-220FP package; same die but lower Ptot (63 W vs. 92 W), higher RthJC (2.2 °C/W), no drain tab | Limited to <1.5 kW applications; unsuitable for high-diF/dt or high-duty-cycle resonant operation | Choose only for cost-sensitive, space-constrained low-power adapters where peak efficiency is secondary to BOM cost |
Compared with IPW60R125CFD7 and IPP60R125CFD7, the IPB60R125CFD7ATMA1 offers optimal thermal performance via its D²PAK drain tab, highest power density among CFD7 variants, and direct compatibility with automated SMT assembly-making it the preferred choice for volume production of compact, high-efficiency resonant converters.
Availability
IPB60R125CFD7ATMA1 is available at Aetrix Electronics and suitable for server power supplies, telecom rectifiers, and EV onboard chargers requiring stable component supply, JEDEC-qualified reliability, and high-volume SMT manufacturability.
Supply support for IPB60R125CFD7ATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and industrial sensors, with core expertise in silicon and SiC power devices.
This part belongs to the CoolMOS™ CFD7 product line-designed specifically for soft-switching resonant topologies like LLC and PSFB, targeting efficiency, power density, and ruggedness in high-reliability AC/DC and DC/DC conversion.
FAQ
Is IPB60R125CFD7ATMA1 pin-compatible with earlier CoolMOS™ CFD2 devices?
No. While both belong to the CoolMOS™ family, CFD7 introduces revised gate charge profile, lower Qrr, and improved diF/dt capability. Pinout is identical (D²PAK-3), but gate drive timing and snubber requirements differ due to faster switching dynamics and reduced Qg. Layout reuse is possible, but gate resistor and driver strength must be re-evaluated.
What is the recommended gate resistor value for ZVS operation at 200 kHz?
Based on datasheet test conditions (RG = 5.3 Ω, VDD = 400 V, ID = 8.1 A), a 4.7–6.8 Ω non-inductive gate resistor is recommended for ZVS in PSFB. Lower values improve turn-on speed but increase ringing risk; ferrite beads are advised for paralleling per Infineon's note. Thermal derating above 100 kHz requires verifying gate driver peak current capability (>2 A).
Does this MOSFET require a negative gate turn-off voltage?
No. The device specifies ±20 V static and ±30 V dynamic gate-source voltage ratings. A standard 0 V to 12 V or 0 V to 15 V gate drive suffices. Negative turn-off is unnecessary due to its robust dv/dt immunity (70 V/ns reverse diode dv/dt) and low Miller capacitance, though it may be used optionally to accelerate turn-off in high-noise environments.
Can IPB60R125CFD7ATMA1 replace IGBTs in a 15 kVA UPS inverter?
Yes-with design adjustments. Its 600 V rating, 125 mΩ RDS(on), and 1300 A/µs diF/dt support IGBT replacement in 20–50 kHz three-phase inverters. However, gate drive must deliver higher peak current (≥3 A), layout must minimize source inductance (<1 nH), and thermal interface must handle 92 W dissipation. Efficiency gains exceed 1.2% at partial load due to absence of tail current.
IPB60R125CFD7ATMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- CoolMOS™ CFD7
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 600 V
- Current - Continuous Drain (Id) @ 25°C:
- 18A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 125mOhm @ 7.8A, 10V
- Vgs(th) (Max) @ Id:
- 4.5V @ 390µA
- Gate Charge (Qg) (Max) @ Vgs:
- 36 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1503 pF @ 400 V
- FET Feature:
- -
- Power Dissipation (Max):
- 92W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TO263-3-2
IPB60R125CFD7ATMA1 FAQ
1.How can I place an order for IPB60R125CFD7ATMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IPB60R125CFD7ATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IPB60R125CFD7ATMA1 reliable?
The price and inventory of IPB60R125CFD7ATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPB60R125CFD7ATMA1 is usually 5 days.
3.What payment methods are accepted for IPB60R125CFD7ATMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPB60R125CFD7ATMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IPB60R125CFD7ATMA1?
IPB60R125CFD7ATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IPB60R125CFD7ATMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IPB60R125CFD7ATMA1?
For technical support, including IPB60R125CFD7ATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPB60R125CFD7ATMA1 requirements.
6.How does Aetrix verify that IPB60R125CFD7ATMA1 is sourced from the original manufacturer or authorized distributors?
All IPB60R125CFD7ATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPB60R125CFD7ATMA1 meets industry standards.
7.What is the process for return or replacement of IPB60R125CFD7ATMA1?
All IPB60R125CFD7ATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPB60R125CFD7ATMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPB60R125CFD7ATMA1 part is unused and in its original packaging.
Return procedure for IPB60R125CFD7ATMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IPB60R125CFD7ATMA1 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

