Infineon Technologies IPB60R160P6ATMA1
- Part No.:
- IPB60R160P6ATMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
IPB60R160P6ATMA1.pdf
- Description:
- MOSFET N-CH 600V 23.8A D2PAK
- Quantity:
- Payment:

- Shipping:

Inventory:2,219
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Product details
Overview
IPB60R160P6ATMA1 from Infineon Technologies is a 600 V, 23.8 A (TC=25°C) superjunction N-channel power MOSFET in D²PAK (TO-263) package, featuring 160 mΩ max RDS(on), 44 nC typical gate charge, and 5.7 µJ Eoss at 400 V - optimized for high-efficiency PFC and hard-switching SMPS in server PSUs and telecom rectifiers.
For engineers reviewing the IPB60R160P6ATMA1 datasheet, IPB60R160P6ATMA1 pinout, IPB60R160P6ATMA1 application, or IPB60R160P6ATMA1 equivalent, key selection criteria include its 100 V/ns dv/dt ruggedness, 500 A/µs body diode commutation capability, low RDS(on) × Qg figure-of-merit, JEDEC industrial-grade qualification, and TO-263 thermal resistance of 0.71 °C/W (junct-to-case).
Technical Context
This CoolMOS™ P6 device implements a superjunction cell structure enabling simultaneous reduction of conduction and switching losses. Its 600 V blocking rating supports universal-input offline converters, while the 6.1 V gate plateau voltage ensures stable turn-on under varying drive conditions.
The MOSFET delivers 497 mJ single-pulse avalanche energy and supports 68 A pulsed drain current, making it suitable for resonant topologies like LLC where overcurrent and voltage transients are common. Its 0.9 V body diode forward voltage at 11.3 A reduces reverse recovery losses in synchronous rectification scenarios.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 600 V - rated for 400 V DC bus applications with 50% margin against line surges in telecom/server AC-DC front-ends |
| RDS(on),max | 160 mΩ - enables <1.5 W conduction loss at 12 A RMS in continuous conduction mode PFC stages |
| Qg,typ | 44 nC - determines gate drive power requirement (~1.8 mW at 100 kHz, VGS=13 V), compatible with standard PWM controllers |
| Eoss@400V | 5.7 µJ - directly reduces turn-off switching loss in hard-switched converters operating above 65 kHz |
| dv/dt ruggedness | 100 V/ns - prevents false turn-on during high-speed switching in half-bridge configurations without snubbers |
| Body diode dI/dt | 500 A/µs - supports fast commutation in ZVS/ZCS circuits and limits reverse recovery stress on gate driver |
| Tj max | 150 °C - allows operation in sealed server chassis with ambient up to 85 °C when mounted on 6 cm² copper area |
Pinout & Package
IPB60R160P6ATMA1 uses the PG-TO263 (D²PAK) surface-mount package with exposed drain tab for thermal and electrical connection. The package features gull-wing leads, RoHS-compliant Pb-free plating, and halogen-free mold compound.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Gate | High-impedance control input requiring <1.7 Ω series resistance to damp ringing; referenced to source |
| Pin 2 & Tab | Drain | Main high-voltage power terminal; tab must be soldered to PCB copper pour for thermal management and low-inductance return path |
| Pin 3 | Source | Power ground reference for gate drive and current sensing; connects to low-side shunt or controller ground plane |
Key Features
| Feature | Design Value |
|---|---|
| Superjunction architecture | Enables 600 V rating with 160 mΩ RDS(on), reducing conduction loss by 35% vs. planar MOSFETs at same die size |
| Low Eoss and Qg | 5.7 µJ Eoss + 44 nC Qg yields 129 µJ/nC FoM - improves efficiency in 100–300 kHz PFC and LLC designs |
| High dv/dt immunity | 100 V/ns rating eliminates need for external gate clamping in bridge-leg layouts with fast SiC/GaN drivers |
| Industrial qualification | JEDEC J-STD-020 MSL1 and JESD22-A108 qualified - supports reflow-only assembly and 15-year field reliability in telecom infrastructure |
| Body diode performance | 350 ns trr, 5.3 µC Qrr, and 500 A/µs dI/dt enable use in quasi-resonant flyback without external Schottky assist |
Applications
| Server Power Supply PFC Stage | Telecom Rectifier Module |
|---|---|
Use Scenario: Active boost PFC in 3 kW redundant server PSU with universal AC input (90–264 VAC). IC Role / Device Role / Timing Role: High-side switch in continuous conduction mode (CCM) boost converter operating at 65–100 kHz. Use Value: 160 mΩ RDS(on) and 5.7 µJ Eoss reduce total losses by 1.2 W vs. prior-gen CoolMOS™ P5, enabling >96% efficiency at full load. |
Use Scenario: Primary-side switch in 1.5 kW telecom rectifier with hold-up time >20 ms. IC Role / Device Role / Timing Role: Hard-switched PWM transistor in phase-shifted full-bridge topology at 100 kHz. Use Value: 100 V/ns dv/dt ruggedness prevents spurious turn-on during zero-voltage switching transitions, eliminating gate driver overdesign. |
| LCD TV Backlight Inverter | Industrial UPS Inverter Stage |
Use Scenario: Resonant half-bridge driving CCFL or LED backlight in 42-inch LCD TV power board. IC Role / Device Role / Timing Role: Low-side switch in LLC resonant converter with variable frequency control (150–500 kHz). Use Value: 500 A/µs body diode dI/dt withstands rapid commutation during zero-current switching, reducing EMI filter size by 30%. |
Use Scenario: Output H-bridge switch in 5 kVA online UPS inverter stage with battery backup. IC Role / Device Role / Timing Role: 600 V output stage MOSFET handling 230 VAC sine-wave synthesis with 3rd-harmonic injection. Use Value: 497 mJ single-pulse avalanche energy absorbs line transients during grid fault events without failure, meeting IEC 62040-1. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IPW60R160P6 | Same silicon, TO-247 package with lower RthJC (0.71 °C/W) but through-hole mounting | Better thermal performance in forced-air cooled industrial SMPS; not suitable for SMT-only production | Select when board-level airflow ≥2 m/s is available and manual assembly is acceptable |
| IPP60R160P6 | Same silicon, TO-220 package with higher RthJC (0.71 °C/W) but lower cost and smaller footprint | Limited to <1.2 kW PFC due to lower power dissipation (176 W vs. 176 W at TC=25°C, but derated faster) | Select for cost-sensitive adapter or lighting applications where peak power ≤800 W |
Compared with IPW60R160P6 and IPP60R160P6, IPB60R160P6ATMA1 offers optimal balance of SMT manufacturability, thermal performance (0.71 °C/W RthJC), and board space efficiency - making it preferred for high-density server and telecom power modules where automated assembly and thermal density are critical.
Availability
IPB60R160P6ATMA1 is available at Aetrix Electronics and suitable for server power supply PFC stages, telecom rectifier modules, and industrial UPS inverter stages requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for IPB60R160P6ATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices, with global manufacturing and R&D centers.
The CoolMOS™ P6 product line was engineered specifically for high-efficiency, high-power-density offline power conversion - targeting datacenter, telecom, and industrial SMPS where reduced conduction and switching losses directly improve system thermal design and energy certification compliance.
FAQ
What is the maximum continuous drain current for IPB60R160P6ATMA1 at 100°C case temperature?
The maximum continuous drain current is 15.0 A at TC = 100°C, as specified in Table 2 of the Rev. 2.2 datasheet. This rating is thermally limited by junction temperature (Tj ≤ 150°C) and assumes proper PCB copper area (6 cm² drain pad) and no forced airflow. Derating curves in Diagram 1 confirm linear reduction from 23.8 A at 25°C to 15.0 A at 100°C.
Does IPB60R160P6ATMA1 require a gate resistor for stability in hard-switching applications?
Yes - a 1.7 Ω gate resistor is used in the datasheet's switching time test circuit (Table 11), and application notes recommend 1.5–2.2 Ω to suppress oscillation and limit peak gate current. Lower values risk ringing and EMI; higher values increase switching losses. Ferrite beads are advised only when paralleling multiple devices.
Can IPB60R160P6ATMA1 replace older CoolMOS™ P5 devices in existing designs?
Yes - it is a direct drop-in replacement for IPB60R160P5 in D²PAK, with identical pinout, voltage rating, and RDS(on). Key improvements include 15% lower Eoss, 10% lower Qg, and enhanced dv/dt ruggedness. No layout or drive circuit changes are required, though efficiency gains may allow downsizing heatsinks.
What is the recommended PCB layout practice for the drain tab of IPB60R160P6ATMA1?
The drain tab must be soldered to a minimum 6 cm² copper area on the top layer, connected via ≥6 thermal vias (0.3 mm diameter) to inner-layer ground or power planes. Avoid narrow traces between tab and copper pour - use solid fill. Thermal relief is prohibited; the tab serves both electrical and thermal functions, and insufficient copper increases RthJC beyond 0.71 °C/W.
IPB60R160P6ATMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- CoolMOS™ P6
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 600 V
- Current - Continuous Drain (Id) @ 25°C:
- 23.8A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 160mOhm @ 9A, 10V
- Vgs(th) (Max) @ Id:
- 4.5V @ 750µA
- Gate Charge (Qg) (Max) @ Vgs:
- 44 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2080 pF @ 100 V
- FET Feature:
- -
- Power Dissipation (Max):
- 176W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TO263-3
IPB60R160P6ATMA1 FAQ
1.How can I place an order for IPB60R160P6ATMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IPB60R160P6ATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IPB60R160P6ATMA1 reliable?
The price and inventory of IPB60R160P6ATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPB60R160P6ATMA1 is usually 5 days.
3.What payment methods are accepted for IPB60R160P6ATMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPB60R160P6ATMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IPB60R160P6ATMA1?
IPB60R160P6ATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IPB60R160P6ATMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IPB60R160P6ATMA1?
For technical support, including IPB60R160P6ATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPB60R160P6ATMA1 requirements.
6.How does Aetrix verify that IPB60R160P6ATMA1 is sourced from the original manufacturer or authorized distributors?
All IPB60R160P6ATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPB60R160P6ATMA1 meets industry standards.
7.What is the process for return or replacement of IPB60R160P6ATMA1?
All IPB60R160P6ATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPB60R160P6ATMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPB60R160P6ATMA1 part is unused and in its original packaging.
Return procedure for IPB60R160P6ATMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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