Infineon Technologies IPD60R650CEAUMA1
- Part No.:
- IPD60R650CEAUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
IPD60R650CEAUMA1.pdf
- Description:
- CONSUMER
- Quantity:
- Payment:

- Shipping:

Inventory:2,496
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Product details
Overview
IPD60R650CEAUMA1 from Infineon Technologies is a 600 V, 9.9 A superjunction N-channel MOSFET in DPAK (PG-TO252) package, featuring RDS(on) = 650 mΩ max at VGS = 10 V and Qg = 20.5 nC typ. It delivers low Eoss (1.9 µJ @ 400 V), high commutation ruggedness, and is optimized for cost-sensitive PFC and hard-switching PWM stages in indoor lighting and adapter power supplies.
For engineers reviewing the IPD60R650CEAUMA1 datasheet, IPD60R650CEAUMA1 pinout, IPD60R650CEAUMA1 application, or IPD60R650CEAUMA1 equivalent, key selection criteria include its 600 V VDS, 650 mΩ RDS(on), 20.5 nC gate charge, 1.52 °C/W RthJC, and DPAK thermal performance under PCB-constrained cooling.
Technical Context
This CoolMOS™ CE device implements superjunction architecture to achieve ultra-low figure-of-merit (RDS(on) × Qg) while maintaining robust dv/dt ruggedness (50 V/ns) and reverse diode commutation capability (500 A/µs). Its gate threshold voltage (2.5–3.5 V) ensures stable turn-on with standard 10 V gate drivers.
The MOSFET supports both unidirectional switching and synchronous rectification roles, with validated avalanche energy rating (EAS = 133 mJ) and reverse recovery parameters (Qrr = 2.1 µC, trr = 250 ns) enabling reliable operation in discontinuous conduction mode (DCM) PFC and resonant topologies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 600 V - Withstands full mains rectified voltage in universal-input offline SMPS without derating. |
| RDS(on) max | 650 mΩ @ VGS = 10 V, Tj = 25°C - Enables <1.5 W conduction loss at 9.9 A DC, suitable for compact heatsink designs. |
| Qg typ | 20.5 nC - Low gate drive power requirement; compatible with standard 1 A peak gate drivers. |
| Eoss | 1.9 µJ @ 400 V - Reduces turn-off switching loss in high-frequency PFC (>70 kHz) and LLC converters. |
| RthJC | 1.52 °C/W - Enables 82 W continuous power dissipation at TC = 25°C on minimal PCB copper footprint. |
| trr | 250 ns - Limits reverse recovery current overshoot during hard-switched transitions, reducing EMI risk. |
Pinout & Package
DPAK (PG-TO252) package with exposed drain pad for thermal enhancement; surface-mount, single-row 3-pin configuration.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Left) | Gate | Control terminal requiring ≤20 V absolute max; low input capacitance (Ciss = 440 pF) eases layout. |
| Pin 2 (Middle) + Tab | Drain | Main high-voltage power path; tab is electrically connected to drain and serves as primary thermal interface to PCB. |
| Pin 3 (Right) | Source | Reference node for gate drive and current sensing; connects to power ground or low-side shunt resistor. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low FOM (RDS(on) × Qg) | 13.3 Ω·nC - Delivers best-in-class efficiency vs. cost trade-off for consumer-grade 65–150 W adapters. |
| High commutation ruggedness | dv/dt = 50 V/ns, dif/dt = 500 A/µs - Survives fast transient stress in bridge-leg configurations without snubbers. |
| Halogen-free & Pb-free | RoHS-compliant plating and mold compound - Meets IEC 61249-2-21 and JEDEC J-STD-020 standards for lead-free reflow. |
| Standard-grade qualification | Tj = −40 to +150°C, Tstg = −40 to +150°C - Validated for industrial ambient and thermally aggressive enclosure environments. |
Applications
| LED Driver Power Stage | AC-DC Adapter Primary Switch |
|---|---|
|
Use Scenario: High-efficiency, low-cost constant-current LED driver for indoor downlights operating from universal AC input (90–264 VAC). IC Role / Device Role / Timing Role: Primary-side hard-switching MOSFET in flyback or quasi-resonant topology, switching at 65–100 kHz. Use Value: 650 mΩ RDS(on) and 1.9 µJ Eoss enable >90% efficiency at 30 W output while meeting Class C conducted EMI limits. |
Use Scenario: Compact 65 W laptop adapter with active PFC front-end and LLC resonant secondary stage. IC Role / Device Role / Timing Role: Boost switch in continuous conduction mode (CCM) PFC controller, operating at fixed 65 kHz. Use Value: Low Qg (20.5 nC) reduces gate driver losses; 133 mJ EAS withstands line surge events without failure. |
| PC Silver Box PSU | LCD TV Power Supply |
|
Use Scenario: Entry-level ATX power supply with active PFC and forward converter main stage. IC Role / Device Role / Timing Role: PFC boost switch handling 300–400 V DC bus, rated for 9.9 A continuous current. Use Value: 1.52 °C/W RthJC allows direct mounting to small aluminum heatsink, eliminating need for thermal interface pads. |
Use Scenario: 120 W open-frame power supply for 32-inch LCD TV with dual-output (12 V/24 V) and standby regulation. IC Role / Device Role / Timing Role: Main switch in half-bridge resonant converter, operating in ZVS condition above 200 kHz. Use Value: 250 ns trr and 2.1 µC Qrr minimize body-diode conduction loss during dead-time, improving light-load efficiency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP6N60DM6 | RDS(on) = 650 mΩ (same), but Qg = 25 nC (22% higher); no specified Eoss value in datasheet. | Lower switching efficiency in high-frequency PFC due to higher gate charge; requires stronger gate driver. | Prefer when gate drive strength exceeds 1.5 A and thermal margin is ample; avoid in space-constrained adapters. |
| FDPF6N60NZ | RDS(on) = 650 mΩ (same), but RthJC = 2.0 °C/W (32% worse); TO-220FP package instead of DPAK. | Requires larger heatsink or forced air cooling; incompatible with SMT-only assembly lines. | Select only if through-hole assembly is mandated and board real estate is not constrained. |
Compared with STP6N60DM6 and FDPF6N60NZ, IPD60R650CEAUMA1 offers superior thermal resistance (1.52 vs. ≥2.0 °C/W), lower gate charge (20.5 vs. ≥25 nC), and documented Eoss-making it optimal for compact, high-efficiency SMT-based power supplies targeting consumer lighting and adapter markets.
Availability
IPD60R650CEAUMA1 is available at Aetrix Electronics and suitable for indoor lighting drivers, AC-DC adapters, and PC silver box power supplies requiring stable component supply, long-term lifecycle support, and RoHS-compliant manufacturing.
Supply support for IPD60R650CEAUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global R&D and wafer fabrication facilities.
This device belongs to the CoolMOS™ CE family-a cost-optimized superjunction MOSFET platform targeting high-efficiency, price-sensitive offline power conversion in consumer and lighting applications.
FAQ
What is the maximum continuous drain current for IPD60R650CEAUMA1 at 100°C case temperature?
The maximum continuous drain current is 6.2 A at TC = 100°C, as specified in Table 2 of the datasheet. This derating reflects thermal limitations of the DPAK package under realistic board-level cooling conditions, not silicon capability alone.
Does IPD60R650CEAUMA1 support paralleling in high-current designs?
Yes, but with specific layout requirements: ferrite beads must be placed on each gate line, and separate totem-pole drivers are recommended to ensure balanced gate voltage rise/fall times and prevent current imbalance during switching transitions.
Is the drain tab electrically isolated from the PCB in the DPAK package?
No-the drain tab is internally connected to Pin 2 and is electrically active at drain potential. It must be routed on a dedicated high-voltage copper pour with adequate creepage/clearance (≥4 mm) and cannot be grounded or connected to any other net.
What is the safe operating area (SOA) limitation at 80°C case temperature for pulsed operation?
At TC = 80°C, the SOA curve (Diagram 7) limits single-pulse ID to 4.5 A at VDS = 400 V for pulse widths up to 100 µs. Beyond that, thermal saturation restricts operation to lower current or shorter pulses to avoid junction overheating.
IPD60R650CEAUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- CoolMOS™ CE
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 600 V
- Current - Continuous Drain (Id) @ 25°C:
- 9.9A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 650mOhm @ 2.4A, 10V
- Vgs(th) (Max) @ Id:
- 3.5V @ 200µA
- Gate Charge (Qg) (Max) @ Vgs:
- 20.5 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 440 pF @ 100 V
- FET Feature:
- -
- Power Dissipation (Max):
- 82W (Tc)
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TO252-3-344
IPD60R650CEAUMA1 FAQ
1.How can I place an order for IPD60R650CEAUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IPD60R650CEAUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IPD60R650CEAUMA1 reliable?
The price and inventory of IPD60R650CEAUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPD60R650CEAUMA1 is usually 5 days.
3.What payment methods are accepted for IPD60R650CEAUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPD60R650CEAUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IPD60R650CEAUMA1?
IPD60R650CEAUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IPD60R650CEAUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IPD60R650CEAUMA1?
For technical support, including IPD60R650CEAUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPD60R650CEAUMA1 requirements.
6.How does Aetrix verify that IPD60R650CEAUMA1 is sourced from the original manufacturer or authorized distributors?
All IPD60R650CEAUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPD60R650CEAUMA1 meets industry standards.
7.What is the process for return or replacement of IPD60R650CEAUMA1?
All IPD60R650CEAUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPD60R650CEAUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPD60R650CEAUMA1 part is unused and in its original packaging.
Return procedure for IPD60R650CEAUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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