Infineon Technologies IPD60R800CEAUMA1
- Part No.:
- IPD60R800CEAUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
IPD60R800CEAUMA1.pdf
- Description:
- CONSUMER
- Quantity:
- Payment:

- Shipping:

Inventory:2,497
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IPD60R800CEAUMA1 from Infineon Technologies is a 600 V, 800 mΩ superjunction N-channel MOSFET in DPAK (PG-TO252) package, optimized for high-efficiency PFC and hard-switching SMPS stages. It delivers 8.4 A continuous drain current at TC = 25°C, 17.2 nC total gate charge, and 1.6 µJ output switching energy at 400 V - enabling compact, cost-sensitive lighting and adapter designs.
For engineers reviewing the IPD60R800CEAUMA1 datasheet, IPD60R800CEAUMA1 pinout, IPD60R800CEAUMA1 application, or IPD60R800CEAUMA1 equivalent, key selection criteria include RDS(on) vs. temperature stability, Eoss-driven ZVS capability, commutation ruggedness (500 A/µs di/dt), and thermal resistance (RthJC = 1.70 °C/W) for PCB-constrained cooling.
Technical Context
This CoolMOS™ CE device implements a superjunction cell structure with optimized charge balance for low RDS(on) × Qg figure-of-merit (FOM) and reduced Eoss. Its gate threshold voltage (2.5–3.5 V) and plateau voltage (5.4 V) support standard 10–13 V gate drivers without level-shifting.
The integrated body diode exhibits 250 ns reverse recovery time and 1.8 µC Qrr at 400 V, enabling reliable operation in discontinuous conduction mode (DCM) PFC and resonant topologies. dv/dt ruggedness is rated at 50 V/ns for low-side switching and 15 V/ns for reverse diode commutation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 600 V - supports 400 V DC bus with 50% margin for surge and ringing in offline SMPS. |
| RDS(on),max | 800 mΩ at Tj = 25°C - enables <8.4 A continuous conduction with ≤6.7 W conduction loss at 25°C case temp. |
| Qg,typ | 17.2 nC - determines gate drive power and switching speed; compatible with standard 1-A peak drivers. |
| Eoss@400V | 1.6 µJ - directly impacts turn-on loss in ZVS circuits; enables >100 kHz operation in LLC resonant converters. |
| ID,pulse | 15.7 A - supports short-term overload handling in adapter burst-mode or PFC overcurrent events. |
| RthJC | 1.70 °C/W - allows 74 W power dissipation at TC = 25°C; requires ≥6 cm² copper pour for thermal management. |
Pinout & Package
IPD60R800CEAUMA1 uses the DPAK (PG-TO252) surface-mount package with exposed drain tab on the underside for thermal conduction. The package is RoHS-compliant, halogen-free, and qualified for standard-grade industrial applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Gate) | Control electrode | Receives gate drive signal; 11 Ω internal gate resistance limits dV/dt-induced oscillation. |
| Pin 2 (Drain) | High-voltage power terminal | Connected to PCB drain copper pour; electrically and thermally coupled to exposed metal tab. |
| Pin 3 (Source) | Reference node / return path | Serves as local ground reference for gate driver; carries full load current and diode reverse recovery current. |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(on) × Qg FOM | Enables high efficiency at 65–100 kHz without sacrificing gate drive simplicity or layout sensitivity. |
| High commutation ruggedness | Rated for 500 A/µs di/dt and 50 V/ns dv/dt - supports reliable operation in hard-switched flyback and forward converters. |
| Optimized body diode | 250 ns trr and low Qrr reduce reverse recovery losses in DCM PFC and quasi-resonant topologies. |
| Pb-free plating & halogen-free mold compound | Meets JEDEC MSL3 reflow requirements and environmental compliance for global consumer electronics manufacturing. |
Applications
| LED Driver Power Stage | PC Silverbox PFC |
|---|---|
|
Use Scenario: Constant-current LED driver operating from universal AC input with active PFC front-end. IC Role / Device Role / Timing Role: High-side switch in boost PFC stage, switching at 65–133 kHz with critical conduction mode control. Use Value: 800 mΩ RDS(on) and 1.6 µJ Eoss enable >95% PFC efficiency at 100 W while minimizing heatsink size. |
Use Scenario: 300–500 W ATX PC power supply with two-stage conversion (PFC + LLC). IC Role / Device Role / Timing Role: Primary-side switch in continuous conduction mode (CCM) boost PFC controller. Use Value: 15.7 A pulse rating and 72 mJ single-pulse avalanche energy ensure robustness during line surges and startup transients. |
| LCD TV Backlight Inverter | USB-C PD Adapter |
|
Use Scenario: High-voltage DC-DC stage powering CCFL or edge-lit LED backlights in 32–55″ LCD TVs. IC Role / Device Role / Timing Role: Main switch in asymmetrical half-bridge or flyback converter operating up to 100 kHz. Use Value: 50 V/ns dv/dt ruggedness prevents false turn-on during high dV/dt transitions across transformer leakage inductance. |
Use Scenario: 65 W GaN-assisted or all-Si USB-C PD fast charger with active clamp flyback or QR topology. IC Role / Device Role / Timing Role: Primary switch in quasi-resonant flyback with valley switching. Use Value: Low Eoss and fast turn-off (62 ns total) reduce switching loss and improve light-load efficiency compliance with DoE Level VI. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IPD60R600CE | RDS(on) = 600 mΩ (lower conduction loss), Qg = 22.5 nC (higher drive demand), same package and voltage rating. | Better suited for fixed-frequency CCM PFC where conduction loss dominates; less optimal for high-frequency QR designs due to higher Eoss. | Select when thermal headroom is limited and gate drive capability supports higher Qg. |
| STP60N6F6 | 600 V, 0.6 Ω, TO-220 package, higher RthJC (1.5 °C/W), no Eoss spec, slower tr/tf. | Designed for legacy hard-switched SMPS; lacks CoolMOS™ CE's ZVS-enabling Eoss and di/dt ruggedness. | Consider only for cost-driven replacements where layout and thermal design are unchanged and frequency ≤65 kHz. |
Compared with IPD60R600CE and STP60N6F6, IPD60R800CEAUMA1 offers the best balance of low gate charge (17.2 nC), ultra-low Eoss (1.6 µJ), and proven commutation ruggedness - making it optimal for space-constrained, high-frequency adapters and lighting drivers where both efficiency and reliability are critical.
Availability
IPD60R800CEAUMA1 is available at Aetrix Electronics and suitable for LED driver power stages, PC silverbox PFC modules, and LCD TV backlight inverters requiring stable component supply and long-term industrial availability.
Supply support for IPD60R800CEAUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices.
The CoolMOS™ CE series was developed to deliver price-performance leadership in 600 V superjunction MOSFETs for cost-sensitive consumer and lighting applications without compromising efficiency or ruggedness.
FAQ
What is the maximum junction temperature rating for IPD60R800CEAUMA1?
The absolute maximum operating junction temperature is 150°C, with derated continuous drain current (5.3 A) at TC = 100°C. Thermal design must maintain Tj ≤ 150°C under worst-case ambient and power dissipation conditions, using the specified RthJC = 1.70 °C/W and PCB copper area guidelines.
Can IPD60R800CEAUMA1 be used in parallel configurations?
Yes, but Infineon recommends gate ferrite beads or individual totem-pole drivers per device to suppress gate oscillation and ensure current sharing. Layout symmetry, matched gate trace lengths, and Kelvin source routing are mandatory; paralleling increases total Qg and requires proportionally higher gate drive current capability.
Does this MOSFET have avalanche capability, and how is it rated?
It is rated for 72 mJ single-pulse avalanche energy (EAS) at ID = 1 A and VDD = 50 V, and 0.17 mJ repetitive avalanche energy (EAR). These ratings assume proper SOA adherence and are validated per JEDEC JESD24-11; sustained avalanche operation is not recommended.
Is IPD60R800CEAUMA1 suitable for zero-voltage switching (ZVS) topologies?
Yes - its 1.6 µJ Eoss at 400 V and low Coss (27 pF) enable efficient ZVS in LLC and active-clamp flyback converters. The device's 50 V/ns dv/dt rating ensures robustness during resonant transitions, and its 250 ns trr minimizes diode-related losses in half-bridge configurations.
IPD60R800CEAUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- CoolMOS™ CE
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 600 V
- Current - Continuous Drain (Id) @ 25°C:
- 8.4A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 800mOhm @ 2A, 10V
- Vgs(th) (Max) @ Id:
- 3.5V @ 170µA
- Gate Charge (Qg) (Max) @ Vgs:
- 17.2 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 373 pF @ 100 V
- FET Feature:
- -
- Power Dissipation (Max):
- 74W (Tc)
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TO252-3-344
IPD60R800CEAUMA1 FAQ
1.How can I place an order for IPD60R800CEAUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IPD60R800CEAUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IPD60R800CEAUMA1 reliable?
The price and inventory of IPD60R800CEAUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPD60R800CEAUMA1 is usually 5 days.
3.What payment methods are accepted for IPD60R800CEAUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPD60R800CEAUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IPD60R800CEAUMA1?
IPD60R800CEAUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IPD60R800CEAUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IPD60R800CEAUMA1?
For technical support, including IPD60R800CEAUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPD60R800CEAUMA1 requirements.
6.How does Aetrix verify that IPD60R800CEAUMA1 is sourced from the original manufacturer or authorized distributors?
All IPD60R800CEAUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPD60R800CEAUMA1 meets industry standards.
7.What is the process for return or replacement of IPD60R800CEAUMA1?
All IPD60R800CEAUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPD60R800CEAUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPD60R800CEAUMA1 part is unused and in its original packaging.
Return procedure for IPD60R800CEAUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IPD60R800CEAUMA1 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

