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Infineon Technologies IPDQ60T040S7AXTMA1

Part No.:
IPDQ60T040S7AXTMA1
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
22-PowerBSOP Module
Datasheet:
AetrixIPDQ60T040S7AXTMA1.pdf
Description:
AUTOMOTIVE_COOLMOS
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:750

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Product details

Overview

IPDQ60T040S7AXTMA1 from Infineon is a 600 V, 40 mΩ CoolMOS™ S7TA superjunction MOSFET with integrated temperature sensor (TS), optimized for static switching and high-current low-frequency applications such as HV eFuse and on-board charger disconnect switches. It features RDS(on) = 40 mΩ (max), Qg = 83 nC (typ), VSD = 0.82 V, pulsed drain current of 203 A, and AEC-Q101 qualification.

For engineers reviewing the IPDQ60T040S7AXTMA1 datasheet, IPDQ60T040S7AXTMA1 pinout, IPDQ60T040S7AXTMA1 application, or IPDQ60T040S7AXTMA1 equivalent, key selection criteria include junction temperature sensing accuracy, pulsed current capability under 150 °C Tj, gate drive robustness at ±30 V, and thermal resistance RthJC = 0.46 °C/W for high-power PCB mounting.

Technical Context

This device implements a silicon-based superjunction MOSFET architecture with embedded forward-biased temperature-sensing diode (TS pin) monolithically integrated in the die. The TS diode provides linear voltage vs. junction temperature response (TC ≈ 5.6 mV/K) with ±0.1 V accuracy over 25–175 °C, enabling real-time thermal protection without external sensors.

It operates in hard-switched, low-duty-cycle applications where conduction losses dominate; its 0.040 Ω RDS(on) minimizes I²R heating, while its 203 A pulsed ID rating and 156 mJ single-pulse avalanche energy support robust fault handling in DC circuit breakers and HV eDisconnect systems.

Key Specifications

ParameterValue and Actual Design Meaning
RDS(on), max40 mΩ at VGS = 12 V, ID = 13 A, Tj = 25 °C - enables low conduction loss in high-current static switch designs
Qg, typ83 nC at VDD = 300 V, ID = 13 A - determines gate driver power requirement and switching speed trade-off
VBR(DSS)600 V - supports blocking in 400–600 V DC bus applications including EV on-board chargers and industrial rectifiers
Tj max150 °C continuous, 175 °C short-term (≤50 h) - defines thermal derating envelope for sustained operation
RthJC0.46 °C/W - allows direct heatsink mounting via exposed tab for efficient thermal path in high-power modules
VSD0.82 V at IF = 13 A, Tj = 25 °C - specifies body diode forward drop for freewheeling or bidirectional conduction paths
dv/dt ruggedness20 V/ns - ensures immunity to parasitic turn-on during high-speed voltage transients in high-voltage switching nodes

Pinout & Package

IPDQ60T040S7AXTMA1 uses PG-HDSOP-22 package with exposed copper drain tab (pins 12–22 + tab) for thermal and electrical connection. Gate (pins 1–2), driver source (pin 4), power source (pins 5–11), and temperature sensor (pin 3) are electrically isolated per functional domain.

Pin/TerminalCircuit RoleDesign Meaning
Pins 1–2Gate inputLow-impedance control node requiring stable ±30 V drive; RG placement recommended on Driver Source (pin 4) side
Pin 3Temperature sensor anodeForward-biased diode output for junction temperature monitoring; requires constant-current bias (5–500 µA)
Pin 4Driver sourceReference for gate driver IC return path; not interchangeable with power source (pins 5–11)
Pins 5–11Power sourceMain source terminal for load current return; must be routed separately from driver source to avoid noise coupling
Pins 12–22 + TabDrainHigh-voltage drain connection and primary thermal interface; tab must be soldered to heatsink or copper plane

Key Features

FeatureDesign Value
Integrated temperature sensorMonolithic diode with ±0.1 V VF accuracy across 25–175 °C, eliminating need for external thermistors or RTDs
Optimized for static switchingLow RDS(on) and high pulse current (203 A) enable reliable HV contactor replacement in eFuse and DC breaker applications
AEC-Q101 qualifiedValidated for automotive-grade reliability including temperature cycling, HTRB, and ESD (HBM Class 2), supporting EV traction and charging systems
Enhanced dv/dt immunity20 V/ns rated ruggedness reduces risk of false turn-on in noisy high-voltage environments like onboard chargers and line rectifiers

Applications

DC Circuit BreakerHV eDisconnect Switch

Use Scenario: High-voltage DC isolation in battery management systems during fault conditions or maintenance.

IC Role / Device Role / Timing Role: Main power semiconductor acting as solid-state contactor with fast, controlled turn-off and thermal shutdown via integrated TS pin.

Use Value: Enables <100 ms fault clearing with precise Tj monitoring, reducing reliance on mechanical relays and improving system MTBF.

Use Scenario: Isolation of high-voltage traction battery from inverter or charger during vehicle startup/shutdown or crash detection.

IC Role / Device Role / Timing Role: Bidirectional static switch with body diode conduction and temperature-triggered disable function.

Use Value: Supports ASIL-B compliance through real-time junction temperature feedback, allowing dynamic current derating before thermal runaway.

On-Board Charger (OBC) Input StageHigh-Power Line Rectification

Use Scenario: AC/DC front-end switching in 11–22 kW EV on-board chargers operating at 50–60 Hz line frequency.

IC Role / Device Role / Timing Role: Low-frequency, high-current unidirectional switch controlling AC input rectification path and soft-start sequencing.

Use Value: Delivers 54 A continuous current at TC = 25 °C with minimal conduction loss, reducing heatsink size by >30% versus prior-gen CoolMOS™ S7A.

Use Scenario: Industrial 3-phase rectifier stage in UPS or motor drives handling >10 kW continuous power.

IC Role / Device Role / Timing Role: High-voltage synchronous rectifier or freewheeling switch managing reverse recovery and commutation stress.

Use Value: Leverages 360 ns trr and 6.1 µC Qrr to minimize switching loss during low-frequency commutation, improving efficiency by up to 1.2% at full load.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage static switching applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IPDQ60T040S7ATMA1No 'X' suffix; same die, identical electrical specs, but lacks AEC-Q101 qualification and extended Tj validationSuitable only for industrial, non-automotive applications with relaxed reliability requirementsSelect when automotive qualification is unnecessary and cost sensitivity outweighs long-term lifecycle assurance
IPDQ60T060S7AXTMA1Higher RDS(on) = 60 mΩ, lower Qg = 62 nC, same 600 V rating and TS functionalityBetter suited for space-constrained designs where gate drive power matters more than conduction lossChoose when thermal budget permits higher on-resistance and layout favors reduced gate charge

Compared with IPDQ60T040S7AXTMA1, the S7ATMA1 variant trades automotive qualification for cost, while the 060S7AXTMA1 offers gate-drive efficiency at the expense of conduction loss-making the 040S7AXTMA1 optimal for thermally demanding, safety-critical HV DC switching.

Availability

IPDQ60T040S7AXTMA1 is available at Aetrix Electronics and suitable for high-voltage DC circuit breakers, automotive HV eDisconnect systems, and on-board charger input stages requiring stable component supply, AEC-Q101 compliance, and validated thermal performance up to 175 °C.

Supply support for IPDQ60T040S7AXTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and sensor solutions for automotive, industrial, and renewable energy markets.

This part belongs to the CoolMOS™ S7TA product line, engineered specifically for high-reliability, low-frequency, high-current static switching in electric vehicle and industrial HV DC systems where thermal awareness and fault resilience are critical.

FAQ

Can IPDQ60T040S7AXTMA1 be used in linear mode operation?

No. The datasheet explicitly prohibits linear-mode operation due to inherent thermal instability risks in superjunction MOSFETs. It is designed exclusively for switched-mode applications with defined duty cycles and adequate heatsinking. Operating in the linear region may cause localized hot-spot formation and premature failure, even with active cooling.

What is the maximum allowable gate resistor value when driving IPDQ60T040S7AXTMA1?

The gate resistor must be selected to limit peak gate current and control switching speed without exceeding safe dv/dt limits. With typical Qg = 83 nC and recommended VGS swing of 0–12 V, a 10 Ω resistor yields ~1.2 A peak current and ~100 ns rise time. Values above 22 Ω increase switching losses significantly; values below 5 Ω risk overshoot and EMI without proper layout control.

How is the temperature sensor pin (Pin 3) biased and calibrated?

Pin 3 requires a constant-current source of 10–500 µA (typically 50 µA) to generate a forward voltage (VF) linearly proportional to junction temperature. Calibration uses the specified TC of 5.588 mV/K at 50 µA, with VF = 1.8103 V at 25 °C and 0.9721 V at 175 °C. No factory trimming is needed; system-level calibration against reference thermocouples is sufficient.

Why are Driver Source (Pin 4) and Power Source (Pins 5–11) separate terminals?

Separation prevents gate loop noise from coupling into the main current return path. Pin 4 serves as the dedicated low-impedance reference for gate driver ICs, while Pins 5–11 carry high di/dt load current. Swapping them causes gate oscillation, false triggering, and potential shoot-through in half-bridge configurations-hence the datasheet's explicit warning against interchangeability.

IPDQ60T040S7AXTMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
CoolMOS™
Package/Case:
22-PowerBSOP Module
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
600 V
Current - Continuous Drain (Id) @ 25°C:
54A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
12V
Rds On (Max) @ Id, Vgs:
40mOhm @ 13A, 12V
Vgs(th) (Max) @ Id:
4.5V @ 780µA
Gate Charge (Qg) (Max) @ Vgs:
83 nC @ 12 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
3128 pF @ 300 V
FET Feature:
-
Power Dissipation (Max):
272W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q101
Mounting Type:
Surface Mount
Supplier Device Package:
PG-HDSOP-22-1

IPDQ60T040S7AXTMA1 FAQ

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5.How can I obtain technical support or documentation for IPDQ60T040S7AXTMA1?

For technical support, including IPDQ60T040S7AXTMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPDQ60T040S7AXTMA1 requirements.

6.How does Aetrix verify that IPDQ60T040S7AXTMA1 is sourced from the original manufacturer or authorized distributors?

All IPDQ60T040S7AXTMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPDQ60T040S7AXTMA1 meets industry standards.

7.What is the process for return or replacement of IPDQ60T040S7AXTMA1?

All IPDQ60T040S7AXTMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPDQ60T040S7AXTMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IPDQ60T040S7AXTMA1 part is unused and in its original packaging.

Return procedure for IPDQ60T040S7AXTMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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