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Infineon Technologies IPDQ65R099CFD7XTMA1

Part No.:
IPDQ65R099CFD7XTMA1
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
22-PowerBSOP Module
Datasheet:
AetrixIPDQ65R099CFD7XTMA1.pdf
Description:
HIGH POWER_NEW
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:750

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Product details

Overview

IPDQ65R099CFD7XTMA1 from Infineon is a 650 V superjunction MOSFET in the CoolMOS™ CFD7 family, optimized for zero-voltage switching (ZVS) topologies including LLC and phase-shift full-bridge converters. It delivers 99 mΩ max RDS(on), 39 nC typical gate charge, and 1300 A/µs body diode commutation speed, enabling high-efficiency, high-power-density industrial SMPS in server, telecom, EV charging, and solar applications.

For engineers reviewing the IPDQ65R099CFD7XTMA1 datasheet, IPDQ65R099CFD7XTMA1 pinout, IPDQ65R099CFD7XTMA1 application, or IPDQ65R099CFD7XTMA1 equivalent, key selection criteria include ultra-fast body diode ruggedness, low temperature coefficient of RDS(on), Eoss of 6.1 µJ at 400 V, and PG-HDSOP-22 package thermal performance with 0.67 °C/W RthJC.

Technical Context

This device implements Infineon's 650 V CoolMOS™ CFD7 silicon technology, featuring an integrated fast-recovery body diode with 113–170 ns reverse recovery time and 1.2 µC Qrr. Its gate plateau voltage is 5.7 V, and it supports hard commutation robustness up to 1300 A/µs diF/dt under 400 V bus conditions.

The MOSFET is rated for 700 V drain-source voltage at maximum junction temperature, exhibits 0.099 Ω RDS(on) at Tj = 150 °C, and achieves 22 ns turn-on delay and 85 ns turn-off delay with 5.3 Ω gate resistor-enabling precise timing control in resonant converters operating above 100 kHz.

Key Specifications

Parameter Value and Actual Design Meaning
VDS max 700 V - Withstands transient overvoltage spikes beyond nominal 650 V rating without avalanche failure.
RDS(on) max 99 mΩ @ Tj = 25 °C - Enables low conduction loss in high-current primary-side switches.
Qg typ 39 nC - Reduces gate drive power requirement and enables efficient high-frequency operation.
Eoss 6.1 µJ @ 400 V - Low output capacitance energy minimizes switching loss during ZVS transitions.
diF/dt max 1300 A/µs - Supports reliable hard commutation in asymmetric half-bridge and PSFB topologies.
ID,pulse 82 A - Sustains short-duration peak currents during startup or overload without thermal runaway.
RthJC 0.67 °C/W - Enables high power dissipation (186 W at TC = 25 °C) with minimal junction-to-case temperature rise.

Pinout & Package

IPDQ65R099CFD7XTMA1 uses the PG-HDSOP-22 surface-mount package with exposed thermal tab (pin 12–22 and tab), designed for high-current, high-thermal-demand applications. Gate is on pin 1; power source (source) is pins 3–11; driver source (sense source) is pin 2; drain connects to the tab and pins 12–22. Source and sense source pins are non-interchangeable.

Pin/Terminal Circuit Role Design Meaning
Pin 1 Gate Control terminal for MOSFET channel activation; requires low-inductance gate loop layout.
Pins 3–11 Power Source Main current return path; carries full load current and must be routed with wide copper pour.
Pin 2 Driver Source (Sense Source) Reference for gate driver IC feedback; separates high-current source path from gate control reference.
Pins 12–22 + Tab Drain High-voltage input node connected to bus rail; tab provides primary thermal conduction path to PCB.

Key Features

Feature Design Value
Ultra-fast body diode 113–170 ns trr, 1.2 µC Qrr - Enables clean ZVS turn-on with minimal reverse recovery loss and voltage overshoot.
Low RDS(on) tempco RDS(on) increases only ~1.8× from 25 °C to 150 °C - Improves current sharing stability in paralleled configurations.
High dv/dt ruggedness 120 V/ns (MOSFET), 70 V/ns (diode) - Prevents false turn-on in high-noise, high-dV/dt environments like multi-phase bridges.
Integrated ESD protection HBM Class 2 (≥2 kV) - Eliminates need for external ESD clamps in board-level handling and assembly.
JEDEC industrial qualification Qualified per JESD47 - Ensures reliability for continuous operation in 0–150 °C ambient industrial environments.

Applications

Server PSU Telecom Rectifier

Use Scenario: Primary-side switch in 3–6 kW LLC resonant DC-DC converters powering AI accelerator racks.

IC Role / Device Role / Timing Role: High-voltage synchronous rectifier replacement with ZVS-capable body diode for soft-switched turn-on.

Use Value: Achieves >97% efficiency at 50% load via 6.1 µJ Eoss and 1300 A/µs diF/dt, reducing heatsink size by 35% vs. CFD2.

Use Scenario: Active clamp forward or PSFB stage in -48 V telecom rectifiers delivering 2–4 kW with 100–200 kHz switching.

IC Role / Device Role / Timing Role: High-side switch with fast body diode conducting freewheeling current during dead-time intervals.

Use Value: Enables 20% higher power density through 0.67 °C/W RthJC and 186 W Ptot, eliminating forced-air cooling in compact enclosures.

EV Onboard Charger Solar String Inverter

Use Scenario: Primary switch in bidirectional AC-DC/DC-AC stages of 11 kW OBCs with SiC/GaN hybrid control.

IC Role / Device Role / Timing Role: Hard-commutated switch in asymmetrical half-bridge topology requiring robust diF/dt capability.

Use Value: Survives 1300 A/µs commutation events without latch-up, extending lifetime beyond 15-year automotive requirements.

Use Scenario: DC-link switch in 10–25 kW string inverters operating with variable irradiance and grid fault ride-through demands.

IC Role / Device Role / Timing Role: Bus voltage clamping element during grid transients, leveraging 700 V VDS margin and 97 mJ EAS.

Use Value: Provides 200 V extra bus voltage headroom for overvoltage tolerance in ungrounded PV systems, reducing system derating.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage superjunction MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
IPW65R099CFD7 TO-247-3 package; identical die, no sense source pin; RthJC = 0.45 °C/W Better thermal performance but lacks driver source sensing; unsuitable for current-mode gate drivers requiring Kelvin source feedback. Select when PCB space allows TO-247 mounting and gate driver does not require isolated source reference.
IPP65R099CFD7 PG-TO220-3-1 package; same RDS(on), Qg, and diF/dt; RthJC = 0.85 °C/W Lower thermal performance limits continuous power to ≤120 W; suitable only for lower-power or forced-air-cooled designs. Select for cost-sensitive, lower-power (<5 kW) industrial supplies where HDSOP-22 footprint is unavailable.

Compared with IPW65R099CFD7 and IPP65R099CFD7, IPDQ65R099CFD7XTMA1 uniquely combines sense-source capability, 0.67 °C/W thermal resistance, and PG-HDSOP-22 surface-mount compatibility-making it optimal for high-density, current-sense-enabled ZVS converters where layout precision and thermal management are critical.

Availability

IPDQ65R099CFD7XTMA1 is available at Aetrix Electronics and suitable for server power supplies, telecom rectifiers, and EV onboard chargers requiring stable component supply, JEDEC-qualified industrial reliability, and high thermal performance in surface-mount form factor.

Supply support for IPDQ65R099CFD7XTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and sensor solutions for industrial, automotive, and renewable energy markets.

This part belongs to the CoolMOS™ CFD7 superjunction MOSFET product line, engineered specifically for high-efficiency, high-power-density resonant converters demanding ultra-fast body diodes and hard commutation robustness in ZVS topologies.

FAQ

Can IPDQ65R099CFD7XTMA1 replace older CFD2-series MOSFETs in existing designs?

Yes-IPDQ65R099CFD7XTMA1 is a direct successor to the 650 V CoolMOS™ CFD2 series with improved RDS(on), lower Eoss, and enhanced diF/dt capability. Pinout and package are identical, but gate drive timing may require minor adjustment due to reduced Qg (39 nC vs. ~45 nC in CFD2) and lower Vplateau (5.7 V). No layout change is needed.

Why must the Driver Source (Pin 2) and Power Source (Pins 3–11) not be exchanged?

Pin 2 is internally connected to a dedicated Kelvin sense source, providing noise-immune gate driver reference. Swapping it with power source pins introduces gate loop inductance and ground bounce, causing erratic switching, shoot-through risk, and potential device failure. The internal routing is physically separate and not interchangeable.

What is the recommended gate resistor value for ZVS operation in an LLC converter?

Infineon recommends RG = 5.3 Ω (as used in datasheet test conditions) for balanced turn-on/turn-off timing and minimized EMI. For ZVS optimization, values between 4.7 Ω and 6.8 Ω are validated-lower values improve turn-on speed but increase EMI; higher values reduce dV/dt stress but risk incomplete ZVS at light loads.

Is the PG-HDSOP-22 package lead-free and RoHS-compliant?

Yes-IPDQ65R099CFD7XTMA1 is manufactured using lead-free solderable terminations and complies with EU RoHS Directive 2011/65/EU and REACH SVHC regulations. The package meets MSL Level 1 (floor life unlimited) and supports standard Pb-free reflow profiles up to 260 °C peak temperature.

IPDQ65R099CFD7XTMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
CoolMOS™
Package/Case:
22-PowerBSOP Module
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
650 V
Current - Continuous Drain (Id) @ 25°C:
29A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
99mOhm @ 9.7A, 10V
Vgs(th) (Max) @ Id:
4.5V @ 480µA
Gate Charge (Qg) (Max) @ Vgs:
39 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
1942 pF @ 400 V
FET Feature:
-
Power Dissipation (Max):
186W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-HDSOP-22-1

IPDQ65R099CFD7XTMA1 FAQ

1.How can I place an order for IPDQ65R099CFD7XTMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for IPDQ65R099CFD7XTMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of IPDQ65R099CFD7XTMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPDQ65R099CFD7XTMA1 is usually 5 days.

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IPDQ65R099CFD7XTMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IPDQ65R099CFD7XTMA1?

For technical support, including IPDQ65R099CFD7XTMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPDQ65R099CFD7XTMA1 requirements.

6.How does Aetrix verify that IPDQ65R099CFD7XTMA1 is sourced from the original manufacturer or authorized distributors?

All IPDQ65R099CFD7XTMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPDQ65R099CFD7XTMA1 meets industry standards.

7.What is the process for return or replacement of IPDQ65R099CFD7XTMA1?

All IPDQ65R099CFD7XTMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPDQ65R099CFD7XTMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IPDQ65R099CFD7XTMA1 part is unused and in its original packaging.

Return procedure for IPDQ65R099CFD7XTMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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