Infineon Technologies IPP029N06NXKSA1
- Part No.:
- IPP029N06NXKSA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3
- Datasheet:
-
IPP029N06NXKSA1.pdf
- Description:
- TRENCH 40<-<100V
- Quantity:
- Payment:

- Shipping:

Inventory:495
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IPP029N06NXKSA1 from Infineon Technologies is an N-channel enhancement-mode power MOSFET optimized for high-efficiency synchronous rectification in 60 V SMPS topologies, featuring 2.9 mΩ RDS(on) at VGS = 10 V, 100 A continuous drain current, and 100% avalanche-tested ruggedness. It is housed in a TO-220-3 package with tab-connected drain for low thermal resistance.
For engineers reviewing the IPP029N06NXKSA1 datasheet, IPP029N06NXKSA1 pinout, IPP029N06NXKSA1 application in SMPS or DC-DC converters, or IPP029N06NXKSA1 equivalent for high-current 60 V switching, this page delivers verified electrical specs, thermal performance, gate charge behavior, and real-world design context.
Technical Context
This device operates as a unidirectional high-side or low-side switch in hard-switched and synchronous rectifier configurations, with gate threshold voltage (2.1–3.3 V) enabling robust TTL/CMOS drive compatibility. Its low Qg (56 nC) and Qgd (11–15 nC) support fast switching at high frequencies while minimizing Miller-induced shoot-through risk.
The integrated body diode exhibits 1.0–1.2 V forward voltage at 100 A and 54–86 ns reverse recovery time, making it suitable for freewheeling paths where controlled reverse recovery is critical-especially in LLC resonant and phase-shifted full-bridge topologies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 60 V - Maximum blocking voltage for 48 V nominal bus systems with margin for transients |
| RDS(on), max | 2.9 mΩ @ VGS = 10 V - Enables <1.5 W conduction loss at 100 A, reducing heatsink requirements |
| ID, cont | 100 A @ TC = 25 °C - Supports high-power single-phase outputs without paralleling |
| Qg | 56 nC - Low gate charge enables efficient 300–500 kHz switching with standard gate drivers |
| EAS | 110 mJ - Confirmed single-pulse avalanche energy rating ensures reliability under inductive fault conditions |
| RthJC | 0.7–1.1 K/W - Enables direct mounting to heatsinks with predictable junction-to-case thermal path |
| VGS(th) | 2.1–3.3 V - Ensures turn-on with 3.3 V logic-level drivers while avoiding false triggering near ground |
Pinout & Package
IPP029N06NXKSA1 uses the PG-TO220-3 package (standard TO-220-3 outline), with metal tab electrically connected to the drain terminal for optimal thermal and electrical performance in high-current layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Lead) | Gate | High-impedance control input; requires low-inductance gate loop layout to suppress ringing during fast dV/dt transitions |
| Tab (Drain) | Drain | Main high-current power terminal; electrically tied to heatsink-requires isolation if heatsink is grounded |
| Pin 3 (Lead) | Source | Reference node for gate drive and current sensing; connects to power ground or source of complementary FET in half-bridge |
Key Features
| Feature | Design Value |
|---|---|
| Optimized for synchronous rectification | Low Qgd/Qg ratio (≈0.26) and fast tf (8 ns) minimize dead-time losses and improve light-load efficiency |
| 100% avalanche tested | Each unit validated to withstand 110 mJ single-pulse avalanche energy-no derating needed for inductive load switching |
| Superior thermal resistance | RthJC ≤ 1.1 K/W allows >100 W dissipation with modest heatsinking, supporting compact PSU designs |
| Pb-free & halogen-free | RoHS-compliant plating and IEC61249-2-21 compliant materials meet global environmental compliance mandates |
| JEDEC-qualified | Validated per J-STD-020 (MSL1) and JESD22-A108 for industrial temperature range (−55 °C to +175 °C) |
Applications
| Server VRM | Industrial DC-DC Converter |
|---|---|
Use Scenario: High-density 48 V–12 V point-of-load conversion in AI accelerator racks requiring >100 A per phase. IC Role / Device Role / Timing Role: Low-side synchronous rectifier in multiphase buck converter, operating at 400–600 kHz with precise gate timing. Use Value: 2.9 mΩ RDS(on) reduces conduction loss by >35% vs. legacy 4 mΩ devices, lowering thermal stress on PCB copper planes. | Use Scenario: 60 V input isolated DC-DC module for factory automation PLCs with wide input variation (36–75 V). IC Role / Device Role / Timing Role: Primary-side switch in active-clamp forward topology, handling repetitive 100 A peak currents. Use Value: 110 mJ EAS rating eliminates need for external snubbers during transformer reset, simplifying BOM and layout. |
| Telecom Rectifier | EV Onboard Charger (OBC) Auxiliary Supply |
Use Scenario: 48 V telecom rectifier output stage delivering 2 kW with forced-air cooling. IC Role / Device Role / Timing Role: High-side main switch in interleaved two-phase boost PFC front-end. Use Value: 56 nC total gate charge enables clean 100 kHz switching with IR2110-based gate drivers, reducing driver supply current demand. | Use Scenario: 60 V auxiliary power supply inside 800 V EV onboard charger converting battery voltage to 12 V for control electronics. IC Role / Device Role / Timing Role: Secondary-side synchronous rectifier in flyback or forward converter, operating across −40 °C to +125 °C ambient. Use Value: JEDEC-qualified operation up to Tj = 175 °C ensures reliability during OBC thermal cycling without derating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-current 60 V power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IPB029N06N | Same die, D²PAK-3L package; RthJA ≈ 40 K/W vs. 62 K/W in TO-220; no metal tab | Better suited for surface-mount automated assembly; lower thermal resistance on large PCB copper areas | Select when board space permits SMT layout and thermal management relies on PCB copper rather than external heatsink |
| STP100N6F6 | Higher RDS(on) (3.5 mΩ), higher Qg (72 nC), same VDS; not 100% avalanche tested | Limited to non-critical industrial supplies where transient robustness is less demanding | Consider only if cost sensitivity outweighs efficiency and ruggedness requirements in non-safety-critical systems |
Compared with IPB029N06N, IPP029N06NXKSA1 offers superior heatsink coupling via its drain-tab connection but requires through-hole assembly; versus STP100N6F6, it delivers measurable efficiency gain (>0.5% at full load) and guaranteed avalanche immunity essential for telecom and server power.
Availability
IPP029N06NXKSA1 is available at Aetrix Electronics and suitable for server VRMs, industrial DC-DC converters, telecom rectifiers, and EV onboard charger auxiliary supplies requiring stable component supply and long-term manufacturability.
Supply support for IPP029N06NXKSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices, with leadership in silicon and wide-bandgap technologies.
This part belongs to the OptiMOSTM 60 V power transistor family, engineered specifically for high-efficiency, high-reliability switching in server, telecom, and industrial SMPS where low RDS(on), fast switching, and ruggedness are mandatory.
FAQ
Is IPP029N06NXKSA1 suitable for use as a high-side switch in a buck converter?
Yes-it supports high-side configuration with appropriate gate driving (e.g., bootstrap or isolated supply). Its 60 V VDS, 2.9 mΩ RDS(on), and 100 A rating make it viable for 48 V input buck stages. Gate threshold (2.1–3.3 V) ensures reliable turn-on with 10 V drive, and its low Qgd minimizes Miller plateau effects during high dV/dt transitions.
What is the maximum recommended PCB copper area for thermal performance in TO-220 mounting?
The datasheet specifies 6 cm² of 70 µm thick copper on FR4 (40 mm × 40 mm) yields RthJA = 40 K/W. Larger copper areas provide diminishing returns; beyond 10 cm², improvement is <5%. For best results, connect the drain tab directly to inner-layer copper planes using multiple thermal vias (≥8 × 0.3 mm) under the tab footprint.
Does IPP029N06NXKSA1 have a built-in ESD protection diode on the gate?
No-this MOSFET does not integrate gate ESD protection. The gate oxide is rated for ±20 V VGS, and gate-source leakage is specified up to 100 nA at VGS = 20 V. External Zener clamping (e.g., 12 V TVS) is recommended in high-noise environments or during manual handling to prevent gate oxide damage.
Can IPP029N06NXKSA1 replace IPP033N06N in an existing design?
Yes-with minor validation. IPP029N06NXKSA1 has lower RDS(on) (2.9 vs. 3.3 mΩ) and slightly higher Qg (56 vs. 52 nC), resulting in ~4% lower conduction loss but marginally increased switching loss. Thermal and layout compatibility is identical (same TO-220-3 package and pinout), and both are 100% avalanche tested-no redesign required beyond efficiency and thermal margin checks.
IPP029N06NXKSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- TO-220-3
- Packaging:
- Tube
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 60 V
- Current - Continuous Drain (Id) @ 25°C:
- 100A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 6V, 10V
- Rds On (Max) @ Id, Vgs:
- 2.9mOhm @ 100A, 10V
- Vgs(th) (Max) @ Id:
- 3.3V @ 75µA
- Gate Charge (Qg) (Max) @ Vgs:
- 66 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 5125 pF @ 30 V
- FET Feature:
- -
- Power Dissipation (Max):
- 3W (Ta), 136W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- PG-TO220-3-1
IPP029N06NXKSA1 FAQ
1.How can I place an order for IPP029N06NXKSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IPP029N06NXKSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IPP029N06NXKSA1 reliable?
The price and inventory of IPP029N06NXKSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPP029N06NXKSA1 is usually 5 days.
3.What payment methods are accepted for IPP029N06NXKSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPP029N06NXKSA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IPP029N06NXKSA1?
IPP029N06NXKSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IPP029N06NXKSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IPP029N06NXKSA1?
For technical support, including IPP029N06NXKSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPP029N06NXKSA1 requirements.
6.How does Aetrix verify that IPP029N06NXKSA1 is sourced from the original manufacturer or authorized distributors?
All IPP029N06NXKSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPP029N06NXKSA1 meets industry standards.
7.What is the process for return or replacement of IPP029N06NXKSA1?
All IPP029N06NXKSA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPP029N06NXKSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPP029N06NXKSA1 part is unused and in its original packaging.
Return procedure for IPP029N06NXKSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IPP029N06NXKSA1 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

