Infineon Technologies IPP60R160P7XKSA1
- Part No.:
- IPP60R160P7XKSA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3
- Datasheet:
-
IPP60R160P7XKSA1.pdf
- Description:
- MOSFET N-CH 650V 20A TO220-3-1
- Quantity:
- Payment:

- Shipping:

Inventory:496
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IPP60R160P7XKSA1 from Infineon Technologies is a 600 V, 160 mΩ superjunction N-channel power MOSFET in PG-TO220-3 package, optimized for high-efficiency hard- and soft-switching PFC and LLC resonant converters. It delivers 66 A pulsed drain current, 31 nC total gate charge, and 900 A/µs body diode commutation speed, enabling robust operation in server PSUs and telecom rectifiers.
For engineers reviewing the IPP60R160P7XKSA1 datasheet, IPP60R160P7XKSA1 pinout, IPP60R160P7XKSA1 application, or IPP60R160P7XKSA1 equivalent, key selection criteria include RDS(on) vs. temperature stability, ESD robustness (>2 kV HBM), dv/dt ruggedness (80 V/ns), and low Eoss (3.5 µJ @ 400 V) for ZVS/ZCS design validation.
Technical Context
This CoolMOS™ P7 device implements a trench-gated superjunction structure with optimized charge balancing, delivering lower RDS(on) × area (0.160 Ω × mm²) than prior P6 generation while maintaining <5.1 V gate plateau voltage and 9–10 nC Qgd. Its body diode exhibits 190 ns reverse recovery time and 1.7 µC Qrr, validated for hard commutation up to 900 A/µs.
The MOSFET supports both low-side and high-side configurations with identical dv/dt immunity (80 V/ns low-side, 50 V/ns reverse diode), and its 1.55 °C/W RthJC enables thermal derating to 13 A continuous at TC = 100°C - critical for compact, convection-cooled industrial SMPS designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 600 V maximum blocking voltage - supports 400 V DC bus with 50% margin for transient overvoltage in telecom/server front-end converters |
| RDS(on),max | 160 mΩ at Tj = 150°C - defines conduction loss floor in 20 A PFC boost stages operating at 100 kHz |
| Qg,typ | 31 nC - determines gate drive power and switching speed in 300–500 kHz LLC half-bridge designs |
| Eoss@400V | 3.5 µJ - quantifies energy lost during turn-on in zero-voltage-switching topologies; enables >96% efficiency at 1 kW |
| diF/dt | 900 A/µs - certifies body diode ruggedness for unidirectional hard-commutated PFC freewheeling paths |
| Tj,max | 150°C - allows operation in sealed enclosures without forced airflow when paired with 1.55 °C/W thermal path |
| VGS(th) | 3.0–4.0 V - ensures reliable turn-on with standard 5 V logic-level gate drivers and noise immunity against false triggering |
Pinout & Package
Package: PG-TO220-3 (standard through-hole, isolated tab, lead-free plating). Thermal pad electrically connected to Drain (Pin 2).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Gate) | Control electrode | High-impedance input requiring <10 Ω series gate resistor to suppress ringing; referenced to Source (Pin 3) |
| Pin 2 (Drain) | High-voltage power terminal | Connected to heatsink via isolated mounting; carries full AC/DC input current and withstands 650 V transient peaks |
| Pin 3 (Source) | Power return and reference node | Serves as local ground for gate driver; must be low-inductance path to minimize VGS disturbance during fast dI/dt events |
Key Features
| Feature | Design Value |
|---|---|
| Superjunction architecture | Enables 160 mΩ RDS(on) at 600 V with <0.160 Ω·mm² figure-of-merit - reduces die size by 25% vs. P6 generation for same RDS(on) |
| Body diode commutation ruggedness | Validated to 900 A/µs diF/dt - eliminates need for external anti-parallel SiC Schottky in cost-sensitive PFC designs |
| ESD robustness | >2 kV HBM - permits direct handling on production lines without special ESD controls, reducing assembly yield loss |
| Low ringing tendency | Gate threshold of 3.5 V typ. + 9 Ω internal RG - simplifies gate drive design with minimal snubber requirements in 300–700 kHz converters |
| dv/dt immunity | 80 V/ns (MOSFET), 50 V/ns (body diode) - prevents spurious turn-on in high-noise bridge-leg environments without active Miller clamp |
Applications
| Server Power Supply (PFC Stage) | Telecom Rectifier (LLC Resonant) |
|---|---|
Use Scenario: 1.5 kW continuous boost PFC front-end operating at 100 kHz with 400 V DC output. IC Role / Device Role / Timing Role: Main switch in interleaved two-phase boost converter; handles 20 A RMS input current per phase. Use Value: 160 mΩ RDS(on) at 125°C and 31 nC Qg enable >98.2% efficiency while reducing heatsink volume by 35% vs. P6 equivalents. |
Use Scenario: 1.2 kW half-bridge LLC resonant DC-DC stage converting 400 V to 12 V for base station RF amplifiers. IC Role / Device Role / Timing Role: High-side and low-side primary switch; operates in ZVS mode at 350 kHz with 66 A peak current. Use Value: 3.5 µJ Eoss and 900 A/µs diF/dt ensure reliable zero-voltage turn-on and body diode commutation under full-load transients. |
| Industrial UPS Inverter | LED Driver (High-Power) |
Use Scenario: 3 kVA online UPS inverter stage with 600 V DC bus and 50 Hz/60 Hz sine-wave output. IC Role / Device Role / Timing Role: IGBT replacement in 3-phase inverter leg; switched at 8–16 kHz with unipolar PWM. Use Value: 650 V VDS@Tj,max and 13 A continuous rating at 100°C allow direct substitution without derating or layout change. |
Use Scenario: 400 W constant-current LED driver for stadium lighting, using asymmetric half-bridge topology. IC Role / Device Role / Timing Role: Primary-side switch controlling resonant tank; subjected to repetitive hard commutation during dimming transitions. Use Value: >2 kV HBM ESD rating and 190 ns trr prevent latch-up and reduce EMI filter size compared to standard SJ-MOSFETs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IPP60R190P7 | Higher RDS(on) (190 mΩ), identical 600 V rating and package; 27 nC Qg, 3.1 µJ Eoss | Better trade-off for lower-frequency (<100 kHz) PFC where conduction loss dominates switching loss | Select when thermal budget allows higher RDS(on) to reduce gate drive complexity and cost |
| IPW60R099P7 | Lower RDS(on) (99 mΩ), same platform; 45 nC Qg, 5.2 µJ Eoss, TO-247-3 package | Required for >3 kW systems needing <10 mΩ·cm² RDS(on) density and enhanced thermal dissipation | Choose for high-power server PSUs where 1.55 °C/W RthJC is insufficient and TO-247 mechanical fit is acceptable |
Compared with IPP60R190P7, IPP60R160P7XKSA1 offers 16% lower conduction loss at 25°C but requires ~15% more gate drive energy; versus IPW60R099P7, it trades 38% higher RDS(on) for 31% lower Eoss and TO-220 compatibility in space-constrained legacy designs.
Availability
IPP60R160P7XKSA1 is available at Aetrix Electronics and suitable for server power supplies, telecom rectifiers, and industrial UPS inverters requiring stable component supply across multi-year production cycles.
Supply support for IPP60R160P7XKSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices, with global manufacturing and qualification infrastructure.
The CoolMOS™ P7 product line targets high-efficiency AC-DC conversion in datacenter, telecom, and industrial power systems, emphasizing reduced system size, improved thermal performance, and simplified EMI compliance through intrinsic switching behavior.
FAQ
What is the maximum continuous drain current at 100°C case temperature?
The IPP60R160P7XKSA1 supports 13 A continuous drain current at TC = 100°C, as specified in Table 2 of the Rev. 2.0 datasheet. This rating is derived from thermal limits (81 W Ptot at 25°C) and 1.55 °C/W junction-to-case resistance, allowing safe operation in convection-cooled server PSU housings without active cooling.
Is this MOSFET suitable for paralleling in high-current PFC designs?
Yes, but with specific layout requirements: Infineon recommends ferrite beads on each gate line or individual totem-pole drivers to suppress oscillation. The device's matched threshold voltage (3.0–4.0 V) and low RDS(on) tolerance (±20%) support current sharing, provided source inductance is balanced and thermal coupling is uniform across paralleled units.
How does the body diode performance compare to previous CoolMOS generations?
This P7 device achieves 900 A/µs diF/dt and 190 ns trr - a 2.3× improvement in commutation speed over P6 and 35% reduction in Qrr vs. P5. These values are measured under standardized conditions (VR = 400 V, IF = 3 A, diF/dt = 100 A/µs) and validated per JEDEC JESD24-11 for industrial reliability.
Does the PG-TO220-3 package provide electrical isolation between drain and mounting surface?
No - the PG-TO220-3 package used in IPP60R160P7XKSA1 has an electrically connected drain tab. The metal tab (Pin 2) is internally bonded to the drain, requiring insulating hardware (e.g., silicone pad + shoulder washer) when mounted to a grounded heatsink. Isolation voltage rating is not specified; creepage/clearance must comply with end-equipment safety standards.
IPP60R160P7XKSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- CoolMOS™ P7
- Package/Case:
- TO-220-3
- Packaging:
- Tube
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 650 V
- Current - Continuous Drain (Id) @ 25°C:
- 20A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 160mOhm @ 6.3A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 350µA
- Gate Charge (Qg) (Max) @ Vgs:
- 31 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1317 pF @ 400 V
- FET Feature:
- -
- Power Dissipation (Max):
- 81W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- PG-TO220-3-1
IPP60R160P7XKSA1 FAQ
1.How can I place an order for IPP60R160P7XKSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IPP60R160P7XKSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IPP60R160P7XKSA1 reliable?
The price and inventory of IPP60R160P7XKSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPP60R160P7XKSA1 is usually 5 days.
3.What payment methods are accepted for IPP60R160P7XKSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPP60R160P7XKSA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IPP60R160P7XKSA1?
IPP60R160P7XKSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IPP60R160P7XKSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IPP60R160P7XKSA1?
For technical support, including IPP60R160P7XKSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPP60R160P7XKSA1 requirements.
6.How does Aetrix verify that IPP60R160P7XKSA1 is sourced from the original manufacturer or authorized distributors?
All IPP60R160P7XKSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPP60R160P7XKSA1 meets industry standards.
7.What is the process for return or replacement of IPP60R160P7XKSA1?
All IPP60R160P7XKSA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPP60R160P7XKSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPP60R160P7XKSA1 part is unused and in its original packaging.
Return procedure for IPP60R160P7XKSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IPP60R160P7XKSA1 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

