Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Infineon Technologies IPQC60R010S7XTMA1

Name: IPQC60R010S7XTMA1
Brand: Infineon Technologies
SKU: IPQC60R010S7XTMA1
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: IPQC60R010S7XTMA1

Manufacturer:: Infineon Technologies

Category:: FETs, MOSFETs

Package:: 22-PowerBSOP Module

Datasheet:: IPQC60R010S7XTMA1.pdf

Description:: MOSFET

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:750

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

IPQC60R010S7XTMA1 from Infineon is a 600 V, 10 mΩ silicon carbide–enhanced superjunction MOSFET in PG-HDSOP-22 package with Kelvin source configuration, optimized for static switching and high-current line rectification in SMPS and inverters. It delivers 801 A pulsed drain current, 0.82 V diode forward voltage, and 318 nC total gate charge.

For engineers reviewing the IPQC60R010S7XTMA1 datasheet, IPQC60R010S7XTMA1 pinout, IPQC60R010S7XTMA1 application, or IPQC60R010S7XTMA1 equivalent, key selection criteria include R_DS(on) stability at 150 °C, dv/dt ruggedness (20 V/ns), body diode recovery performance (600 ns t_rr), and bottom-side cooling compatibility with standard PCB assembly flows.

Technical Context

This CoolMOS™ S7 device uses charge-compensation trench technology to achieve ultra-low R_DS(on) × Q_g figure-of-merit (10 mΩ × 318 nC) while maintaining 600 V blocking capability. Its Kelvin source architecture separates driver and power return paths to minimize source inductance and suppress oscillation during high-di/dt switching.

The PG-HDSOP-22 package integrates a thermally enhanced exposed tab for direct heatsink mounting and supports MSL1 reflow compatibility up to 260 °C. Internal body diode characteristics-V_SD = 0.82 V at 50 A, t_rr = 600 ns-are specified under hard-switched commutation conditions (di/dt = 100 A/μs).

Key Specifications

Parameter	Value and Actual Design Meaning
R_DS(on)	10 mΩ max at V_GS = 12 V, I_D = 50 A, T_j = 25 °C - enables minimal conduction loss in high-current DC/AC line switching
V_(BR)DSS	600 V min - supports operation across universal AC input (85–265 VAC) with margin for surge and ringing
Q_g	318 nC typ at V_DD = 300 V, I_D = 50 A - determines gate drive power requirement and switching loss trade-off
I_D,pulse	801 A max - supports short-duration overload handling in circuit breaker and SSR applications
V_SD	0.82 V typ at I_S = 50 A, T_j = 25 °C - reduces reverse conduction loss in synchronous rectification and bidirectional topologies
dv/dt ruggedness	20 V/ns min - ensures reliable operation without spurious turn-on in high-noise inverter and motor drive environments
R_thJC	0.18 °C/W - allows >694 W continuous power dissipation with efficient heatsinking, reducing thermal derating penalties

Pinout & Package

IPQC60R010S7XTMA1 is housed in PG-HDSOP-22: a surface-mount, thermally optimized package with exposed copper drain tab on the bottom side and 22-pin leadframe layout enabling dual-source routing and Kelvin sensing.

Pin/Terminal	Circuit Role	Design Meaning
TAB (Drain)	Main power drain connection	Exposed metal tab serves as primary drain terminal and thermal path; must be soldered to PCB copper pour or heatsink
Pin 1	Gate	High-impedance control input; requires external gate resistor placed at driver source (not gate) for paralleling stability
Pins 3–11	Power Source	Low-inductance return path for main current; connects to system ground/power rail in high-current paths
Pin 2	Driver Source	Kelvin sense node for gate driver feedback; isolates gate loop from power loop to suppress ringing and improve switching consistency
Pins 12–22	Drain (redundant)	Secondary drain connections tied internally to TAB; provide mechanical reinforcement and additional current capacity

Key Features

Feature	Design Value
Kelvin source configuration	Separates driver return (Pin 2) from power return (Pins 3–11), eliminating source inductance impact on gate control and enabling stable 801 A pulse operation
Bottom-side cooling package	PG-HDSOP-22 exposes drain tab directly to PCB thermal plane, achieving 0.18 °C/W R_thJC without clip-bond or thermal interface material
Optimized for static switching	Ultra-low R_DS(on) and high I_D,pulse prioritize conduction efficiency over switching speed-ideal for solid-state relay and contactor replacement
JEDEC-qualified for industrial use	Validated per JESD47 stress testing across –55 °C to +175 °C extended junction range, supporting 50 h at 175 °C in critical applications
Body diode with controlled recovery	t_rr = 600 ns and Q_rr = 17 μC enable predictable commutation in line rectification without snubber dependency

Applications

Solid-State Relay (SSR)

High-Power Line Rectification

Use Scenario: Replacing electromechanical relays in industrial PLC output modules requiring >100 k-cycle lifetime and zero contact bounce.

IC Role / Device Role / Timing Role: Main power switch operating in on/off (static) mode with <1 Hz switching frequency and sustained 50 A RMS current.

Use Value: Eliminates arcing, wear, and vibration sensitivity while delivering 0.82 V low-loss conduction and 20 V/ns dv/dt immunity in noisy factory environments.

Use Scenario: Primary-side rectification in 3–5 kW telecom rectifiers and UPS systems where efficiency >96% at full load is required.

IC Role / Device Role / Timing Role: Unidirectional power switch conducting continuously during AC half-cycles, with peak current up to 801 A during surge events.

Use Value: 10 mΩ R_DS(on) minimizes I²R losses at 50 A, while Kelvin source ensures consistent turn-on even under PCB trace inductance variations.

Circuit Breaker Replacement

Inverter Output Stage

Use Scenario: Electronic trip unit in 400 V AC molded-case circuit breakers needing sub-10 ms fault interruption and thermal runaway protection.

IC Role / Device Role / Timing Role: High-current shutoff element triggered by overcurrent detection, holding off 600 V during interruption and conducting 50 A normally.

Use Value: 616 mJ single-pulse avalanche energy rating allows safe clamping of inductive kickback without external TVS, simplifying protection design.

Use Scenario: Low-side switch in three-phase solar inverter H-bridge stages operating at 16 kHz PWM with 500 V DC bus.

IC Role / Device Role / Timing Role: Fast-turning power switch managing motor phase current; leverages 5 ns rise time and 9 ns fall time for reduced switching loss.

Use Value: 318 nC Q_g balances gate drive loss and E_sw, while 0.18 °C/W R_thJC sustains 150 °C junction temperature under forced-air cooling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage, high-current switching applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IPW60R017C7FKSA1	R_DS(on) = 17 mΩ (higher), Q_g = 220 nC (lower), same 600 V rating, TO-247 package	Lacks Kelvin source; higher R_DS(on) increases conduction loss but lower Q_g eases gate drive design	Preferred when board space allows TO-247 and thermal design accommodates higher I²R loss
IPP60R017C7XKSA1	R_DS(on) = 17 mΩ, Q_g = 220 nC, PG-TO220-3-1 package, no Kelvin source	Non-isolated source pin limits high-di/dt stability; lower thermal resistance (0.35 °C/W) but no bottom-side cooling	Selected for cost-sensitive industrial drives where PCB-level thermal management is less constrained

Compared with IPW60R017C7FKSA1 and IPP60R017C7XKSA1, IPQC60R010S7XTMA1 provides 30% lower R_DS(on) and Kelvin source integrity essential for paralleled high-current designs, at the expense of higher gate charge and stricter layout requirements for driver source routing.

Availability

IPQC60R010S7XTMA1 is available at Aetrix Electronics and suitable for solid-state relay, high-power line rectification, and electronic circuit breaker applications requiring stable component supply, long-lifecycle support, and JEDEC-qualified industrial reliability.

Supply support for IPQC60R010S7XTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and industrial sensors, with global manufacturing and qualification infrastructure.

IPQC60R010S7XTMA1 belongs to the CoolMOS™ S7 superjunction MOSFET product line, engineered specifically for high-efficiency, high-current static switching in industrial power conversion and protection systems.

FAQ

Can IPQC60R010S7XTMA1 be paralleled with identical units?

Yes, but only with strict adherence to gate resistor placement: the resistor must be mounted at the driver source (Pin 2), not the gate (Pin 1), to prevent oscillation. Layout symmetry, matched trace inductance, and individual gate drive paths are mandatory. The datasheet explicitly warns that source pin exchange between Power Source (Pins 3–11) and Driver Source (Pin 2) causes malfunction.

What is the maximum allowable junction temperature during continuous operation?

The absolute maximum operating junction temperature is 150 °C for indefinite operation. An extended rating of 175 °C is permitted for ≤50 hours over the device's lifetime, validated per JEDEC industrial qualification. Thermal design must ensure R_thJC × P_diss + T_case stays within these limits, using the 0.18 °C/W junction-to-case resistance.

Does the internal body diode support synchronous rectification?

No-the body diode is optimized for unidirectional line rectification and fault clamping, not high-frequency synchronous operation. Its 600 ns reverse recovery time and 17 μC Q_rr generate significant switching loss above 20 kHz. For synchronous rectification, a discrete Schottky or GaN FET with <100 ns t_rr is recommended instead.

Is PG-HDSOP-22 compatible with standard reflow soldering processes?

Yes-PG-HDSOP-22 is MSL1 rated and qualified for lead-free reflow up to 260 °C peak temperature. The package uses total Pb-free terminations and is designed for compatibility with standard PCB assembly flows, including stencil printing, pick-and-place, and convection reflow, without requiring special thermal profiling beyond IPC/JEDEC J-STD-020.

IPQC60R010S7XTMA1 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: CoolMOS™ S7

Package/Case:: 22-PowerBSOP Module

Packaging:: Tape & Reel (TR)

Product Status:: Active

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 600 V

Current - Continuous Drain (Id) @ 25°C:: 50A (Tc)

Drive Voltage (Max Rds On, Min Rds On):: 12V

Rds On (Max) @ Id, Vgs:: 10mOhm @ 50A, 12V

Vgs(th) (Max) @ Id:: 4.5V @ 3.08mA

Gate Charge (Qg) (Max) @ Vgs:: 318 nC @ 12 V

Vgs (Max):: ±20V

Input Capacitance (Ciss) (Max) @ Vds:: -

FET Feature:: -

Power Dissipation (Max):: 694W (Tc)

Operating Temperature:: -55°C ~ 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: PG-HDSOP-22

IPQC60R010S7XTMA1 FAQ

1.How can I place an order for IPQC60R010S7XTMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for IPQC60R010S7XTMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IPQC60R010S7XTMA1 reliable?

The price and inventory of IPQC60R010S7XTMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPQC60R010S7XTMA1 is usually 5 days.

3.What payment methods are accepted for IPQC60R010S7XTMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPQC60R010S7XTMA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IPQC60R010S7XTMA1?

IPQC60R010S7XTMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IPQC60R010S7XTMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IPQC60R010S7XTMA1?

For technical support, including IPQC60R010S7XTMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPQC60R010S7XTMA1 requirements.

6.How does Aetrix verify that IPQC60R010S7XTMA1 is sourced from the original manufacturer or authorized distributors?

All IPQC60R010S7XTMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPQC60R010S7XTMA1 meets industry standards.

7.What is the process for return or replacement of IPQC60R010S7XTMA1?

All IPQC60R010S7XTMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPQC60R010S7XTMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IPQC60R010S7XTMA1 part is unused and in its original packaging.

Return procedure for IPQC60R010S7XTMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-08-06 Conditional Access Module: CAM, CI/CI+ and DVB Security

Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…

2026-08-03 Electronic Component Obsolescence: EOL Risks, Replacement Options and Last-Time Buy Strategy

Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

2026-07-08 Output Capacitor Selection for High-Current ASIC Vcore Rails

Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…

2026-07-07 High-Current ASIC Core Power Supply Design: 12-Phase Buck, PMBus and Dynamic Load Response

Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …