Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Infineon Technologies IPQC60R040S7AXTMA1

Name: IPQC60R040S7AXTMA1
Brand: Infineon Technologies
SKU: IPQC60R040S7AXTMA1
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: IPQC60R040S7AXTMA1

Manufacturer:: Infineon Technologies

Category:: FETs, MOSFETs

Package:: 22-PowerBSOP Module

Datasheet:: IPQC60R040S7AXTMA1.pdf

Description:: MOSFET

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:730

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

IPQC60R040S7AXTMA1 from Infineon Technologies is a 600 V, 40 mΩ superjunction MOSFET in PG-HDSOP-22 (QDPAK) package with Kelvin Source configuration, designed as a high-current static switch for low-frequency HV applications including battery disconnect switches and synchronous rectification in bridge rectifiers. It features 207 A pulsed drain current, 83 nC total gate charge, and AEC-Q101 qualification.

For engineers reviewing the IPQC60R040S7AXTMA1 datasheet, IPQC60R040S7AXTMA1 pinout, IPQC60R040S7AXTMA1 application, or IPQC60R040S7AXTMA1 equivalent, key selection criteria include R_DS(on) stability at 150 °C, dv/dt ruggedness (20 V/ns), Kelvin Source layout impact on ringing suppression, and thermal resistance (0.46 °C/W junction-to-case) for high-power SMD designs.

Technical Context

This CoolMOS™ S7A device implements superjunction cell architecture to achieve 40 mΩ R_DS(on) at 600 V blocking capability while maintaining robust avalanche energy rating (159 mJ) and 20 V/ns dv/dt ruggedness. Its internal body diode supports synchronous rectification with 0.82 V forward voltage at 13 A.

The PG-HDSOP-22 package integrates a thermally enhanced exposed tab (Drain-connected pins 12–22) and dedicated Kelvin Source (Pin 2), decoupling power and sensing paths to minimize source inductance-induced oscillation during 207 A pulsed operation.

Key Specifications

Parameter	Value and Actual Design Meaning
R_DS(on), max	40 mΩ at V_GS = 12 V, I_D = 13 A, T_j = 25 °C - enables low conduction loss in high-current DC switching
V_(BR)DSS	600 V - rated for HV battery systems and industrial AC/DC disconnects up to 400 V RMS
Q_g, typ	83 nC - determines gate drive power requirement and switching speed in low-frequency (<100 kHz) operation
I_D,pulse	207 A - supports short-duration surge currents in circuit breaker and e-fuse applications
R_thJC	0.46 °C/W - allows direct heatsinking via bottom-side cooling in QDPAK footprint without thermal vias
V_SD	0.82 V at I_F = 13 A, T_j = 25 °C - reduces forward loss vs. standard silicon diodes in synchronous rectifier mode
dv/dt ruggedness	20 V/ns - ensures reliable turn-off under fast voltage transients in motor drives and HV inverters

Pinout & Package

PG-HDSOP-22 (QDPAK) package with exposed copper thermal tab (Drain-connected), MSL1 reflow compatible, Pb-free, bottom-side cooled. Pin 1 = Gate, Pins 3–11 = Power Source, Pin 2 = Driver Source (Kelvin), Pins 12–22 + Tab = Drain.

Pin/Terminal	Circuit Role	Design Meaning
Pin 1	Gate	Control input for MOSFET channel activation; requires gate resistor placement on Driver Source (Pin 2) for paralleling
Pins 3–11	Power Source	Main current return path for load current; carries full output current but not used for gate loop sensing
Pin 2	Driver Source (Kelvin)	Reference node for gate driver feedback; eliminates source inductance impact on switching waveform stability
Pins 12–22 + Tab	Drain	High-voltage power input terminal; electrically and thermally connected to exposed copper pad for PCB heatsinking

Key Features

Feature	Design Value
Kelvin Source configuration	Separates high-current power return (Pins 3–11) from gate drive reference (Pin 2), reducing switching ringing and improving stability at >100 A
S7A superjunction technology	Delivers 40 mΩ R_DS(on) in QDPAK footprint - 25% lower on-resistance than prior S6 generation at same voltage class
AEC-Q101 qualified	Validated for automotive-grade reliability including temperature cycling, HTRB, and ESD - suitable for HV battery disconnect modules
Bottom-side cooling	Thermal resistance of 0.46 °C/W junction-to-case enables >272 W power dissipation with minimal PCB copper area

Applications

High-Voltage Battery Disconnect Switch

Circuit Breaker (AC/DC Low-Frequency)

Use Scenario: Isolation of 400–800 V traction battery during fault conditions or service mode in EV/HEV platforms.

IC Role / Device Role / Timing Role: High-side static switch operating in on/off mode with <1 Hz switching frequency and 207 A fault-current interruption capability.

Use Value: Replaces mechanical contactors with solid-state reliability, eliminating arcing and enabling faster response (<10 ms) than electromechanical breakers.

Use Scenario: Solid-state overcurrent protection in industrial DC distribution panels and renewable energy inverters.

IC Role / Device Role / Timing Role: Low-frequency (≤100 Hz) power switch with 600 V blocking and 14 A continuous current rating at 140 °C case temperature.

Use Value: Enables compact, maintenance-free breakers with precise trip timing and no contact wear, supporting UL 489/60947 compliance.

Synchronous Rectification (Bridge Replacement)

HV E-Fuse

Use Scenario: Replacement of Si diodes in high-power AC/DC front-end rectifiers or LLC secondary-side rectification.

IC Role / Device Role / Timing Role: Unidirectional power switch with integrated body diode (V_SD = 0.82 V), driven synchronously to reduce conduction loss.

Use Value: Cuts forward voltage drop by ~30% vs. 600 V Schottky diodes, lowering thermal stress and improving efficiency in >3 kW PSUs.

Use Scenario: Electronic fuse function in battery management systems requiring programmable current limiting and fast fault shutdown.

IC Role / Device Role / Timing Role: Current-sensing enabled switch with 159 mJ single-pulse avalanche energy rating for safe energy absorption during short-circuit events.

Use Value: Provides sub-100 µs fault response and repeatable trip behavior without degradation, replacing polymer PTCs in high-reliability systems.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage, low-frequency power switching applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IPW60R041P7XKSA1	Same 600 V / 41 mΩ rating but TO-247 package; higher R_thJA (62 °C/W); no Kelvin Source	Limited to forced-air or heatsink-cooled designs; unsuitable for ultra-low-inductance SMD layouts	Select when board space allows through-hole mounting and Kelvin Source is not required for stability
IPP60R041C7XKSA1	600 V / 41 mΩ in PG-TO220-3-1; lacks AEC-Q101 qualification; no Kelvin Source; R_thJC = 0.55 °C/W	Targeted at cost-sensitive industrial SMPS, not automotive or safety-critical e-fuse use	Select for non-automotive, non-UL-certified applications where qualification and thermal performance are secondary

Compared with IPW60R041P7XKSA1 and IPP60R041C7XKSA1, IPQC60R040S7AXTMA1 uniquely combines AEC-Q101 qualification, Kelvin Source, and 0.46 °C/W R_thJC in an SMD package-making it the only option for space-constrained, high-reliability HV battery disconnects requiring zero-layout-induced ringing.

Availability

IPQC60R040S7AXTMA1 is available at Aetrix Electronics and suitable for high-voltage battery disconnect switches, circuit breakers, synchronous rectifiers, and HV e-fuses requiring stable component supply across automotive, industrial, and energy storage programs.

Supply support for IPQC60R040S7AXTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and sensor solutions, with leadership in silicon carbide and superjunction MOSFET technologies.

The CoolMOS™ S7A product line targets high-efficiency, high-reliability HV power conversion in automotive battery systems and industrial protection devices, emphasizing low R_DS(on), robust dv/dt immunity, and AEC-Q101 compliance.

FAQ

Can IPQC60R040S7AXTMA1 be used in linear mode operation?

No. The datasheet explicitly states that this CoolMOS™ device must not be operated in linear mode. Its design and qualification assume switching operation only. Linear-mode use risks thermal runaway due to positive temperature coefficient behavior and insufficient Safe Operating Area (SOA) margin at partial conduction. Applications requiring analog control must use dedicated linear FETs or bipolar devices.

What is the functional difference between Power Source (Pins 3–11) and Driver Source (Pin 2)?

Power Source pins carry full load current and connect to system ground or return path, while Driver Source (Pin 2) is a dedicated Kelvin sense terminal tied directly to the MOSFET's internal source metallization. Using Pin 2 for gate driver reference eliminates voltage drop across source bond wires during switching, preventing false turn-off and oscillation-critical for stable 207 A pulse handling.

Is the PG-HDSOP-22 package compatible with standard reflow soldering processes?

Yes. The package is MSL1 rated and qualified for lead-free reflow with peak temperature up to 260 °C. Its bottom-side cooling design requires no special stencil or thermal relief-standard Type 3 solder paste and 60–90 sec above 217 °C profile are sufficient. The exposed drain tab ensures efficient heat transfer to inner PCB copper layers without thermal vias.

Why does the datasheet prohibit exchanging Source and Driver Source pins?

Swapping these pins disrupts the Kelvin sensing architecture: connecting gate driver to Power Source introduces ~1.5 nH of parasitic inductance per bond wire, causing severe ringing during turn-off and potential shoot-through in half-bridge configurations. This violates the device's SOA limits and invalidates AEC-Q101 qualification-resulting in unpredictable failure modes under high di/dt conditions.

IPQC60R040S7AXTMA1 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: CoolMOS™

Package/Case:: 22-PowerBSOP Module

Packaging:: Tape & Reel (TR)

Product Status:: Active

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 600 V

Current - Continuous Drain (Id) @ 25°C:: 14A (Tc)

Drive Voltage (Max Rds On, Min Rds On):: 12V

Rds On (Max) @ Id, Vgs:: 40mOhm @ 13A, 12V

Vgs(th) (Max) @ Id:: 4.5V @ 790µA

Gate Charge (Qg) (Max) @ Vgs:: 83 nC @ 12 V

Vgs (Max):: ±20V

Input Capacitance (Ciss) (Max) @ Vds:: -

FET Feature:: -

Power Dissipation (Max):: 272W (Tc)

Operating Temperature:: -40°C ~ 150°C (TJ)

Grade:: Automotive

Qualification:: AEC-Q101

Mounting Type:: Surface Mount

Supplier Device Package:: PG-HDSOP-22

IPQC60R040S7AXTMA1 FAQ

1.How can I place an order for IPQC60R040S7AXTMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for IPQC60R040S7AXTMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IPQC60R040S7AXTMA1 reliable?

The price and inventory of IPQC60R040S7AXTMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPQC60R040S7AXTMA1 is usually 5 days.

3.What payment methods are accepted for IPQC60R040S7AXTMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPQC60R040S7AXTMA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IPQC60R040S7AXTMA1?

IPQC60R040S7AXTMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IPQC60R040S7AXTMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IPQC60R040S7AXTMA1?

For technical support, including IPQC60R040S7AXTMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPQC60R040S7AXTMA1 requirements.

6.How does Aetrix verify that IPQC60R040S7AXTMA1 is sourced from the original manufacturer or authorized distributors?

All IPQC60R040S7AXTMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPQC60R040S7AXTMA1 meets industry standards.

7.What is the process for return or replacement of IPQC60R040S7AXTMA1?

All IPQC60R040S7AXTMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPQC60R040S7AXTMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IPQC60R040S7AXTMA1 part is unused and in its original packaging.

Return procedure for IPQC60R040S7AXTMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-08-06 Conditional Access Module: CAM, CI/CI+ and DVB Security

Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…

2026-08-03 Electronic Component Obsolescence: EOL Risks, Replacement Options and Last-Time Buy Strategy

Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

2026-07-08 Output Capacitor Selection for High-Current ASIC Vcore Rails

Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…

2026-07-07 High-Current ASIC Core Power Supply Design: 12-Phase Buck, PMBus and Dynamic Load Response

Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …