Infineon Technologies IPT60R055CFD7XTMA1
- Part No.:
- IPT60R055CFD7XTMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerSFN
- Datasheet:
-
IPT60R055CFD7XTMA1.pdf
- Description:
- MOSFET N-CH 600V 44A 8HSOF
- Quantity:
- Payment:

- Shipping:

Inventory:1,764
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IPT60R055CFD7XTMA1 from Infineon Technologies is a 600 V, 55 mΩ ultra-fast body diode CoolMOS™ CFD7 power MOSFET in PG-HSOF-8 (TOLL) package, optimized for soft-switching resonant topologies including phase-shift full-bridge (ZVS) and LLC converters. It delivers 129 A pulsed drain current, 67 nC total gate charge, and 1300 A/μs di/dt ruggedness, enabling high-efficiency, high-power-density server and EV charging power supplies.
For engineers reviewing the IPT60R055CFD7XTMA1 datasheet, IPT60R055CFD7XTMA1 pinout, IPT60R055CFD7XTMA1 application, or IPT60R055CFD7XTMA1 equivalent, key selection criteria include its low RDS(on) × Qg figure-of-merit (55 mΩ × 67 nC), best-in-class reverse recovery charge (Qrr = 0.61–1.22 μC), and validated hard commutation robustness per JEDEC industrial qualification.
Technical Context
This device implements Infineon's superjunction-based CoolMOS™ CFD7 architecture with an integrated ultra-fast body diode engineered for zero-voltage switching (ZVS) operation. Its reduced Qg (67 nC typ), low Qrr, and improved turn-off behavior directly enable lower switching losses in resonant topologies.
The TOLL package provides low thermal resistance (RthJC = 0.53 °C/W) and high-current capability via exposed drain tab. Pin configuration separates driver source (Pin 2) from power source (Pins 3–8), preventing ground loop errors and supporting stable paralleling when gate resistors are placed at the driver source.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 600 V - Maximum blocking voltage for primary-side switching in 400 V bus telecom/server PSUs and 800 V EV charger PFC stages. |
| RDS(on) | 55 mΩ max @ Tj = 25°C - Enables <44 A continuous conduction at 100°C case temperature with minimal conduction loss. |
| Qg | 67 nC typ - Reduces gate drive power and enables higher-frequency operation in LLC resonant controllers. |
| Qrr | 0.61–1.22 μC - Minimizes reverse recovery energy loss and EMI generation during hard commutation in ZVS transitions. |
| di/dt ruggedness | 1300 A/μs - Supports reliable operation under fast current transients in high-dV/dt resonant circuits without parasitic turn-on. |
| PD | 236 W @ TC = 25°C - Sustains high power density in compact TOLL-packaged designs with direct heatsink mounting. |
| RthJC | 0.53 °C/W - Enables efficient thermal path from junction to heatsink, critical for >3 kW resonant converter modules. |
Pinout & Package
Package: PG-HSOF-8 (TOLL) - thermally enhanced surface-mount package with exposed drain tab for direct heatsink attachment and low-inductance source connection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain Tab | Power Drain Terminal | Exposed copper pad carrying full load current; must be soldered to PCB copper pour or heatsink for thermal and electrical performance. |
| Pin 1 | Gate | Control input; requires low-impedance gate driver due to 67 nC Qg; sensitive to noise coupling. |
| Pin 2 | Driver Source | Reference node for gate driver IC; isolates gate loop from high di/dt power source paths to prevent false triggering. |
| Pins 3–8 | Power Source | Parallel source terminals carrying main current return path; must be routed with low inductance to minimize voltage spikes. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-fast body diode | Qrr = 0.61–1.22 μC and trr = 122–184 ns - Enables clean ZVS turn-on with minimal reverse recovery loss in LLC half-bridge legs. |
| Low RDS(on) × Qg FOM | 55 mΩ × 67 nC = 3.685 Ω·nC - Best-in-class tradeoff between conduction and switching loss for 600 V resonant applications. |
| Hard commutation ruggedness | 1300 A/μs di/dt rating and 120 V/ns dv/dt rating - Ensures reliable operation during non-resonant transients without external snubbers. |
| JEDEC industrial qualification | Fully qualified per JESD47 - Guarantees long-term reliability in 24/7 server PSU and EV charging environments up to Tj = 150°C. |
| TOLL package thermal performance | RthJC = 0.53 °C/W - Delivers >2× thermal efficiency vs. TO-220, enabling smaller heatsinks in space-constrained 3–5 kW modules. |
Applications
| Server Power Supply | Telecom Rectifier |
|---|---|
|
Use Scenario: Primary-side switch in 3 kW+ 48 V output LLC resonant DC-DC converter for AI server racks. IC Role / Device Role / Timing Role: High-side synchronous rectifier switch operating at 300–700 kHz with ZVS turn-on enabled by ultra-low Qrr. Use Value: Reduces switching loss by 22% vs. CFD2 generation, enabling >97% peak efficiency and 20% higher power density. |
Use Scenario: Main switch in 48 V telecom rectifier with active clamp forward topology requiring fast body diode recovery. IC Role / Device Role / Timing Role: Low-side switch handling bidirectional current during active clamp reset and freewheeling phases. Use Value: Eliminates need for external SiC Schottky anti-parallel diode due to 1300 A/μs di/dt ruggedness and low VF = 1.0 V. |
| EV Onboard Charger | Industrial UPS Inverter |
|
Use Scenario: Secondary-side synchronous rectifier in 11 kW bidirectional OBC LLC stage converting 800 V battery to 400 V HV bus. IC Role / Device Role / Timing Role: Fast-recovery body diode conducts reverse current during dead-time, enabling ZVS across full load range. Use Value: Achieves <1.22 μC Qrr at 125°C, reducing dead-time loss and improving light-load efficiency by 3.1%. |
Use Scenario: Half-bridge leg switch in 5 kVA industrial UPS inverter with soft-switched phase-shift control. IC Role / Device Role / Timing Role: Resonant switch managing high di/dt transitions during zero-current switching (ZCS) commutation. Use Value: Withstands 1300 A/μs di/dt without oscillation, eliminating need for gate resistors >10 Ω and simplifying gate drive design. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-efficiency resonant switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IPT60R065CFD7 | RDS(on) = 65 mΩ (higher conduction loss), same Qg and Qrr specs | Better suited for cost-sensitive 1.5–2 kW telecom rectifiers where thermal margin allows higher RDS(on) | Select when BOM cost reduction outweighs 8–10% conduction loss increase at full load. |
| IPW60R055CFD7 | TO-247-3L package, identical die but higher RthJC = 0.75 °C/W and no driver-source pin separation | Preferred for legacy through-hole designs or prototyping where TOLL reflow process is unavailable | Choose only if board assembly constraints prohibit SMD TOLL; expect ~15% lower thermal performance. |
Compared with IPT60R065CFD7 and IPW60R055CFD7, IPT60R055CFD7XTMA1 offers the lowest RDS(on) in SMD form factor with dedicated driver-source isolation-critical for noise-immune gate drive in high-density 3+ kW resonant converters.
Availability
IPT60R055CFD7XTMA1 is available at Aetrix Electronics and suitable for server power supplies, telecom rectifiers, and EV onboard chargers requiring stable component supply, JEDEC-qualified reliability, and high-volume production support.
Supply support for IPT60R055CFD7XTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive, and industrial control ICs and discrete devices, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
This part belongs to the CoolMOS™ CFD7 product line-designed specifically for soft-switching resonant topologies such as LLC and phase-shift full-bridge, balancing ultra-low Qrr, high di/dt ruggedness, and ease of implementation in high-efficiency power systems.
FAQ
Can IPT60R055CFD7XTMA1 replace older CoolMOS™ CFD2 devices in existing designs?
Yes, it is a direct drop-in replacement for IPT60R055CFD2 in most cases, offering improved Qrr (−35%), lower Qg (−12%), and higher di/dt ruggedness (1300 A/μs vs. 900 A/μs). However, gate drive timing may require minor adjustment due to lower threshold voltage (VGS(th) = 3.5–4.5 V) and steeper transconductance curve.
What is the purpose of the separate Driver Source (Pin 2) versus Power Source (Pins 3–8)?
Pin 2 provides a dedicated low-noise reference for the gate driver IC, decoupling the gate loop from high-di/dt power return paths. This prevents false turn-on caused by source inductance-induced voltage spikes during switching transitions-critical for stable operation above 300 kHz.
Is the TOLL package compatible with standard reflow profiles?
Yes, it is MSL1 rated and qualified for peak reflow temperatures up to 260°C. The package uses lead-free terminations and meets IPC/JEDEC J-STD-020D moisture sensitivity requirements-no pre-bake needed before assembly.
Does this MOSFET require an external anti-parallel diode in LLC half-bridge configurations?
No. Its integrated ultra-fast body diode (trr = 122–184 ns, Qrr = 0.61–1.22 μC) is fully characterized and qualified for hard commutation, eliminating the need for external SiC or silicon Schottky diodes in typical LLC secondary-side synchronous rectification.
IPT60R055CFD7XTMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- CoolMOS™ CFD7
- Package/Case:
- 8-PowerSFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 600 V
- Current - Continuous Drain (Id) @ 25°C:
- 44A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 55mOhm @ 15.1A, 10V
- Vgs(th) (Max) @ Id:
- 4.5V @ 760µA
- Gate Charge (Qg) (Max) @ Vgs:
- 67 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2721 pF @ 400 V
- FET Feature:
- -
- Power Dissipation (Max):
- 236W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-HSOF-8-2
IPT60R055CFD7XTMA1 FAQ
1.How can I place an order for IPT60R055CFD7XTMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IPT60R055CFD7XTMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IPT60R055CFD7XTMA1 reliable?
The price and inventory of IPT60R055CFD7XTMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPT60R055CFD7XTMA1 is usually 5 days.
3.What payment methods are accepted for IPT60R055CFD7XTMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPT60R055CFD7XTMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IPT60R055CFD7XTMA1?
IPT60R055CFD7XTMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IPT60R055CFD7XTMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IPT60R055CFD7XTMA1?
For technical support, including IPT60R055CFD7XTMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPT60R055CFD7XTMA1 requirements.
6.How does Aetrix verify that IPT60R055CFD7XTMA1 is sourced from the original manufacturer or authorized distributors?
All IPT60R055CFD7XTMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPT60R055CFD7XTMA1 meets industry standards.
7.What is the process for return or replacement of IPT60R055CFD7XTMA1?
All IPT60R055CFD7XTMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPT60R055CFD7XTMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPT60R055CFD7XTMA1 part is unused and in its original packaging.
Return procedure for IPT60R055CFD7XTMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IPT60R055CFD7XTMA1 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

