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Infineon Technologies IPT60R150G7XTMA1

Part No.:
IPT60R150G7XTMA1
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
8-PowerSFN
Datasheet:
AetrixIPT60R150G7XTMA1.pdf
Description:
MOSFET N-CH 600V 17A 8HSOF
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,304

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Product details

Overview

IPT60R150G7XTMA1 from Infineon is a 600 V, 150 mΩ silicon carbide–compatible superjunction MOSFET in TOLL (PG-HSOF-8) package, featuring Kelvin Source configuration for reduced gate oscillation and <1 nH source inductance. It delivers 45 A pulsed drain current, 2.74 μJ Eoss at 400 V, and 700 A/μs body diode di/dt - optimized for high-efficiency PFC and LLC resonant converters up to 3 kW in server, telecom, and solar inverters.

For engineers reviewing the IPT60R150G7XTMA1 datasheet, IPT60R150G7XTMA1 pinout, IPT60R150G7XTMA1 application, or IPT60R150G7XTMA1 equivalent, key selection criteria include RDS(on) × Qg FOM (15% better than prior C7), MSL1-compliant SMD thermal performance (RthJC = 1.18 °C/W), and validated hard/soft-switching capability in industrial-grade topologies.

Technical Context

This CoolMOS™ G7 device implements a superjunction structure with optimized charge balancing for low RDS(on) × Qg and RDS(on) × Eoss figures of merit. Its Kelvin Source architecture separates power and sensing source paths, enabling precise gate control and minimizing parasitic inductance-induced ringing during fast switching.

The TOLL package integrates four dedicated source terminals (Pins 3–8 for power source, Pin 2 for Kelvin source), supports reflow soldering at 260 °C, and achieves 35–45 °C/W junction-to-ambient resistance on a 40 mm × 40 mm FR4 PCB - enabling SMD deployment in >2 kW continuous conduction mode PFC stages.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 600 V - rated blocking voltage for primary-side switching in 400 V DC bus systems (e.g., telecom rectifiers, UPS).
RDS(on) 150 mΩ max @ Tj = 25°C - enables low conduction loss in high-current PFC boost stages with ≤17 A continuous rating.
Qg 23 nC total - low gate charge supports high-frequency operation (>100 kHz) while maintaining manageable drive strength requirements.
Eoss 2.74 μJ @ 400 V - minimized output capacitance energy reduces turn-on loss in hard-switched topologies and improves ZVS initiation in LLC.
ID,pulse 45 A - supports peak current handling in transient-loaded PFC and PWM stages without derating beyond thermal limits.
di/dt (body diode) 700 A/μs - ensures robust commutation in synchronous rectification and bidirectional power flow applications.
RthJC 1.18 °C/W - enables direct heatsink mounting via drain tab for efficient thermal management in compact SMD layouts.

Pinout & Package

Package: PG-HSOF-8 (TOLL), surface-mount, MSL1, lead-free die attach, grooved leads for visual inspection. Drain tab exposed on underside for thermal and electrical connection.

Pin/Terminal Circuit Role Design Meaning
Drain Tab Power Drain / Thermal Path Primary current path and main thermal interface; soldered directly to PCB copper pour or heatsink.
Pin 1 Gate Control input; requires low-inductance gate loop layout to exploit Kelvin Source benefits.
Pin 2 Kelvin Source (Sense) Reference return for gate driver IC feedback; decouples gate loop from high-di/dt power source path.
Pins 3–8 Power Source Parallel low-inductance source terminals carrying full load current; collectively minimize Vsource bounce.

Key Features

Feature Design Value
4-pin Kelvin Source configuration Reduces effective source inductance to ~1 nH, suppressing gate ringing and enabling stable >1 MHz switching without ferrite beads.
C7 GOLD superjunction technology Delivers best-in-class RDS(on) × Qg FOM - 15% improvement over prior 600 V C7, enabling higher efficiency at same silicon area.
TOLL package thermal performance RthJA = 35–45 °C/W on standard FR4 - allows SMD implementation in 3 kW PFC where TO-247 devices previously dominated.
JEDEC-qualified industrial reliability Qualified per JESD47; rated for continuous operation at Tj ≤ 150°C - suitable for unattended 24/7 server and telecom infrastructure.
Body diode with 700 A/μs di/dt Enables reliable zero-voltage switching in LLC half-bridge and bidirectional DC–DC converters without external SiC diodes.

Applications

Server Power Supply PFC Stage Telecom Rectifier LLC Resonant Converter

Use Scenario: Active front-end boost converter in 2–3 kW redundant AC–DC power supplies for cloud data centers.

IC Role / Device Role / Timing Role: High-side switch in continuous conduction mode (CCM) PFC, operating at 65–100 kHz with critical gate timing control.

Use Value: Kelvin Source eliminates need for gate ferrite beads, reducing BOM count and layout complexity while maintaining <1% efficiency penalty at full load.

Use Scenario: Primary-side switch in asymmetric half-bridge LLC resonant converter for 48 V telecom rectifiers (3.3 kW).

IC Role / Device Role / Timing Role: Hard-switched ZVS-capable switch with precise dead-time control enabled by low Eoss and predictable Qgd.

Use Value: 2.74 μJ Eoss at 400 V reduces turn-on loss by 22% vs. legacy C6 devices, improving full-load efficiency to ≥97.2%.

Solar String Inverter DC–DC Stage Industrial UPS Inverter Bridge

Use Scenario: Isolated DC–DC stage stepping up PV array voltage (600–1000 V) to intermediate bus in string inverters.

IC Role / Device Role / Timing Role: Primary switch in phase-shifted full-bridge topology, requiring robust body diode recovery under reverse conduction.

Use Value: 700 A/μs body diode di/dt and 245 ns trr ensure clean commutation without voltage overshoot, eliminating snubbers in 10–20 kHz operation.

Use Scenario: Output H-bridge in online double-conversion UPS (2–5 kVA), switching 400 V DC bus to 230 V AC with low THD.

IC Role / Device Role / Timing Role: Low-RDS(on) switching element handling 17 A continuous current with minimal thermal derating.

Use Value: RthJC = 1.18 °C/W enables direct heatsink mounting in constrained chassis, reducing thermal interface layers and improving long-term reliability.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage superjunction MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
IPW60R099C7 RDS(on) = 99 mΩ (lower), Qg = 32 nC (higher), same TOLL package, no Kelvin Source Better conduction loss but higher switching loss; requires gate ferrite for stability above 60 kHz Select when PFC stage prioritizes conduction efficiency over switching frequency headroom
STP60N6F7 RDS(on) = 145 mΩ, Qg = 26 nC, TO-220FP package, no Kelvin Source, RthJC = 1.5 °C/W Larger footprint, higher thermal resistance, no SMD capability; limited to ≤1.5 kW designs Select only for cost-sensitive, lower-power (<1.2 kW), through-hole legacy designs with no layout redesign budget

Compared with IPW60R099C7 and STP60N6F7, IPT60R150G7XTMA1 uniquely balances switching efficiency, SMD manufacturability, and gate drive simplicity - making it the optimal choice for new 2–3 kW PFC/LLC platforms where board space, thermal density, and production scalability are critical.

Availability

IPT60R150G7XTMA1 is available at Aetrix Electronics and suitable for server power supplies, telecom rectifiers, and solar string inverters requiring stable component supply, JEDEC-qualified industrial reliability, and SMD-compatible high-current switching performance.

Supply support for IPT60R150G7XTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices.

This part belongs to the CoolMOS™ G7 superjunction MOSFET product line, engineered specifically for high-efficiency, high-power-density AC–DC and DC–DC conversion in data center, telecom, and renewable energy systems.

FAQ

What is the maximum continuous drain current rating for IPT60R150G7XTMA1?

The maximum continuous drain current is 17 A at Tc = 25°C and derates to 11 A at Tc = 100°C per the datasheet's absolute maximum ratings table. This rating assumes proper PCB copper area (6 cm² drain pad) and ambient cooling conditions - not case temperature alone.

Does IPT60R150G7XTMA1 require external gate ferrite beads in PFC applications?

No - the integrated 4-pin Kelvin Source configuration reduces source inductance to ~1 nH, eliminating gate ringing in typical 65–100 kHz PFC designs without ferrite beads. Ferrites are only recommended if layout introduces >5 nH gate loop inductance or when paralleling multiple devices.

How does the TOLL package improve thermal performance versus TO-220 or TO-247?

The TOLL package achieves RthJC = 1.18 °C/W - 25% lower than comparable TO-247 devices - due to its exposed drain tab, optimized copper clip construction, and direct thermal path to PCB. On a 40 mm × 40 mm FR4 board, RthJA is 35–45 °C/W, enabling 30% higher power density than through-hole alternatives.

Is IPT60R150G7XTMA1 suitable for synchronous rectification in LLC converters?

Yes - its body diode supports 700 A/μs di/dt and 245 ns reverse recovery time, enabling clean commutation in secondary-side synchronous rectification. However, it is not optimized as a dedicated SR FET; use only in primary-side or asymmetrical bridge configurations where its VDS and RDS(on) align with system voltage and current demands.

IPT60R150G7XTMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
CoolMOS™ G7
Package/Case:
8-PowerSFN
Packaging:
Tape & Reel (TR)
Product Status:
Last Time Buy
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
600 V
Current - Continuous Drain (Id) @ 25°C:
17A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
150mOhm @ 5.3A, 10V
Vgs(th) (Max) @ Id:
4V @ 260µA
Gate Charge (Qg) (Max) @ Vgs:
23 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
902 pF @ 400 V
FET Feature:
-
Power Dissipation (Max):
106W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-HSOF-8-2

IPT60R150G7XTMA1 FAQ

1.How can I place an order for IPT60R150G7XTMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for IPT60R150G7XTMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IPT60R150G7XTMA1 reliable?

The price and inventory of IPT60R150G7XTMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPT60R150G7XTMA1 is usually 5 days.

3.What payment methods are accepted for IPT60R150G7XTMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPT60R150G7XTMA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IPT60R150G7XTMA1?

IPT60R150G7XTMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IPT60R150G7XTMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IPT60R150G7XTMA1?

For technical support, including IPT60R150G7XTMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPT60R150G7XTMA1 requirements.

6.How does Aetrix verify that IPT60R150G7XTMA1 is sourced from the original manufacturer or authorized distributors?

All IPT60R150G7XTMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPT60R150G7XTMA1 meets industry standards.

7.What is the process for return or replacement of IPT60R150G7XTMA1?

All IPT60R150G7XTMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPT60R150G7XTMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IPT60R150G7XTMA1 part is unused and in its original packaging.

Return procedure for IPT60R150G7XTMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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