Infineon Technologies IPT65R040CFD7XTMA1
- Part No.:
- IPT65R040CFD7XTMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerSFN
- Datasheet:
-
IPT65R040CFD7XTMA1.pdf
- Description:
- MOSFET N-CH 650V 8HSOF
- Quantity:
- Payment:

- Shipping:

Inventory:2,000
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IPT65R040CFD7XTMA1 from Infineon is a 650 V superjunction MOSFET with 40 mΩ max RDS(on), ultra-fast body diode (diF/dt = 1300 A/µs), and PG-HSOF-8 package. It serves as a primary-side switching device in resonant topologies-LLC and phase-shift full-bridge-with ZVS operation, delivering high efficiency at light and full load in industrial SMPS.
For engineers reviewing the IPT65R040CFD7XTMA1 datasheet, IPT65R040CFD7XTMA1 pinout, IPT65R040CFD7XTMA1 application, or IPT65R040CFD7XTMA1 equivalent, key selection criteria include hard commutation ruggedness, low temperature coefficient of RDS(on), Eoss = 14.8 µJ @ 400 V, and gate charge Qg = 97 nC for optimized ZVS timing control.
Technical Context
This CoolMOS™ CFD7 device implements a superjunction structure with integrated fast-recovery body diode, enabling robust hard-switching capability while maintaining low conduction and switching losses. Its diF/dt rating of 1300 A/µs and reverse recovery charge Qrr = 1.3–2.6 µC support reliable operation under high di/dt stress in ZVS circuits.
The MOSFET features a gate plateau voltage of 5.7 V and exhibits minimal RDS(on) drift over temperature (typ. 1.0× at Tj = 125 °C vs. 25 °C), ensuring stable current handling across industrial thermal ranges. Its Co(er) = 185 pF and Ciss = 4975 pF are optimized for soft-switching gate drive design in high-frequency resonant converters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS max | 650 V - supports 400 V bus designs with 1.6× safety margin for transient overvoltage in telecom/server PSUs |
| RDS(on) max | 40 mΩ @ Tj = 25 °C - enables <63 A continuous drain current at TC = 25 °C with low conduction loss |
| Qg typ | 97 nC - determines gate driver power requirement and influences ZVS dead-time tuning precision |
| Eoss | 14.8 µJ @ 400 V - directly impacts turn-on switching loss and resonant tank energy recycling efficiency |
| diF/dt max | 1300 A/µs - ensures reliable body diode commutation during hard-switching events without oscillation or latch-up |
| Tj max | 150 °C - qualified per JEDEC JESD47 for industrial applications with extended thermal headroom |
| RthJC | 0.36 °C/W - enables high-power dissipation (347 W @ TC = 25 °C) with direct tab cooling |
Pinout & Package
Package: PG-HSOF-8 - surface-mount, thermally enhanced 8-pin package with exposed drain tab for low-inductance, high-current PCB mounting and direct heatsink coupling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain Tab | Main power drain connection | Exposed copper pad carrying full load current; must be soldered to large copper area for thermal and electrical performance |
| Pin 1 | Source | Power source terminal; referenced for gate drive and current sensing; not interchangeable with sense source |
| Pin 2 | Driver Source | Dedicated Kelvin source for gate driver return path; minimizes gate loop inductance and improves switching stability |
| Pins 3–8 | Source (parallel) | Additional source connections to reduce package resistance and improve current sharing across internal dies |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-fast body diode | diF/dt = 1300 A/µs enables reliable hard commutation in asymmetric half-bridge and PSFB without snubbers |
| Low RDS(on) tempco | RDS(on) increases only ~1.0× from 25 °C to 125 °C - maintains current derating predictability in thermal cycling |
| Reduced Eoss | 14.8 µJ @ 400 V lowers turn-on loss and eases ZVS condition across wide load range in LLC converters |
| High avalanche energy | EAS = 248 mJ (single pulse) provides margin against inductive switching transients in unregulated systems |
| JEDEC industrial qualification | Fully qualified per JESD47 - validated for 150 °C Tj, 1000-hr HTOL, and HAST, supporting long-life server/industrial deployments |
Applications
| Server Power Supply | Telecom Rectifier |
|---|---|
|
Use Scenario: Primary-side switch in 3–6 kW LLC resonant DC-DC converters powering CPU/GPU VRMs. IC Role / Device Role / Timing Role: High-voltage switching element operating in zero-voltage switching mode with precise dead-time control. Use Value: 14.8 µJ Eoss and 97 nC Qg enable >96% full-load efficiency and >94% efficiency at 10% load. |
Use Scenario: Main switch in 2–4 kW phase-shift full-bridge rectifiers for -48 V telecom distribution. IC Role / Device Role / Timing Role: Hard-commutated high-side switch requiring robust body diode recovery under high diF/dt. Use Value: 1300 A/µs diF/dt rating prevents diode-induced shoot-through and eliminates need for external anti-parallel SiC diodes. |
| EV Onboard Charger | Solar String Inverter |
|
Use Scenario: Primary-side switch in bi-directional CLLC converters for 11 kW AC/DC + DC/AC OBC systems. IC Role / Device Role / Timing Role: Bidirectional resonant switch managing both charging and vehicle-to-grid (V2G) energy flow. Use Value: Low RDS(on) tempco and 150 °C Tj rating sustain performance across ambient temperatures from -40 °C to +85 °C. |
Use Scenario: High-side switch in 5–10 kW two-stage solar inverters with boost + full-bridge topology. IC Role / Device Role / Timing Role: Fast-switching boost switch handling high input ripple current and partial shading transients. Use Value: 248 mJ single-pulse avalanche energy withstands lightning-induced surges on PV input without clamping circuitry. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 650 V superjunction MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IPW65R041C7 | RDS(on) max = 41 mΩ; Qg = 95 nC; same PG-TO247-4 package; no dedicated Driver Source pin | Lacks Kelvin source - higher gate loop inductance limits ZVS reliability above 300 kHz | Prefer for TO-247-based legacy designs where PCB layout cannot accommodate HSOF-8's compact footprint |
| STP65N045M6 | RDS(on) max = 45 mΩ; Qg = 102 nC; standard TO-220FP package; diF/dt = 800 A/µs | Lower diode ruggedness requires external snubber in PSFB; higher RDS(on) increases conduction loss by ~12.5% | Acceptable for cost-sensitive 1–2 kW telecom supplies where peak efficiency is secondary to BOM cost |
Compared with IPW65R041C7 and STP65N045M6, IPT65R040CFD7XTMA1 delivers superior ZVS margin via its dedicated Driver Source pin and 62.5% higher diF/dt, making it optimal for high-density, high-efficiency 3+ kW resonant converters where thermal and switching loss budgets are constrained.
Availability
IPT65R040CFD7XTMA1 is available at Aetrix Electronics and suitable for server power supplies, telecom rectifiers, and EV onboard chargers requiring stable component supply, JEDEC-qualified industrial reliability, and high thermal conductivity packaging.
Supply support for IPT65R040CFD7XTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices.
The CoolMOS™ CFD7 product line targets high-efficiency resonant power conversion, specifically engineered for ZVS topologies like LLC and phase-shift full-bridge in datacenter, telecom, and renewable energy systems.
FAQ
Can IPT65R040CFD7XTMA1 replace older CFD2-series MOSFETs in existing designs?
Yes, it is a direct successor to the 650 V CoolMOS™ CFD2 series with identical pinout and improved RDS(on), switching loss, and body diode performance. Layout compatibility is maintained, but gate drive strength should be verified due to 97 nC Qg-slightly higher than CFD2's typical 85 nC. No PCB changes are required.
What is the purpose of the Driver Source (Pin 2) versus Source (Pin 1)?
Pin 2 (Driver Source) is a Kelvin connection exclusively for gate driver return, minimizing gate loop inductance and preventing oscillation during fast switching. Pin 1 (Source) carries main power current and must not be used for gate reference. Swapping them causes unstable turn-on and potential device failure.
Is parallel operation supported, and what layout guidance applies?
Yes, parallel operation is supported using multiple IPT65R040CFD7XTMA1 units. Gate resistors must be placed on the Driver Source (Pin 2), not the Gate, to ensure balanced dynamic current sharing. Symmetrical PCB trace lengths and individual gate resistor placement per device are mandatory for stability.
Does this MOSFET require a negative gate voltage for reliable turn-off?
No. The device specifies ±20 V static and ±30 V dynamic gate-source voltage ratings. A gate drive of 0 V to +12–15 V is sufficient for full enhancement and safe turn-off. Negative bias is unnecessary and not recommended, as it adds complexity without improving ruggedness or switching speed.
IPT65R040CFD7XTMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- CoolMOS™ CFD7
- Package/Case:
- 8-PowerSFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 650 V
- Current - Continuous Drain (Id) @ 25°C:
- -
- Drive Voltage (Max Rds On, Min Rds On):
- -
- Rds On (Max) @ Id, Vgs:
- -
- Vgs(th) (Max) @ Id:
- -
- Gate Charge (Qg) (Max) @ Vgs:
- -
- Vgs (Max):
- -
- Input Capacitance (Ciss) (Max) @ Vds:
- -
- FET Feature:
- -
- Power Dissipation (Max):
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-HSOF-8-2
IPT65R040CFD7XTMA1 FAQ
1.How can I place an order for IPT65R040CFD7XTMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IPT65R040CFD7XTMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IPT65R040CFD7XTMA1 reliable?
The price and inventory of IPT65R040CFD7XTMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPT65R040CFD7XTMA1 is usually 5 days.
3.What payment methods are accepted for IPT65R040CFD7XTMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPT65R040CFD7XTMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IPT65R040CFD7XTMA1?
IPT65R040CFD7XTMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IPT65R040CFD7XTMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IPT65R040CFD7XTMA1?
For technical support, including IPT65R040CFD7XTMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPT65R040CFD7XTMA1 requirements.
6.How does Aetrix verify that IPT65R040CFD7XTMA1 is sourced from the original manufacturer or authorized distributors?
All IPT65R040CFD7XTMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPT65R040CFD7XTMA1 meets industry standards.
7.What is the process for return or replacement of IPT65R040CFD7XTMA1?
All IPT65R040CFD7XTMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPT65R040CFD7XTMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPT65R040CFD7XTMA1 part is unused and in its original packaging.
Return procedure for IPT65R040CFD7XTMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IPT65R040CFD7XTMA1 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

