Infineon Technologies IPTG029N13NM6ATMA1
- Part No.:
- IPTG029N13NM6ATMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- -
- Datasheet:
-
IPTG029N13NM6ATMA1.pdf
- Description:
- TRENCH >=100V
- Quantity:
- Payment:

- Shipping:

Inventory:1,800
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IPTG029N13NM6ATMA1 from Infineon Technologies is an N-channel enhancement-mode MOSFET optimized for high-efficiency motor drives and battery-powered systems, featuring 135 V VDS, 2.9 mΩ RDS(on) max at VGS = 10 V, 212 A continuous drain current, 104 nC total gate charge, and 118 nC reverse recovery charge. It uses PG-HSOG-8 package with exposed drain tab for thermal performance.
For engineers reviewing the IPTG029N13NM6ATMA1 datasheet, IPTG029N13NM6ATMA1 pinout, IPTG029N13NM6ATMA1 application, or IPTG029N13NM6ATMA1 equivalent, key selection criteria include low Qg×RDS(on) figure-of-merit, 175 °C operation, 100% avalanche rating, and optimized switching behavior for synchronous rectification in BLDC inverters and e-bike controllers.
Technical Context
This OptiMOSTM 6 device employs trench-gate superjunction architecture to achieve ultra-low RDS(on) while maintaining fast switching with Qrr = 118 nC and trr = 32–64 ns. Its gate plateau voltage of 4.5 V enables robust drive margin in 12 V gate-drive systems.
The MOSFET supports hard-switched and synchronous rectifier topologies with validated avalanche energy (EAS = 435 mJ) and thermal resistance RthJC = 0.5 °C/W, enabling high-power density designs in constrained thermal environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 135 V - Supports 48 V and 60 V nominal battery systems with ≥2× safety margin against transients. |
| RDS(on) max | 2.9 mΩ at VGS = 10 V - Enables <1.2 W conduction loss at 200 A, critical for high-current motor phases. |
| ID continuous | 212 A at TC = 25 °C - Rated for sustained output in 1–3 kW motor inverters with active heatsinking. |
| Qg | 104 nC - Low gate drive power requirement; compatible with standard 1-A peak gate drivers at 100 kHz switching. |
| Qrr | 118 nC - Reduces body-diode switching losses and EMI in synchronous buck and half-bridge configurations. |
| Tj max | 175 °C - Allows operation in sealed enclosures or high-ambient industrial environments without derating. |
| RthJC | 0.5 °C/W - Enables direct mounting to heatsink via exposed drain tab, supporting >250 W dissipation with ΔT = 125 K. |
Pinout & Package
PG-HSOG-8 package with thermally enhanced exposed drain pad (TAB), surface-mount footprint, and 8-pin layout optimized for high-current PCB routing and thermal transfer.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| TAB (Drain) | Main current path, thermal interface | Exposed copper pad carrying full load current and conducting heat directly to heatsink or PCB copper pour. |
| Pin 1 | Gate | Control terminal requiring low-inductance gate loop; connects to driver IC output with RC snubber option. |
| Pins 2–8 | Source | Parallel-source configuration reduces source inductance and improves switching stability under high di/dt. |
Key Features
| Feature | Design Value |
|---|---|
| Optimized FOM (Qg × RDS(on)) | 302 nC·mΩ - Balances switching loss and conduction loss for highest efficiency in 20–100 kHz motor control. |
| 100% unclamped inductive switching (UIS) tested | EAS = 435 mJ - Guarantees ruggedness during fault conditions like phase short or regenerative braking spikes. |
| Low Qrr and fast trr | Qrr = 118 nC, trr = 32 ns - Minimizes shoot-through risk and reduces diode recovery loss in synchronous rectifiers. |
| MOSFET-specific gate threshold | VGS(th) = 2.5–3.5 V - Ensures clean turn-on with standard 3.3 V/5 V logic-level drivers and avoids partial conduction near zero VGS. |
Applications
| Power Tool Motor Inverter | E-Bike 48 V Drive Stage |
|---|---|
Use Scenario: High-torque, intermittent-duty BLDC inverter in cordless drills and impact drivers operating up to 200 A peak. IC Role / Device Role / Timing Role: Main switch in 3-phase inverter leg, handling bidirectional current and regenerative energy during deceleration. Use Value: 2.9 mΩ RDS(on) limits conduction loss to <1.2 W at 200 A, extending battery runtime and reducing heatsink size by 35% vs. legacy 5 mΩ devices. | Use Scenario: 48 V battery-powered e-bike controller delivering 500–1000 W continuous power with field-oriented control. IC Role / Device Role / Timing Role: Synchronous rectifier in high-side and low-side positions of 3-phase inverter, replacing freewheeling diodes. Use Value: 118 nC Qrr and 32 ns trr reduce body-diode losses by 60% versus standard MOSFETs, improving system efficiency from 92% to 94.5% at 500 W. |
| Industrial Pump Inverter | UPS DC-AC Bridge |
Use Scenario: Sealed, fanless 1.5 kW pump drive operating continuously at 40–60 °C ambient in HVAC and water systems. IC Role / Device Role / Timing Role: High-current switching element in IGBT-replacement topology, driven by isolated gate driver with 15 V supply. Use Value: 175 °C Tj rating and 0.5 °C/W RthJC allow full 212 A rating without forced air, eliminating fan-related reliability concerns. | Use Scenario: Online double-conversion UPS using Si MOSFET-based H-bridge for 1 kVA output with low THD requirements. IC Role / Device Role / Timing Role: Fast-switching bridge arm device enabling 20 kHz PWM with minimal dead-time distortion. Use Value: 104 nC Qg and 16 ns td(on) support precise 50 ns dead-time control, reducing output voltage distortion and filter component count. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-current N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IPB029N13N5 | Same VDS (135 V), higher RDS(on) (3.2 mΩ), TO-263-7 package, no exposed drain tab | Limited thermal performance in space-constrained layouts; requires larger heatsink area | Select when board-level thermal management favors through-hole mounting or when PG-HSOG-8 footprint is unavailable. |
| STL220N10F7 | Lower VDS (100 V), similar RDS(on) (2.8 mΩ), same PG-HSOG-8 package, lower Qg (85 nC) | Not suitable for 48 V systems with >100 V transients; better for 24 V or 36 V battery platforms | Select for cost-sensitive 24–36 V applications where 135 V rating is unnecessary and faster switching is prioritized. |
Compared with IPB029N13N5 and STL220N10F7, IPTG029N13NM6ATMA1 delivers superior thermal capability via its exposed drain tab and highest voltage margin for 48 V+ systems, making it optimal for compact, high-power-density motor drives where both electrical and thermal headroom are critical.
Availability
IPTG029N13NM6ATMA1 is available at Aetrix Electronics and suitable for power tool motor inverters, e-bike drive stages, industrial pump inverters, and UPS DC-AC bridges requiring stable component supply across production ramp and long-term maintenance cycles.
Supply support for IPTG029N13NM6ATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with leadership in silicon and wide-bandgap power devices.
This part belongs to the OptiMOSTM 6 family-designed specifically for high-efficiency, high-current switching in battery-powered and motor-control applications where low RDS(on), fast switching, and ruggedness are mandatory.
FAQ
What is the maximum recommended gate drive voltage for IPTG029N13NM6ATMA1?
The absolute maximum gate-source voltage is ±20 V, but the recommended operating range is 10–15 V for optimal RDS(on) and safe margin against overshoot. Driving at 12 V achieves full enhancement while avoiding gate oxide stress; 15 V further reduces RDS(on) by ~15% but requires tighter layout control to suppress ringing.
Does IPTG029N13NM6ATMA1 require external gate resistors in typical motor drive applications?
Yes-external gate resistors (typically 2.2–10 Ω) are required to dampen gate oscillation and control dV/dt during switching. The device's low gate resistance (1.0–1.5 Ω) and 104 nC Qg make it sensitive to parasitic inductance; a 4.7 Ω resistor balances switching speed (≈30 ns rise time) and EMI suppression in 48 V inverter layouts.
Can IPTG029N13NM6ATMA1 be used in parallel configurations?
Yes-its positive temperature coefficient of RDS(on) (confirmed in Diagram 9) ensures inherent current sharing. For two devices in parallel, use matched gate drive paths, symmetrical PCB layout, and individual 1–2 Ω gate resistors to avoid dynamic imbalance; derate total current by 15% for thermal margin at 175 °C junction.
Is the drain tab electrically isolated from other pins in the PG-HSOG-8 package?
No-the drain tab is electrically connected to the internal drain structure and must be treated as a live high-current node. It is not insulated; isolation requires dielectric thermal interface material between tab and heatsink, and proper clearance/creepage design per IEC 61800-5-1 for functional insulation in motor drives.
IPTG029N13NM6ATMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- -
- Technology:
- -
- Drain to Source Voltage (Vdss):
- -
- Current - Continuous Drain (Id) @ 25°C:
- -
- Drive Voltage (Max Rds On, Min Rds On):
- -
- Rds On (Max) @ Id, Vgs:
- -
- Vgs(th) (Max) @ Id:
- -
- Gate Charge (Qg) (Max) @ Vgs:
- -
- Vgs (Max):
- -
- Input Capacitance (Ciss) (Max) @ Vds:
- -
- FET Feature:
- -
- Power Dissipation (Max):
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
IPTG029N13NM6ATMA1 FAQ
1.How can I place an order for IPTG029N13NM6ATMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IPTG029N13NM6ATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IPTG029N13NM6ATMA1 reliable?
The price and inventory of IPTG029N13NM6ATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPTG029N13NM6ATMA1 is usually 5 days.
3.What payment methods are accepted for IPTG029N13NM6ATMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPTG029N13NM6ATMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IPTG029N13NM6ATMA1?
IPTG029N13NM6ATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IPTG029N13NM6ATMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IPTG029N13NM6ATMA1?
For technical support, including IPTG029N13NM6ATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPTG029N13NM6ATMA1 requirements.
6.How does Aetrix verify that IPTG029N13NM6ATMA1 is sourced from the original manufacturer or authorized distributors?
All IPTG029N13NM6ATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPTG029N13NM6ATMA1 meets industry standards.
7.What is the process for return or replacement of IPTG029N13NM6ATMA1?
All IPTG029N13NM6ATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPTG029N13NM6ATMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPTG029N13NM6ATMA1 part is unused and in its original packaging.
Return procedure for IPTG029N13NM6ATMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IPTG029N13NM6ATMA1 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

