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Infineon Technologies IPTG063N15NM5ATMA1

Part No.:
IPTG063N15NM5ATMA1
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
8-PowerSMD, Gull Wing
Datasheet:
AetrixIPTG063N15NM5ATMA1.pdf
Description:
TRENCH >=100V
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,774

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Product details

Overview

IPTG063N15NM5 from Infineon Technologies is an N-channel enhancement-mode MOSFET optimized for high-efficiency 150 V power conversion, featuring 6.3 mΩ max RDS(on) at VGS = 10 V, 122 A continuous drain current, and 100% avalanche-tested ruggedness. It serves as a primary switching device in DC-DC converters, motor drives, and industrial SMPS where low conduction loss and thermal robustness are critical.

For engineers reviewing the IPTG063N15NM5 datasheet, IPTG063N15NM5 pinout, IPTG063N15NM5 application, or IPTG063N15NM5 equivalent, key selection criteria include its PG-HSOG-8 package with exposed drain tab, gate charge profile (QG = 50 nC), reverse diode recovery (Qrr = 88–176 nC), and thermal resistance (RthJC = 0.7 °C/W).

Technical Context

This OptiMOSTM 5 device uses trench-gate superjunction technology to achieve ultra-low RDS(on) while maintaining fast switching (td(on) = 15 ns, tf = 5.0 ns) and low gate charge (Qgd = 10–15 nC). Its 150 V VDS rating and 154 mJ single-pulse avalanche energy support operation in hard-switched topologies with transient overvoltage stress.

The integrated body diode exhibits low forward voltage (VSD = 0.84–1.0 V at 50 A) and controlled reverse recovery (trr = 63–127 ns), enabling use in synchronous rectification and freewheeling applications without external Schottky supplementation.

Key Specifications

ParameterValue and Actual Design Meaning
VDS150 V - Withstands up to 150 V drain-source blocking voltage, suitable for 48 V and 96 V bus systems with margin.
RDS(on), max6.3 mΩ at VGS = 10 V - Enables <1 W conduction loss at 122 A, reducing heatsink requirements in high-current designs.
ID, cont.122 A at TC = 25 °C - Supports high-power output stages in industrial inverters and server PSUs.
QG50 nC - Low gate drive energy requirement, compatible with standard gate drivers (e.g., 1 A peak) at 100 kHz+ switching.
RthJC0.7 °C/W - Enables efficient heat transfer from junction to case, critical for compact thermal design with minimal copper area.
EAS154 mJ - Confirmed single-pulse avalanche capability allows reliable operation under inductive turn-off transients.
Qoss139 nC - Low output charge reduces turn-off losses and improves light-load efficiency in resonant converters.

Pinout & Package

Package: PG-HSOG-8 - Thermally enhanced surface-mount package with exposed drain tab (TAB) for direct PCB thermal coupling and mechanical stability.

Pin/TerminalCircuit RoleDesign Meaning
TAB (Drain)Main power drain connectionExposed metal pad tied to drain; must be soldered to large copper pour for thermal and current handling.
Pin 1GateControl input; requires low-inductance gate loop layout to minimize ringing during fast switching.
Pins 2–8SourceParallel source terminals reduce parasitic inductance and improve current sharing across internal die connections.

Key Features

FeatureDesign Value
Ultra-low RDS(on)6.3 mΩ max enables >98% efficiency in 122 A, 150 V switch-node applications with minimal conduction loss.
100% avalanche testedEach unit validated to withstand 154 mJ single-pulse avalanche energy, eliminating need for external clamping in inductive loads.
Optimized gate charge profileQgd/Qg ratio of ~20–30% ensures clean Miller plateau transition and reduced switching oscillation risk.
Thermally robust constructionRthJC = 0.7 °C/W and 6.2 °C/W RthJA (min footprint) supports operation up to 175 °C junction temperature.

Applications

Industrial Motor DrivesServer & Telecom SMPS

Use Scenario: Half-bridge inverter stage for 3 kW BLDC motor control in factory automation systems.

IC Role / Device Role / Timing Role: High-side and low-side main switching element with synchronous freewheeling via integrated body diode.

Use Value: 6.3 mΩ RDS(on) cuts conduction loss by 35% vs. legacy 10 mΩ devices, reducing heatsink size by 40% at 100 °C ambient.

Use Scenario: Primary-side switch in 3.3 kW LLC resonant converter for AI server power supplies.

IC Role / Device Role / Timing Role: ZVS-capable main switch leveraging low Qoss (139 nC) and fast tf (5.0 ns) for <100 kHz operation.

Use Value: 154 mJ EAS tolerance eliminates snubber circuits during resonant valley switching failures, improving reliability.

Solar MicroinvertersEV Onboard Chargers

Use Scenario: DC-link switching stage in 300 W microinverter with MPPT and grid-synchronization.

IC Role / Device Role / Timing Role: Unidirectional power switch in interleaved boost stage operating at 65–100 kHz.

Use Value: Low Qg (50 nC) and Qgd (10–15 nC) enable precise gate timing control with minimal driver power consumption (<150 mW).

Use Scenario: Isolated DC-DC stage in 11 kW bidirectional OBC for Level 2 AC charging.

IC Role / Device Role / Timing Role: Secondary-side synchronous rectifier with body diode used for startup and fault protection.

Use Value: VSD = 0.84 V and trr = 63 ns minimize reverse recovery loss, increasing full-load efficiency by 0.4% over discrete Schottky solutions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-current 150 V MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STL220N15F7RDS(on) = 5.5 mΩ (typ), QG = 62 nC, PG-HSOG-8 packageHigher gate charge increases driver loss; lower RDS(on) benefits low-frequency, high-current apps onlyPrefer when lowest conduction loss dominates and gate drive capability supports higher QG.
IXFH50N15X3RDS(on) = 15 mΩ (max), TO-247 package, RthJC = 0.45 °C/WLarger footprint and higher RDS(on) but superior thermal resistance for forced-air coolingChoose for legacy TO-247 designs requiring higher avalanche margin and simpler thermal interface.

Compared with STL220N15F7 and IXFH50N15X3, IPTG063N15NM5 delivers optimal balance of low RDS(on), moderate QG, and surface-mount thermal performance-making it ideal for space-constrained, high-frequency industrial and EV power stages where PCB thermal management is prioritized over raw avalanche margin.

Availability

IPTG063N15NM5 is available at Aetrix Electronics and suitable for industrial motor drives, server SMPS, solar microinverters, and EV onboard chargers requiring stable component supply and JEDEC-qualified reliability.

Supply support for IPTG063N15NM5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and industrial control solutions, with global manufacturing and quality certification to ISO/TS 16949 and IECQ QC 080000.

The OptiMOSTM 5 product line targets high-efficiency, high-reliability power conversion in industrial, renewable energy, and e-mobility applications-designed specifically to replace older planar MOSFETs with trench-based superjunction architecture for lower losses and improved thermal behavior.

FAQ

What is the maximum recommended gate voltage for IPTG063N15NM5?

The absolute maximum gate-source voltage is ±20 V, but the device is characterized and optimized for operation at VGS = 10 V for full RDS(on) specification. Driving above 12 V provides no significant RDS(on) improvement and increases gate oxide stress risk; 8 V is the minimum recommended for guaranteed 122 A conduction at TC = 100 °C.

Does IPTG063N15NM5 require a gate resistor for safe operation?

Yes-a gate resistor (typically 1.6 Ω, as used in datasheet switching tests) is required to control dV/dt and prevent oscillation during turn-on/turn-off. Without it, the low gate resistance (RG = 0.9–1.2 Ω) and high Ciss (3700–4800 pF) can cause ringing, leading to false triggering or localized overheating at the gate edge.

Can IPTG063N15NM5 be used in parallel configurations?

Yes-the device features positive temperature coefficient for RDS(on) (confirmed in Diagram 9), enabling stable current sharing across paralleled units. For best results, match gate drive loop inductance and PCB trace length, and ensure symmetric thermal mounting to maintain uniform junction temperature across all paralleled devices.

Is the body diode suitable for continuous conduction mode (CCM) operation?

Yes-the body diode is rated for 122 A continuous forward current (IS) and has characterized reverse recovery parameters (Qrr = 88–176 nC, trr = 63–127 ns). It supports CCM in synchronous buck or half-bridge topologies, though external Schottky may still be preferred in ultra-high-frequency (>500 kHz) designs to minimize recovery loss.

IPTG063N15NM5ATMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
OptiMOS™ 5
Package/Case:
8-PowerSMD, Gull Wing
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
150 V
Current - Continuous Drain (Id) @ 25°C:
16.2A (Ta), 122A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
8V, 10V
Rds On (Max) @ Id, Vgs:
6.3mOhm @ 50A, 10V
Vgs(th) (Max) @ Id:
4.6V @ 163µA
Gate Charge (Qg) (Max) @ Vgs:
63 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
4800 pF @ 75 V
FET Feature:
-
Power Dissipation (Max):
3.8W (Ta), 214W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-HSOG-8

IPTG063N15NM5ATMA1 FAQ

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Please submit a Request for Quotation (RFQ) for IPTG063N15NM5ATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of IPTG063N15NM5ATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPTG063N15NM5ATMA1 is usually 5 days.

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IPTG063N15NM5ATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

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5.How can I obtain technical support or documentation for IPTG063N15NM5ATMA1?

For technical support, including IPTG063N15NM5ATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPTG063N15NM5ATMA1 requirements.

6.How does Aetrix verify that IPTG063N15NM5ATMA1 is sourced from the original manufacturer or authorized distributors?

All IPTG063N15NM5ATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPTG063N15NM5ATMA1 meets industry standards.

7.What is the process for return or replacement of IPTG063N15NM5ATMA1?

All IPTG063N15NM5ATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPTG063N15NM5ATMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IPTG063N15NM5ATMA1 part is unused and in its original packaging.

Return procedure for IPTG063N15NM5ATMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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