Infineon Technologies IPU60R2K1CEBKMA1
- Part No.:
- IPU60R2K1CEBKMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-251-3 Short Leads, IPAK, TO-251AA
- Datasheet:
-
IPU60R2K1CEBKMA1.pdf
- Description:
- MOSFET N-CH 600V 2.3A TO251-3
- Quantity:
- Payment:

- Shipping:

Inventory:7,532
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IPU60R2K1CEBKMA1 from Infineon Technologies is a 600 V, 2.1 Ω (max) superjunction MOSFET in PG-TO251 (IPAK) package, optimized for cost-sensitive PFC and hard-switching SMPS stages in lighting and adapter applications. It delivers 3.7 A continuous drain current at 25°C, features 6.7 nC total gate charge, and integrates a fast-recovery body diode with 180 ns trr and 0.67 µC Qrr.
For engineers reviewing the IPU60R2K1CEBKMA1 datasheet, IPU60R2K1CEBKMA1 pinout, IPU60R2K1CEBKMA1 application, or IPU60R2K1CEBKMA1 equivalent, key selection criteria include RDS(on) vs. temperature stability, Eoss at 400 V (0.76 µJ), dv/dt ruggedness (50 V/ns), and gate drive simplicity enabled by 5.4 V plateau voltage and low Qgd/Qg ratio.
Technical Context
This CoolMOS™ CE device employs superjunction architecture to achieve ultra-low figure-of-merit (RDS(on) × Qg = 14.07 Ω·nC typ) while maintaining high commutation ruggedness-evidenced by 11 mJ single-pulse avalanche energy and 500 A/µs diode dif/dt rating. Its 600 V V(BR)DSS and 150 °C max junction temperature support operation in high-voltage, thermally constrained environments.
The MOSFET exhibits strong temperature coefficient linearity in RDS(on), rising from ~1.8 Ω at 25°C to ~4.68 Ω at 150°C, enabling predictable thermal derating. Gate threshold voltage (2.5–3.5 V) and low 12 Ω gate resistance simplify drive circuit design without requiring negative turn-off bias.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS max | 650 V - Ensures 50 V margin above 600 V rated breakdown, supporting reliable operation under transient overvoltage in offline SMPS. |
| RDS(on) max | 2.10 Ω @ Tj = 150°C - Defines worst-case conduction loss in thermally saturated PFC boost stages. |
| Qg typ | 6.7 nC - Enables efficient 100 kHz–300 kHz switching with standard gate drivers (e.g., 1 A peak output). |
| Eoss @ 400 V | 0.76 µJ - Directly determines turn-on switching loss in hard-switched topologies; lower than legacy SJ-MOSFETs. |
| dv/dt ruggedness | 50 V/ns - Allows stable operation without external snubbers in high-dV/dt resonant or phase-shifted full-bridge circuits. |
| trr / Qrr | 180 ns / 0.67 µC - Minimizes reverse recovery losses and EMI generation during diode commutation in LLC and QR flyback. |
Pinout & Package
IPU60R2K1CEBKMA1 is housed in PG-TO251 (IPAK) package with exposed drain tab for enhanced thermal performance. The leadframe design supports PCB-mount thermal relief and direct heatsinking via the tab.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Gate) | Control input | Low-impedance gate terminal; accepts 10 V logic-level drive; 12 Ω internal gate resistance reduces ringing risk. |
| Pin 2 (Drain) | High-side power node | Connected to internal die drain and exposed metal tab; must be electrically isolated from heatsink unless referenced to same potential. |
| Pin 3 (Source) | Reference return path | Serves as signal ground reference for gate drive and current sensing; low-inductance layout critical for EMI control. |
Key Features
| Feature | Design Value |
|---|---|
| Superjunction FOM (RDS(on) × Qg) | 14.07 Ω·nC typ - Reduces combined conduction + switching loss in 65–100 kHz PFC, improving efficiency >95% at full load. |
| Body diode commutation ruggedness | 500 A/µs dif/dt rating - Supports zero-voltage switching transitions without oscillation or failure in resonant converters. |
| Thermal resistance RthJC | 3.26 °C/W - Enables 38 W power dissipation at TC = 25°C; allows compact heatsink design in space-constrained adapters. |
| Pb-free & halogen-free construction | RoHS-compliant plating and mold compound - Meets IPC-J-STD-020 moisture sensitivity level 1 (MSL1) for reflow compatibility. |
Applications
| LED Driver Power Stage | PC Silverbox PFC Boost |
|---|---|
|
Use Scenario: Constant-current LED driver operating from universal AC input (85–265 VAC) with active PFC and quasi-resonant flyback. IC Role / Device Role / Timing Role: Primary-side high-voltage switch in boost PFC pre-regulator stage; handles 600 V DC bus and 100 kHz switching. Use Value: Low Eoss (0.76 µJ) and fast diode (trr = 180 ns) reduce switching loss and audible noise compared to standard SJ-MOSFETs. |
Use Scenario: Active PFC front-end in desktop PC power supplies delivering 300–500 W with THD <5% at full load. IC Role / Device Role / Timing Role: Critical conduction mode (CRM) or continuous conduction mode (CCM) boost switch handling 400 V DC link and 65 kHz operation. Use Value: 2.1 Ω RDS(on) at 150°C ensures stable thermal performance across ambient temperatures up to 70°C without derating. |
| LCD TV Backlight Inverter | USB-C PD Adapter Primary Switch |
|
Use Scenario: High-efficiency flyback converter powering CCFL or LED backlight in 32–55″ LCD TVs with wide input range (90–264 VAC). IC Role / Device Role / Timing Role: Primary-side switching transistor in quasi-resonant (QR) topology; operates at variable frequency up to 130 kHz. Use Value: 50 V/ns dv/dt ruggedness prevents false triggering during high-slew-rate transitions, eliminating need for gate clamping networks. |
Use Scenario: 65 W USB-C Power Delivery adapter using active clamp flyback or asymmetrical half-bridge topology. IC Role / Device Role / Timing Role: Main primary-side switch handling 600 V blocking and 100–200 kHz switching with tight duty cycle control. Use Value: Low Qgd/Qg ratio (3.6/6.7 ≈ 54%) improves controllability during transition between CCM and DCM, enhancing light-load efficiency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage superjunction MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IPD60R2K1CE | Same die, PG-TO252 (DPAK) package; RthJC = 3.26 °C/W identical, but larger footprint and higher RthJA (62 °C/W vs. 62 °C/W - same value, different test condition). | Preferred where board space permits larger DPAK and thermal vias are limited; less suitable for ultra-thin adapter PCBs. | Select IPD60R2K1CE when mechanical mounting constraints favor DPAK's dual leads and higher creepage distance. |
| STP60N2K2 | 600 V, 2.2 Ω RDS(on), 7.2 nC Qg, TO-220 package; lacks Co(er) specification and has higher Eoss (1.1 µJ @ 400 V). | Used in industrial SMPS where cost is prioritized over efficiency; not recommended for consumer-grade lighting due to higher thermal impedance. | Choose STP60N2K2 only if legacy TO-220 socket compatibility is mandatory and efficiency targets allow ≥0.3% penalty at full load. |
Compared with IPD60R2K1CE, IPU60R2K1CEBKMA1 offers identical electrical specs in a smaller IPAK footprint ideal for space-constrained designs, while STP60N2K2 trades efficiency for broader legacy compatibility but requires larger heatsinking due to TO-220 thermal limitations.
Availability
IPU60R2K1CEBKMA1 is available at Aetrix Electronics and suitable for LED driver power stages, PC silverbox PFC boost circuits, and LCD TV backlight inverters requiring stable component supply, long-term lifecycle assurance, and consistent parametric performance across production batches.
Supply support for IPU60R2K1CEBKMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and RF solutions, with global manufacturing and R&D centers across Europe, Asia, and the Americas.
This part belongs to the CoolMOS™ CE family-a cost-optimized superjunction platform targeting high-efficiency, high-volume consumer and lighting power supplies where price-performance balance is critical.
FAQ
Is IPU60R2K1CEBKMA1 pin-compatible with IPD60R2K1CE?
No. While both share identical die characteristics, IPU60R2K1CEBKMA1 uses PG-TO251 (IPAK) with 3-pin single-leaded configuration (G-D-S), whereas IPD60R2K1CE uses PG-TO252 (DPAK) with 3-pin dual-leaded layout (G-S-D). Footprint and solder pad geometry differ, requiring PCB redesign for substitution.
What gate resistor value is recommended for 100 kHz operation?
A 10 Ω series gate resistor is recommended for 100 kHz hard-switching operation. This value balances switching speed (reducing turn-on delay to ~7 ns and fall time to ~50 ns) against gate ringing, leveraging the device's 12 Ω intrinsic gate resistance and 5.4 V gate plateau to ensure clean Miller region crossing.
Can this MOSFET be paralleled for higher current capability?
Yes, but with precautions: use individual ferrite beads (≥100 Ω @ 100 MHz) on each gate line and separate totem-pole drivers to prevent dynamic current imbalance. The device's positive RDS(on) temperature coefficient supports thermal sharing, but layout symmetry is critical to avoid oscillation.
Does the body diode support ZVS in LLC resonant converters?
Yes-the 180 ns reverse recovery time and 0.67 µC Qrr enable reliable zero-voltage switching in LLC half-bridge topologies operating up to 500 kHz. However, soft-start sequencing must ensure diode conduction before main switch turn-on to avoid hard commutation stress.
IPU60R2K1CEBKMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- CoolMOS™ CE
- Package/Case:
- TO-251-3 Short Leads, IPAK, TO-251AA
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 600 V
- Current - Continuous Drain (Id) @ 25°C:
- 2.3A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 2.1Ohm @ 760mA, 10V
- Vgs(th) (Max) @ Id:
- 3.5V @ 60µA
- Gate Charge (Qg) (Max) @ Vgs:
- 6.7 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 140 pF @ 100 V
- FET Feature:
- -
- Power Dissipation (Max):
- 22W (Tc)
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- PG-TO251-3
IPU60R2K1CEBKMA1 FAQ
1.How can I place an order for IPU60R2K1CEBKMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IPU60R2K1CEBKMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IPU60R2K1CEBKMA1 reliable?
The price and inventory of IPU60R2K1CEBKMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPU60R2K1CEBKMA1 is usually 5 days.
3.What payment methods are accepted for IPU60R2K1CEBKMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPU60R2K1CEBKMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IPU60R2K1CEBKMA1?
IPU60R2K1CEBKMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IPU60R2K1CEBKMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IPU60R2K1CEBKMA1?
For technical support, including IPU60R2K1CEBKMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPU60R2K1CEBKMA1 requirements.
6.How does Aetrix verify that IPU60R2K1CEBKMA1 is sourced from the original manufacturer or authorized distributors?
All IPU60R2K1CEBKMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPU60R2K1CEBKMA1 meets industry standards.
7.What is the process for return or replacement of IPU60R2K1CEBKMA1?
All IPU60R2K1CEBKMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPU60R2K1CEBKMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPU60R2K1CEBKMA1 part is unused and in its original packaging.
Return procedure for IPU60R2K1CEBKMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IPU60R2K1CEBKMA1 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

