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Infineon Technologies IQD016N08NM5CGATMA1

Part No.:
IQD016N08NM5CGATMA1
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
9-PowerTDFN
Datasheet:
AetrixIQD016N08NM5CGATMA1.pdf
Description:
OPTIMOS 6 POWER-TRANSISTOR
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,824

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Product details

Overview

IQD016N08NM5CGATMA1 from Infineon Technologies is an N-channel, normal-level 80 V OptiMOSTM 5 power MOSFET in PG-TTFN-9 package, featuring 1.57 mΩ max RDS(on), 323 A continuous drain current at TC = 25 °C, and 100% avalanche tested for robustness in high-current switching applications such as DC-DC synchronous buck converters.

For engineers reviewing the IQD016N08NM5CGATMA1 datasheet, IQD016N08NM5CGATMA1 pinout, IQD016N08NM5CGATMA1 application, or IQD016N08NM5CGATMA1 equivalent, key selection criteria include low RDS(on) at 10 V gate drive, Qg = 106 nC for fast switching, thermal resistance RthJC = 0.45 °C/W, and validated industrial-grade reliability per JEDEC.

Technical Context

This device employs Infineon's OptiMOSTM 5 silicon process optimized for high-current, low-voltage power stages. Its 80 V VDS rating supports 48 V input systems, while the 1.57 mΩ RDS(on) enables high-efficiency operation at >200 A load currents with minimal conduction loss.

The PG-TTFN-9 package integrates a thermally enhanced exposed drain pad (Pins 5–8) and separate source (Pins 1–4) and gate (Pin 9) terminals to minimize parasitic inductance and improve thermal transfer. Gate charge parameters-Qgd = 25–38 nC, Qoss = 123 nC-support high-frequency synchronous rectification with controlled dv/dt and reduced switching loss.

Key Specifications

ParameterValue and Actual Design Meaning
VDS80 V - Supports 48 V nominal bus systems with 25 % overvoltage margin for transient suppression.
RDS(on), max1.57 mΩ @ VGS = 10 V, ID = 50 A - Enables <1 W conduction loss at 250 A, critical for high-current POL converters.
ID, cont.323 A @ TC = 25 °C - Rated for continuous operation in high-power server VRMs and EV onboard chargers.
Qg106 nC - Determines gate driver power requirement; compatible with standard 2 A peak drivers at ≤1 MHz switching.
RthJC0.45 °C/W - Allows junction-to-case temperature rise of ≤142 °C at 315 W dissipation, enabling compact heatsink design.
EAS802 mJ - Withstands single-pulse inductive energy without failure, essential for motor drive freewheeling protection.
Qoss123 nC - Defines output capacitance energy loss during hard-switching transitions; impacts ZVS feasibility above 300 kHz.

Pinout & Package

PG-TTFN-9 is a thermally optimized 9-pin surface-mount package with integrated copper clip for ultra-low inductance and high-current capability. The exposed drain pad (Pins 5–8) provides primary thermal path; source (Pins 1–4) and gate (Pin 9) are isolated for clean gate control.

Pin/TerminalCircuit RoleDesign Meaning
Pins 1–4SourceLow-inductance parallel connection for return path; minimizes source loop inductance in high-di/dt synchronous FETs.
Pins 5–8DrainExposed copper pad forming primary thermal interface and main current path; requires full-solder thermal pad on PCB.
Pin 9GateDedicated gate terminal isolated from source pins to prevent Miller-induced turn-on; enables stable high-speed switching.

Key Features

FeatureDesign Value
100% avalanche testedGuarantees ruggedness against inductive kickback up to 802 mJ, eliminating need for external snubbers in motor control.
Superior thermal resistanceRthJC = 0.45 °C/W enables >300 W power handling with simple heatsinking-critical for space-constrained 48 V–12 V DC-DC modules.
Very low RDS(on)1.57 mΩ at 10 V drive reduces conduction loss by >35 % vs. prior-gen 2.5 mΩ devices, directly improving efficiency in 50–100 A loads.
Pb-free & halogen-freeComplies with RoHS and IEC61249-2-21, supporting automotive and industrial end-equipment compliance without derating.

Applications

Server Voltage Regulator ModulesIndustrial Motor Drives

Use Scenario: High-density 48 V–0.8 V VRM supplying CPU/GPU cores with >500 A peak current.

IC Role / Device Role / Timing Role: Synchronous high-side FET in multiphase buck converter, switching at 500–1000 kHz with precise dead-time control.

Use Value: 1.57 mΩ RDS(on) and 0.45 °C/W RthJC enable >95 % efficiency at 300 A while maintaining Tj < 125 °C under airflow.

Use Scenario: 48 V BLDC inverter stage for conveyor drives and pumps requiring regenerative braking.

IC Role / Device Role / Timing Role: Low-side switch in three-phase inverter leg, conducting freewheeling current during PWM off-time.

Use Value: 100 % avalanche rating (802 mJ) ensures safe operation during inductive flyback without external clamping diodes.

EV Onboard ChargersTelecom Rectifier Modules

Use Scenario: Primary-side synchronous rectification in 3.3 kW AC–DC PFC + LLC stage with 400 V bus.

IC Role / Device Role / Timing Role: Secondary-side synchronous FET in LLC resonant converter, operating in ZVS region with low Qoss.

Use Value: Qoss = 123 nC and Coss = 1200–1600 pF support efficient ZVS down to 200 kHz, reducing switching loss by 40 % vs. Schottky diodes.

Use Scenario: 48 V hot-swap OR-ing FET in redundant telecom power shelves with 100 A continuous load.

IC Role / Device Role / Timing Role: Ideal diode controller replacement, conducting bidirectional current with ultra-low forward drop.

Use Value: RDS(on) = 1.57 mΩ yields <79 mV drop at 50 A-lower than SiC Schottkys-reducing heat generation and improving system MTBF.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-current 80 V power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IPB017N08N5ATMA1RDS(on) = 1.7 mΩ (max), Qg = 110 nC, same PG-TTFN-9 packageSlightly higher conduction loss; identical thermal and avalanche specsSelect when tighter RDS(on) binning is not required and cost optimization is prioritized.
IRFH8325TRPBFRDS(on) = 1.8 mΩ (max), Qg = 102 nC, PowerPAK® 8x8 packageHigher RthJA (55 °C/W vs. 50 °C/W); no dedicated gate pin isolationPrefer for legacy board designs using PowerPAK footprint; avoid in >300 A thermal-limited layouts.

Compared with IPB017N08N5ATMA1 and IRFH8325TRPBF, IQD016N08NM5CGATMA1 delivers the lowest RDS(on) and best thermal resistance in its class-enabling higher current density and lower junction temperature rise in multi-phase VRMs and high-power inverters.

Availability

IQD016N08NM5CGATMA1 is available at Aetrix Electronics and suitable for server voltage regulator modules, industrial motor drives, EV onboard chargers, and telecom rectifier modules requiring stable component supply and JEDEC-qualified industrial reliability.

Supply support for IQD016N08NM5CGATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, sensor, and automotive ICs, with global manufacturing and qualification infrastructure.

This part belongs to the OptiMOSTM 5 family-designed specifically for high-efficiency, high-current DC-DC conversion in datacenter, industrial, and e-mobility applications where low RDS(on), fast switching, and ruggedness are mandatory.

FAQ

What is the maximum continuous drain current at TC = 100 °C?

The IQD016N08NM5CGATMA1 supports 229 A continuous drain current at case temperature of 100 °C, as specified in Table 2 of the datasheet. This derating reflects thermal limits under real-world heatsink conditions and must be verified with actual PCB layout and airflow.

Is this MOSFET suitable for synchronous rectification in LLC resonant converters?

Yes-its low Qoss (123 nC), fast switching times (td(off) = 29 ns), and low RDS(on) make it well-suited for secondary-side synchronous rectification in 200–500 kHz LLC converters, especially where ZVS operation and efficiency >96 % are required.

Does the PG-TTFN-9 package require solder paste stencil adjustments compared to standard SO-8?

Yes-the PG-TTFN-9 has a large exposed drain pad (Pins 5–8) requiring a custom stencil aperture with ≥80 % open area and thermal vias under the pad. Standard SO-8 stencils will cause insufficient solder volume and thermal delamination.

What is the gate threshold voltage range, and how does it affect drive circuit design?

VGS(th) ranges from 2.2 V to 3.8 V at Tj = 25 °C. To ensure full enhancement and low RDS(on), gate drive must deliver ≥6 V (preferably 10 V) with sufficient peak current (>2 A) to overcome Qg = 106 nC within nanoseconds.

IQD016N08NM5CGATMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
OptiMOS™ 5
Package/Case:
9-PowerTDFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
80 V
Current - Continuous Drain (Id) @ 25°C:
31A (Ta), 323A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
6V, 10V
Rds On (Max) @ Id, Vgs:
1.57mOhm @ 50A, 10V
Vgs(th) (Max) @ Id:
3.8V @ 159µA
Gate Charge (Qg) (Max) @ Vgs:
133 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
9200 pF @ 40 V
FET Feature:
-
Power Dissipation (Max):
3W (Ta), 333W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TTFN-9-U02

IQD016N08NM5CGATMA1 FAQ

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Please submit a Request for Quotation (RFQ) for IQD016N08NM5CGATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of IQD016N08NM5CGATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IQD016N08NM5CGATMA1 is usually 5 days.

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5.How can I obtain technical support or documentation for IQD016N08NM5CGATMA1?

For technical support, including IQD016N08NM5CGATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IQD016N08NM5CGATMA1 requirements.

6.How does Aetrix verify that IQD016N08NM5CGATMA1 is sourced from the original manufacturer or authorized distributors?

All IQD016N08NM5CGATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IQD016N08NM5CGATMA1 meets industry standards.

7.What is the process for return or replacement of IQD016N08NM5CGATMA1?

All IQD016N08NM5CGATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IQD016N08NM5CGATMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IQD016N08NM5CGATMA1 part is unused and in its original packaging.

Return procedure for IQD016N08NM5CGATMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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