Infineon Technologies IQDH35N03LM5ATMA1
- Part No.:
- IQDH35N03LM5ATMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerTDFN
- Datasheet:
-
IQDH35N03LM5ATMA1.pdf
- Description:
- TRENCH <= 40V
- Quantity:
- Payment:

- Shipping:

Inventory:4,823
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IQDH35N03LM5ATMA1 from Infineon Technologies is an N-channel logic-level OptiMOSTM 5 power MOSFET rated for 30 V drain-source voltage, 700 A continuous drain current at TC = 25 °C, and 0.35 mΩ maximum RDS(on) at VGS = 10 V. It features integrated body diode, 100% avalanche tested ruggedness, and PG-TSON-8 package optimized for high-current DC-DC converters and synchronous rectification in server VRMs.
For engineers reviewing the IQDH35N03LM5ATMA1 datasheet, IQDH35N03LM5ATMA1 pinout, IQDH35N03LM5ATMA1 application, or IQDH35N03LM5ATMA1 equivalent, key selection criteria include its ultra-low RDS(on), Qg of 91 nC (VGS = 0–4.5 V), Qoss of 95 nC, thermal resistance RthJC of 0.45 °C/W, and suitability for high-frequency synchronous buck topologies with strict conduction and switching loss budgets.
Technical Context
This MOSFET employs trench-gate silicon technology with optimized cell pitch and deep-trench source design to achieve sub-0.4 mΩ on-resistance while maintaining fast switching (td(on) = 12 ns, tf = 14 ns) and low gate charge. Its logic-level threshold (VGS(th) = 1.2–2.0 V) enables direct drive from 3.3 V or 5 V controllers without level-shifting.
The device integrates a robust intrinsic body diode with trr = 49–98 ns and Qrr = 64–304 nC depending on diF/dt, supporting hard-switched and synchronous rectifier operation. Thermal performance is validated via JEDEC industrial qualification, with RthJA = 50 °C/W on 6 cm² FR4 PCB and junction-to-case resistance fixed at 0.45 °C/W.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - Maximum blocking voltage compatible with 12 V and 24 V input bus systems in server PSUs and telecom rectifiers. |
| RDS(on),max | 0.35 mΩ @ VGS=10 V - Enables <1 W conduction loss at 700 A, critical for >95% efficiency in high-current VRMs. |
| ID,cont | 700 A @ TC=25 °C - Supports single-device implementation in 300–500 A output stages when heatsinked properly. |
| Qg | 91 nC @ VGS=0–4.5 V - Low gate charge reduces driver power and enables efficient 500 kHz–1 MHz switching in digital PWM controllers. |
| RthJC | 0.45 °C/W - Allows precise junction temperature estimation and thermal derating using case temperature monitoring. |
| EAS | 1200 mJ - Withstands single-pulse inductive energy in hard-switched applications without failure. |
| Qoss | 95 nC - Directly impacts turn-on loss in high-side configurations; enables ZVS-assisted operation below 300 kHz. |
Pinout & Package
Package: PG-TSON-8 (exposed drain pad), 5 mm × 6 mm footprint, 0.85 mm height, RoHS-compliant, halogen-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1–3 (Source) | Source connection terminal | Low-inductance parallel source path; pins 1–3 are internally bonded to common source metallization. |
| 4 (Gate) | Control input | Single-point gate connection optimized for low-impedance driver routing; requires <3 Ω external RG for specified switching times. |
| 5–8 (Drain) | Power output / heat sink interface | Exposed drain pad occupies bottom surface and pins 5–8; primary thermal path to PCB copper and heatsink. |
Key Features
| Feature | Design Value |
|---|---|
| N-channel logic-level gate | VGS(th) = 1.2–2.0 V enables direct interfacing with 3.3 V microcontrollers and digital PWM ICs without gate drivers. |
| Ultra-low RDS(on) | 0.35 mΩ max at 10 V drive reduces I²R losses by >40% vs. prior-gen 30 V MOSFETs in 400–700 A applications. |
| 100% avalanche rated | Guaranteed EAS = 1200 mJ ensures reliability under transient overvoltage and inductive load switching stress. |
| Optimized dynamic parameters | Qgd = 18–27 nC and Crss = 270–470 pF support stable high-frequency operation with minimal Miller-induced shoot-through risk. |
| JEDEC industrial qualification | Validated for continuous operation from –55 °C to +150 °C junction temperature in uncontrolled ambient environments. |
Applications
| Server Voltage Regulator Modules | Telecom Rectifier Modules |
|---|---|
Use Scenario: High-density 48 V–12 V/5 V step-down conversion delivering up to 500 A per phase in AI accelerator racks. IC Role / Device Role / Timing Role: Synchronous rectifier FET in multiphase buck converter, operating at 500–800 kHz with digital PWM control. Use Value: 0.35 mΩ RDS(on) limits conduction loss to <1.2 W at 500 A, enabling >96% peak efficiency and reducing heatsink mass by 35% vs. 0.65 mΩ alternatives. | Use Scenario: Primary-side synchronous rectification in 48 V telecom rectifiers powering distributed baseband units. IC Role / Device Role / Timing Role: Low-side switch in active clamp forward or LLC secondary-side synchronous rectifier stage. Use Value: Qoss = 95 nC minimizes turn-on loss during zero-voltage switching transitions, improving light-load efficiency by 1.8% at 10% load. |
| Industrial Motor Drive Inverters | High-Power USB PD3.1 GaN Companion FET |
Use Scenario: Half-bridge leg in 3 kW servo drive inverters requiring high short-circuit withstand capability. IC Role / Device Role / Timing Role: Low-side power switch with integrated body diode conducting freewheeling current during dead-time intervals. Use Value: Body diode trr = 49 ns and Qrr = 64 nC (diF/dt = 100 A/µs) reduce commutation loss and EMI vs. discrete diode solutions. | Use Scenario: Synchronous rectifier companion to 650 V GaN HEMTs in 28 V/240 W USB PD3.1 adapters. IC Role / Device Role / Timing Role: Secondary-side 30 V MOSFET controlled by GaN gate driver with adaptive timing to minimize reverse recovery. Use Value: VGS(th) = 1.6 V typ ensures reliable turn-on even with 3.3 V gate drive margin, eliminating need for bootstrap or isolated bias rails. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-current 30 V power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRLH2272PBF | RDS(on) = 0.45 mΩ @ 10 V; Qg = 110 nC; PG-HSOF-8 package with different pinout and thermal pad layout. | Higher conduction loss and larger footprint; less suitable for >400 A phases without paralleling. | Prefer when legacy board layout compatibility with IR's HSOF-8 is required and efficiency targets allow +0.3 W loss margin. |
| SISD10DN03LT | RDS(on) = 0.32 mΩ @ 10 V; Qg = 102 nC; TSDSON-8 package with identical 5×6 mm outline but non-exposed drain pad. | Lacks exposed drain thermal path; RthJC = 0.75 °C/W - limits sustained 700 A operation without aggressive heatsinking. | Select only if PCB stack-up prohibits exposed-drain soldering or if system-level thermal testing confirms acceptable junction rise. |
Compared with IRLH2272PBF and SISD10DN03LT, IQDH35N03LM5ATMA1 delivers the lowest RDS(on) × RthJC product (0.157 mΩ·°C/W), enabling highest current density per phase while maintaining junction temperature below 125 °C under full load with standard 6 cm² cooling.
Availability
IQDH35N03LM5ATMA1 is available at Aetrix Electronics and suitable for server VRMs, telecom rectifiers, industrial motor drives, and high-power USB PD3.1 adapters requiring stable component supply and JEDEC-qualified industrial reliability.
Supply support for IQDH35N03LM5ATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices, with global manufacturing and quality certification to ISO/TS 16949 and IECQ QC 080000.
This part belongs to the OptiMOSTM 5 family-engineered specifically for high-efficiency, high-current DC-DC conversion in datacenter, telecom, and industrial power systems where ultra-low RDS(on) and fast, predictable switching are mandatory.
FAQ
What is the maximum continuous drain current rating for IQDH35N03LM5ATMA1 at 100 °C case temperature?
The datasheet specifies ID = 443 A at TC = 100 °C and VGS = 10 V. This derating reflects thermal limitations of the PG-TSON-8 package under real-world heatsinking conditions. At TC = 100 °C, RDS(on) rises to ~0.42 mΩ, increasing conduction loss proportionally. Designers must verify junction temperature using RthJC = 0.45 °C/W and ensure TJ ≤ 150 °C.
Does IQDH35N03LM5ATMA1 support 3.3 V gate drive in logic-level operation?
Yes. With VGS(th) ranging from 1.2 V to 2.0 V and RDS(on) = 0.36 mΩ max at VGS = 4.5 V and ID = 50 A, the device fully enhances at 3.3 V gate drive. However, RDS(on) increases to ~0.55 mΩ at 3.3 V, raising conduction loss by ~60% versus 10 V drive-acceptable in space-constrained designs where gate driver voltage is limited.
How is the internal body diode characterized for reverse recovery in synchronous rectifier use?
The body diode exhibits trr = 49–98 ns and Qrr = 64–304 nC depending on diF/dt and IF. At IF = 25 A and diF/dt = 100 A/µs, Qrr = 64 nC supports clean commutation in 500 kHz buck converters. The diode's soft recovery behavior minimizes voltage overshoot and EMI, verified across –55 °C to +150 °C junction temperatures per JEDEC test conditions.
Is IQDH35N03LM5ATMA1 pin-compatible with earlier OptiMOSTM generations in PG-TSON-8?
No. While sharing the PG-TSON-8 outline, IQDH35N03LM5ATMA1 uses a 5–8 drain / 1–3 source / 4 gate pin assignment distinct from OptiMOSTM 3 (e.g., IQD35N03L) which assigns drain to pins 1–4. PCB layout must be revised to match the new terminal mapping; no mechanical or electrical drop-in replacement exists within the OptiMOSTM family.
IQDH35N03LM5ATMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™ 5
- Package/Case:
- 8-PowerTDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 66A (Ta), 700A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 0.35mOhm @ 50A, 10V
- Vgs(th) (Max) @ Id:
- 2V @ 1.46mA
- Gate Charge (Qg) (Max) @ Vgs:
- 262 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 18000 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2.5W (Ta), 278W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TSON-8-9
IQDH35N03LM5ATMA1 FAQ
1.How can I place an order for IQDH35N03LM5ATMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IQDH35N03LM5ATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IQDH35N03LM5ATMA1 reliable?
The price and inventory of IQDH35N03LM5ATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IQDH35N03LM5ATMA1 is usually 5 days.
3.What payment methods are accepted for IQDH35N03LM5ATMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IQDH35N03LM5ATMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IQDH35N03LM5ATMA1?
IQDH35N03LM5ATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IQDH35N03LM5ATMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IQDH35N03LM5ATMA1?
For technical support, including IQDH35N03LM5ATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IQDH35N03LM5ATMA1 requirements.
6.How does Aetrix verify that IQDH35N03LM5ATMA1 is sourced from the original manufacturer or authorized distributors?
All IQDH35N03LM5ATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IQDH35N03LM5ATMA1 meets industry standards.
7.What is the process for return or replacement of IQDH35N03LM5ATMA1?
All IQDH35N03LM5ATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IQDH35N03LM5ATMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IQDH35N03LM5ATMA1 part is unused and in its original packaging.
Return procedure for IQDH35N03LM5ATMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IQDH35N03LM5ATMA1 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

