Infineon Technologies IQE004NE1LM7CGATMA1
- Part No.:
- IQE004NE1LM7CGATMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 9-PowerTDFN
- Datasheet:
-
IQE004NE1LM7CGATMA1.pdf
- Description:
- TRENCH <= 40V
- Quantity:
- Payment:

- Shipping:

Inventory:9,900
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Product details
Overview
IQE004NE1LM7CGATMA1 from Infineon Technologies is an N-channel logic-level OptiMOSTM 7 power MOSFET rated for 15 V drain-source voltage, 0.45 mΩ max RDS(on) at VGS = 7 V, 379 A continuous drain current (TC = 25 °C), and fully qualified for industrial applications per JEDEC. It features ultra-low on-resistance, 100% avalanche tested ruggedness, and optimized thermal resistance (RthJC = 1.4 °C/W) for high-efficiency synchronous rectification in SMPS.
For engineers reviewing the IQE004NE1LM7CGATMA1 datasheet, IQE004NE1LM7CGATMA1 pinout, IQE004NE1LM7CGATMA1 application, or IQE004NE1LM7CGATMA1 equivalent, key selection criteria include its 0.45 mΩ RDS(on), 27 nC Qoss, 29 nC total gate charge, PG-TTFN-9 package with isolated source terminals, and suitability for high-current DC-DC converters requiring low conduction loss and fast switching.
Technical Context
This MOSFET employs a trench-based silicon process optimized for logic-level gate drive compatibility (VGS(th) = 1.2–2.0 V) and minimal switching losses. Its dynamic parameters-Qgd = 5.7–8.5 nC, tr = 2 ns, tf = 4 ns-support high-frequency operation up to 1 MHz in resonant and hard-switched topologies.
The device integrates a robust body diode with trr = 25–62 ns and Qrr = 24–98 nC, enabling efficient synchronous rectification without external Schottky diodes. Thermal design is enabled by its low junction-to-case resistance (1.4 °C/W) and validated 6 cm² PCB cooling requirement.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 15 V - Maximum blocking voltage for low-voltage, high-current DC-DC stages (e.g., 12 V input to 1 V output). |
| RDS(on), max | 0.45 mΩ at VGS = 7 V - Enables <1.5 W conduction loss at 30 A, critical for >95% efficiency in server VRMs. |
| ID, cont | 379 A at TC = 25 °C - Supports single-device implementation in high-power POL converters without paralleling. |
| Qoss | 27 nC - Low output charge reduces turn-off energy loss and improves light-load efficiency in ZVS/ZCS circuits. |
| RthJC | 1.4 °C/W - Allows direct heatsink mounting with minimal thermal interface resistance for compact thermal design. |
| Qg | 29 nC at VGS = 0–4.5 V - Matches standard gate drivers (e.g., UCC2753x) without requiring high-current buffer stages. |
| EAS | 859 mJ - Confirmed single-pulse avalanche capability supports robustness against inductive switching transients. |
Pinout & Package
Package: PG-TTFN-9 - Thermally enhanced 9-pin thin-flange no-lead package with exposed drain paddle and isolated source terminals (pins 1–4) for parallel current paths and reduced parasitic inductance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (Pins 5–8) | Main current path collector | Four parallel drain pins reduce bond wire inductance and enable >300 A current sharing across internal die segments. |
| Gate (Pin 9) | Control terminal | Single low-inductance gate connection minimizes ringing during fast dV/dt switching (dV/dt > 10 V/ns). |
| Source (Pins 1–4) | Reference and return path | Four dedicated source pins provide Kelvin sensing capability and separate high-current return from gate drive reference. |
Key Features
| Feature | Design Value |
|---|---|
| N-channel logic-level operation | VGS(th) = 1.2–2.0 V enables direct drive from 3.3 V/5 V microcontrollers and PWM controllers without level-shifting. |
| Ultra-low RDS(on) | 0.45 mΩ max at 7 V gate drive delivers <0.5 W conduction loss at 200 A, reducing thermal stress in high-density modules. |
| 100% avalanche tested | Each unit passes single-pulse EAS = 859 mJ test, ensuring reliability in unclamped inductive load switching events. |
| Optimized for synchronous rectification | Low Qrr (24–98 nC) and fast trr (25–62 ns) minimize reverse recovery loss and cross-conduction risk in LLC and buck converters. |
| Pb-free & halogen-free | RoHS-compliant plating and IEC61249-2-21 halogen-free construction meet automotive and industrial environmental compliance requirements. |
Applications
| Server Voltage Regulator Modules (VRMs) | AI Accelerator Power Delivery |
|---|---|
|
Use Scenario: High-current, multi-phase buck converter supplying 0.8–1.2 V at up to 1000 A to GPU/ASIC dies. IC Role / Device Role / Timing Role: Synchronous rectifier switch in low-side position, operating at 500 kHz–1 MHz with precise dead-time control. Use Value: 0.45 mΩ RDS(on) cuts conduction loss by >40% vs. legacy 0.8 mΩ devices, enabling higher power density without forced air cooling. |
Use Scenario: Point-of-load regulator on AI training card delivering transient-heavy 50–200 A loads with <1 µs response. IC Role / Device Role / Timing Role: High-side switch in dual-active-buck topology, leveraging fast tr/tf (2 ns/4 ns) for minimal switching loss during rapid load steps. Use Value: 29 nC Qg allows full turn-on with <100 ns gate delay using standard 4-A drivers, improving transient regulation fidelity. |
| Industrial 48 V DC-DC Converters | EV On-Board Charger (OBC) Auxiliary Supplies |
|
Use Scenario: Isolated flyback or active-clamp forward converter powering PLC I/O modules from 48 V bus. IC Role / Device Role / Timing Role: Primary-side MOSFET in self-driven synchronous rectifier configuration, operating at 200–300 kHz. Use Value: 1.4 °C/W RthJC permits direct heatsink mounting on metal-core PCBs, eliminating thermal vias and simplifying mechanical layout. |
Use Scenario: Secondary-side synchronous rectifier in 1–3 kW OBC auxiliary supply (12 V/24 V output). IC Role / Device Role / Timing Role: Low-side rectifier in center-tapped forward topology, handling 87 A continuous diode current (IS). Use Value: Body diode VSD = 0.76 V @ 30 A reduces forward drop vs. discrete Schottky, lowering heat generation in sealed OBC enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IPB017N15N5 | RDS(on) = 0.55 mΩ (higher), Qg = 32 nC (higher), same PG-TTFN-9 package | Marginally lower efficiency in >200 A applications due to +22% conduction loss | Select when cost sensitivity outweighs 0.1 mΩ RDS(on) advantage and thermal margin is sufficient. |
| IRFH7107TRPBF | RDS(on) = 0.48 mΩ, Qoss = 34 nC (+26%), different PQFN 5×6 mm package (no isolated source pins) | Limited current sharing capability and higher switching loss in high-frequency SMPS | Prefer only if existing PCB layout uses 5×6 mm footprint and gate drive strength exceeds 5 A peak. |
Compared with IPB017N15N5 and IRFH7107TRPBF, IQE004NE1LM7CGATMA1 delivers the lowest RDS(on) and Qoss in its class, enabling highest efficiency in space-constrained, high-current VRMs where thermal headroom and switching frequency are critical.
Availability
IQE004NE1LM7CGATMA1 is available at Aetrix Electronics and suitable for server VRMs, AI accelerator power delivery, industrial 48 V DC-DC converters, and EV on-board charger auxiliary supplies requiring stable component supply and long-term industrial qualification.
Supply support for IQE004NE1LM7CGATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
This device belongs to the OptiMOSTM 7 product line, engineered specifically for high-current, high-efficiency power conversion in datacenter, AI, and industrial applications where low RDS(on), fast switching, and ruggedness are mandatory.
FAQ
What is the maximum allowable gate-source voltage for IQE004NE1LM7CGATMA1?
The absolute maximum DC gate-source voltage is ±7 V, with transient tolerance up to ±8 V for pulses shorter than 20 ns. Exceeding ±7 V continuously risks gate oxide degradation; gate driver designs must include clamping (e.g., Zener diodes) to ensure VGS remains within this limit during switching transitions and noise events.
Can IQE004NE1LM7CGATMA1 be used in parallel configurations?
Yes-its PG-TTFN-9 package features four isolated source pins (1–4) and four parallel drain pins (5–8), enabling symmetrical current sharing. Matching RDS(on) tolerance (±10%) and identical gate loop inductance across paralleled units are required; external gate resistors (1–2 Ω) are recommended to dampen oscillation.
What is the thermal derating behavior above 25 °C case temperature?
Power dissipation decreases linearly: Ptot = 89 W × (1 − (TC − 25)/150) for TC up to 175 °C. At TC = 100 °C, rated power drops to 44.5 W; continuous drain current derates to 240 A. Diagram 2 in the datasheet provides exact ID vs. TC curves for VGS ≥ 10 V.
Is the body diode suitable for freewheeling in non-synchronous topologies?
Yes-the integrated body diode is characterized with IS = 87 A continuous and trr = 25–62 ns. However, its Qrr (24–98 nC) is significantly higher than discrete Schottky diodes; use only in low-frequency (<100 kHz) or low-dI/dt applications unless synchronous control is implemented to actively clamp reverse recovery.
IQE004NE1LM7CGATMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™ 7
- Package/Case:
- 9-PowerTDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 15 V
- Current - Continuous Drain (Id) @ 25°C:
- 58A (Ta), 379A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 7V
- Rds On (Max) @ Id, Vgs:
- 0.45mOhm @ 30A, 7V
- Vgs(th) (Max) @ Id:
- 2V @ 432µA
- Gate Charge (Qg) (Max) @ Vgs:
- 55 nC @ 7 V
- Vgs (Max):
- ±7V
- Input Capacitance (Ciss) (Max) @ Vds:
- 6240 pF @ 7.5 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2.1W (Ta), 89W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TTFN-9-3
IQE004NE1LM7CGATMA1 FAQ
1.How can I place an order for IQE004NE1LM7CGATMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IQE004NE1LM7CGATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IQE004NE1LM7CGATMA1 reliable?
The price and inventory of IQE004NE1LM7CGATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IQE004NE1LM7CGATMA1 is usually 5 days.
3.What payment methods are accepted for IQE004NE1LM7CGATMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IQE004NE1LM7CGATMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IQE004NE1LM7CGATMA1?
IQE004NE1LM7CGATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IQE004NE1LM7CGATMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IQE004NE1LM7CGATMA1?
For technical support, including IQE004NE1LM7CGATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IQE004NE1LM7CGATMA1 requirements.
6.How does Aetrix verify that IQE004NE1LM7CGATMA1 is sourced from the original manufacturer or authorized distributors?
All IQE004NE1LM7CGATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IQE004NE1LM7CGATMA1 meets industry standards.
7.What is the process for return or replacement of IQE004NE1LM7CGATMA1?
All IQE004NE1LM7CGATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IQE004NE1LM7CGATMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IQE004NE1LM7CGATMA1 part is unused and in its original packaging.
Return procedure for IQE004NE1LM7CGATMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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