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Infineon Technologies IQE022N06LM5CGATMA1

Part No.:
IQE022N06LM5CGATMA1
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
9-PowerTDFN
Datasheet:
AetrixIQE022N06LM5CGATMA1.pdf
Description:
TRENCH 40<-<100V
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,420

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Product details

Overview

IQE022N06LM5CGATMA1 from Infineon Technologies is a 60 V, logic-level N-channel Trench MOSFET in PG-TTFN-9 package, optimized for synchronous rectification in high-efficiency SMPS. It delivers RDS(on) = 2.2 mΩ @ 10 V and 2.9 mΩ @ 4.5 V, supports 151 A continuous drain current at TC = 25 °C, and features 100% avalanche-tested ruggedness for industrial power conversion.

For engineers reviewing the IQE022N06LM5CGATMA1 datasheet, IQE022N06LM5CGATMA1 pinout, IQE022N06LM5CGATMA1 application, or IQE022N06LM5CGATMA1 equivalent, key selection criteria include low gate charge (QG = 26 nC @ 4.5 V), ultra-low RDS(on), superior thermal resistance (RthJC = 0.9 °C/W), and integrated Schottky-like body diode performance with Qrr = 19–196 nC depending on di/dt.

Technical Context

This OptiMOSTM 5 device uses advanced TrenchStop process technology to achieve simultaneous low conduction loss and fast switching. Its gate threshold voltage (VGS(th) = 1.1–2.3 V) enables direct drive from 3.3 V/5 V logic controllers, while the 9-pin PG-TTFN-9 package integrates four parallel source terminals and four parallel drain terminals to minimize parasitic inductance and improve current sharing.

The MOSFET exhibits tightly controlled dynamic parameters: Ciss = 3400–4420 pF, Coss = 720–936 pF, and Crss = 35–63 pF at VDS = 30 V. Its reverse recovery behavior is characterized across two di/dt conditions (100 A/µs and 1000 A/µs), supporting design of hard-switched and resonant topologies requiring predictable body diode commutation.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 60 V - Maximum blocking voltage compatible with 48 V input bus systems and 60 V automotive auxiliary rails.
RDS(on) max @ 10 V 2.2 mΩ - Enables <1.5 W conduction loss at 25 A, critical for high-current synchronous rectifiers.
RDS(on) max @ 4.5 V 2.9 mΩ - Ensures robust turn-on under low-voltage gate drive, e.g., from microcontroller GPIO or dedicated gate drivers with limited output swing.
QG @ 4.5 V 26 nC - Low gate charge reduces driver power demand and switching energy, enabling >1 MHz operation in LLC and GaN-assisted converters.
Qoss 45 nC - Output charge directly impacts turn-off loss and zero-voltage switching (ZVS) initiation margin in resonant converters.
RthJC 0.9 °C/W - Junction-to-case thermal resistance allows >100 W power dissipation with modest heatsinking, supporting compact board layouts.
EAS 241 mJ - Single-pulse avalanche energy rating ensures survivability during transient overvoltage events without external clamping.

Pinout & Package

PG-TTFN-9 is a thermally enhanced 9-pin thin-profile flat no-lead package with exposed drain paddle. Four drain pins (5–8) are internally connected to the die's drain metallization; one gate pin (9) provides low-inductance gate control; four source pins (1–4) connect to the source terminal and serve as primary thermal and electrical return paths.

Pin/Terminal Circuit Role Design Meaning
Pin 1–4 Source Parallel low-inductance source connections; primary thermal path to PCB copper pour via soldered underside paddle.
Pin 5–8 Drain Four parallel drain terminals reduce current density and package inductance, improving EMI and switching robustness.
Pin 9 Gate Dedicated gate terminal with minimized loop inductance; designed for Kelvin connection to gate driver output.

Key Features

Feature Design Value
Logic-level gate drive Operates fully enhanced at VGS ≥ 4.5 V, eliminating need for level-shifting circuitry in 3.3 V/5 V control domains.
100% avalanche rated Guaranteed single-pulse avalanche energy of 241 mJ enables reliable operation in unclamped inductive switching scenarios.
Optimized body diode Low VSD = 0.79 V @ 20 A and controlled Qrr support efficient freewheeling and ZVS in half-bridge and full-bridge topologies.
Pb-free & halogen-free RoHS-compliant lead plating and IEC61249-2-21 compliant materials meet industrial and automotive environmental requirements.
JEDEC industrial qualification Fully qualified per JEDEC standards for extended temperature operation (−55 °C to +175 °C junction), ensuring long-term reliability in harsh environments.

Applications

Server VRM Synchronous Rectifier Industrial DC-DC Converter

Use Scenario: High-current, high-frequency buck converter supplying CPU core voltage (0.8–1.2 V @ up to 300 A) in data center servers.

IC Role / Device Role / Timing Role: Low-side synchronous rectifier MOSFET operating in continuous conduction mode at 500 kHz–1 MHz.

Use Value: 2.2 mΩ RDS(on) minimizes conduction loss under high DC load, while 26 nC QG enables clean, low-loss switching transitions with minimal driver overhead.

Use Scenario: 48 V to 12 V isolated DC-DC module for factory automation PLCs and motor drives.

IC Role / Device Role / Timing Role: Secondary-side synchronous rectifier in forward or LLC resonant topology.

Use Value: 241 mJ EAS withstands reflected transients from primary-side switching; 0.9 °C/W RthJC maintains Tj < 125 °C under full load without forced air.

Automotive On-Board Charger (OBC) Telecom Power Supply

Use Scenario: Bidirectional AC/DC and DC/DC stage in 11 kW OBC for EV charging, operating in both boost and buck modes.

IC Role / Device Role / Timing Role: High-current switch in interleaved totem-pole PFC and isolated DC-DC stages.

Use Value: Dual-rated RDS(on) (2.9 mΩ @ 4.5 V) ensures stable operation across wide input voltage range and varying gate drive capability during fault conditions.

Use Scenario: 54 V input telecom rectifier feeding distributed 12 V/48 V intermediate bus architecture.

IC Role / Device Role / Timing Role: Primary-side switch in phase-shifted full-bridge (PSFB) converter.

Use Value: Low Coss (720–936 pF) and Qoss (45 nC) reduce capacitive turn-off loss and improve ZVS window, increasing efficiency above 96% at full load.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-current logic-level MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
STL220N6F7AG RDS(on) = 2.4 mΩ @ 10 V; QG = 31 nC; PG-HSOF-8 package with 2 drain/source pins only. Limited thermal performance (RthJC = 1.5 °C/W); lower ID rating (120 A) restricts use in >200 A designs. Preferred where board space is constrained and thermal budget allows higher junction rise.
IXFN220N60X3 600 V rating; RDS(on) = 3.2 mΩ @ 10 V; TO-247 package; QG = 120 nC. Designed for high-voltage hard-switched PFC; unsuitable for low-VDS synchronous rectification due to excessive conduction loss and slow switching. Only viable if system requires 600 V blocking and can tolerate 45% higher RDS(on) and 4.6× higher QG.

Compared with STL220N6F7AG and IXFN220N60X3, IQE022N06LM5CGATMA1 offers the lowest RDS(on) and QG in its class, combined with industry-leading thermal resistance and avalanche ruggedness-making it optimal for high-density, high-efficiency 60 V synchronous rectification where thermal management and switching loss are critical.

Availability

IQE022N06LM5CGATMA1 is available at Aetrix Electronics and suitable for server VRMs, industrial DC-DC converters, and automotive on-board chargers requiring stable component supply, long-lifecycle support, and traceable sourcing.

Supply support for IQE022N06LM5CGATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and automotive ICs, with leadership in silicon and wide-bandgap power devices.

IQE022N06LM5CGATMA1 belongs to the OptiMOSTM 5 family-engineered specifically for high-efficiency, high-current switching in industrial and computing power supplies, emphasizing low RDS(on), fast switching, and ruggedness in compact surface-mount packages.

FAQ

What is the maximum continuous drain current for IQE022N06LM5CGATMA1 at 100 °C case temperature?

The maximum continuous drain current is 107 A at TC = 100 °C and VGS = 10 V, as specified in Table 2 of the Rev. 2.0 datasheet. At VGS = 4.5 V, the rating drops to 93 A under the same thermal condition due to increased RDS(on) at lower gate voltage.

Does IQE022N06LM5CGATMA1 support Kelvin source connection for accurate gate drive?

Yes-the PG-TTFN-9 package provides four dedicated source pins (1–4) electrically isolated from the gate and drain terminals, enabling true Kelvin source sensing. This allows precise gate-to-source voltage control and eliminates common-source inductance effects during high-di/dt switching.

Is the body diode suitable for reverse recovery in hard-switched topologies?

Yes-the body diode is characterized for reverse recovery with trr = 17–52 ns and Qrr = 9–196 nC depending on di/dt (100–1000 A/µs). Its low VSD (0.79 V typ.) and controlled Qrr enable reliable operation in hard-switched forward and active-clamp flyback converters without external Schottky assist.

Can IQE022N06LM5CGATMA1 be used in paralleled configurations?

Yes-its positive temperature coefficient of RDS(on) (verified in Diagram 9) ensures inherent current sharing when multiple units are paralleled. The symmetric 4-drain/4-source pin layout and low package inductance further support stable parallel operation in high-current (>300 A) applications such as AI accelerator power delivery.

IQE022N06LM5CGATMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
OptiMOS™ 5
Package/Case:
9-PowerTDFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
60 V
Current - Continuous Drain (Id) @ 25°C:
24A (Ta), 151A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
2.2mOhm @ 20A, 10V
Vgs(th) (Max) @ Id:
2.3V @ 48µA
Gate Charge (Qg) (Max) @ Vgs:
53 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
4420 pF @ 30 V
FET Feature:
-
Power Dissipation (Max):
2.5W (Ta), 100W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TTFN-9-3

IQE022N06LM5CGATMA1 FAQ

1.How can I place an order for IQE022N06LM5CGATMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for IQE022N06LM5CGATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IQE022N06LM5CGATMA1 reliable?

The price and inventory of IQE022N06LM5CGATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IQE022N06LM5CGATMA1 is usually 5 days.

3.What payment methods are accepted for IQE022N06LM5CGATMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IQE022N06LM5CGATMA1 transactions.

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IQE022N06LM5CGATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IQE022N06LM5CGATMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IQE022N06LM5CGATMA1?

For technical support, including IQE022N06LM5CGATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IQE022N06LM5CGATMA1 requirements.

6.How does Aetrix verify that IQE022N06LM5CGATMA1 is sourced from the original manufacturer or authorized distributors?

All IQE022N06LM5CGATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IQE022N06LM5CGATMA1 meets industry standards.

7.What is the process for return or replacement of IQE022N06LM5CGATMA1?

All IQE022N06LM5CGATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IQE022N06LM5CGATMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IQE022N06LM5CGATMA1 part is unused and in its original packaging.

Return procedure for IQE022N06LM5CGATMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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