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Infineon Technologies IRF135S203

Part No.:
IRF135S203
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixIRF135S203.pdf
Description:
MOSFET N-CH 135V 129A TO263-3
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:759

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Product details

Overview

IRF135S203 from Infineon Technologies (formerly International Rectifier) is a 135V, 129A D2-Pak packaged N-channel HEXFET® Power MOSFET optimized for high-current switching in motor drives and DC/DC converters. It delivers 6.7 mΩ typ. RDS(on) at VGS = 10 V, supports 512 A pulsed drain current, and features enhanced body diode dV/dt and dI/dt capability for robust synchronous rectification and half-bridge operation.

For engineers reviewing the IRF135S203 datasheet, IRF135S203 pinout, IRF135S203 application, or IRF135S203 equivalent, this device is selected for high-efficiency, thermally demanding power stages where avalanche ruggedness, low conduction loss, and fast switching with controlled Qgd/Qgs ratio are critical - especially in BLDC inverters and resonant-mode SMPS.

Technical Context

This MOSFET employs a planar silicon process with optimized cell pitch and trench-assisted charge balance to achieve high current density while maintaining stable threshold voltage (2.0–4.0 V) across –55°C to +175°C. Its dynamic characteristics - including 46 nC Qgd, 43 nC Qgs, and 180–270 nC total gate charge - support precise timing control in hard-switched topologies.

The device integrates a co-packaged, optimized body diode with 80 ns trr (TJ = 25°C), 4.0 V/ns peak recovery dv/dt rating, and 270 nC Qrr, enabling reliable operation in bidirectional energy transfer applications such as OR-ing and synchronous rectification without external Schottky supplementation.

Key Specifications

Parameter Value and Actual Design Meaning
VDSS 135 V - Withstands up to 135 V drain-to-source blocking voltage, suitable for 48 V and 96 V bus systems with margin.
RDS(on) max 8.4 mΩ at VGS = 10 V, ID = 77 A - Enables <1 W conduction loss at 77 A, reducing heatsink requirements in high-current paths.
ID continuous 129 A at TC = 25°C - Supports high-power motor drive and converter output stages without parallel devices.
EAS 595 mJ (single-pulse, thermally limited) - Sustains unclamped inductive switching events common in H-bridge fault conditions.
Qg typ. 180 nC - Determines gate driver power and rise/fall time; paired with 2.1 Ω gate resistance for ~73 ns rise time at 77 A load.
Coss eff. (ER) 520 pF - Represents energy stored in output capacitance during turn-off; critical for ZVS design in resonant converters.
trr / Qrr 80 ns / 270 nC at TJ = 25°C - Low reverse recovery charge minimizes switching loss and EMI in synchronous rectifier mode.

Pinout & Package

D2-Pak (TO-263AB) package with isolated tab; surface-mount footprint compatible with standard PCB thermal pads and automated assembly. Thermal resistance RθJC = 0.34 °C/W enables >400 W dissipation with proper heatsinking.

Pin/Terminal Circuit Role Design Meaning
Pin 1 (G) Gate Control terminal; requires 10 V for full enhancement; 2.1 Ω internal gate resistance limits ringing and simplifies driver design.
Pin 2 (D) Drain Main high-side current path; electrically connected to exposed copper tab - must be isolated from heatsink unless referenced to system ground.
Pin 3 (S) Source Reference node for gate drive and current sensing; ties to power ground or low-side switch source in half-bridge configurations.

Key Features

Feature Design Value
Enhanced body diode dV/dt capability 4.0 V/ns peak recovery dv/dt at TJ = 175°C - Prevents false turn-on during fast commutation in bridge legs.
Fully characterized avalanche SOA 595 mJ single-pulse EAS with validated thermal failure model - Allows safe operation under unclamped inductive switching without derating.
Lead-free, RoHS-compliant construction Halogen-free molding compound and matte tin lead finish - Meets IPC-J-STD-020 moisture sensitivity level 1 (MSL1) for reflow compatibility.
Low Ciss/Coss ratio 9700 pF / 540 pF = 17.9 - Improves Miller immunity and reduces gate drive energy versus high-ratio competitors.

Applications

Brushed Motor Drive BLDC Inverter Stage

Use Scenario: High-torque 48 V DC brushed motor control in power tools and industrial actuators.

IC Role / Device Role / Timing Role: Low-side switching element in H-bridge topology, conducting up to 129 A continuous current.

Use Value: 6.7 mΩ RDS(on) reduces I²R losses by >30% vs. legacy 12 mΩ MOSFETs, extending battery runtime and limiting thermal runaway risk.

Use Scenario: Upper-leg switching in three-phase BLDC inverter for e-bike and HVAC fan modules.

IC Role / Device Role / Timing Role: High-side power switch with integrated body diode used for freewheeling during PWM off-time.

Use Value: 80 ns trr and 270 nC Qrr minimize shoot-through risk and reduce switching loss by 22% compared to standard MOSFETs in 20 kHz PWM operation.

Synchronous Rectifier OR-ing Power Switch

Use Scenario: Secondary-side rectification in 12 V/500 W LLC resonant DC/DC converter for telecom power supplies.

IC Role / Device Role / Timing Role: Synchronous rectifier replacing Schottky diode; driven with precise gate timing aligned to transformer voltage polarity.

Use Value: Body diode's 1.3 V VSD and low Qrr enable >97.5% efficiency at full load, exceeding discrete diode performance by 1.8% absolute.

Use Scenario: Redundant 48 V input OR-ing in industrial PLC backplane power distribution.

IC Role / Device Role / Timing Role: Low-loss forward conduction path with fast turn-off to prevent reverse current flow during supply switchover.

Use Value: 512 A pulsed current rating and 4.0 V/ns dv/dt immunity ensure fail-safe isolation during hot-swap events without external protection circuitry.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
STP130N10F7 100 V VDSS, 8.5 mΩ RDS(on), 130 A ID, TO-220 - lower voltage rating, higher RDS(on) at 100 V class. Not suitable for 135 V bus designs; acceptable only in ≤100 V systems with tighter thermal constraints. Select when cost sensitivity outweighs voltage margin and board space permits TO-220 mounting.
IXFH130N15T2 150 V VDSS, 9.5 mΩ RDS(on), 130 A ID, TO-247 - higher voltage headroom but 41% higher gate charge (255 nC). Better for 150 V transient tolerance; slower switching due to higher Qg, requiring stronger gate drivers. Prefer when system-level overvoltage protection exceeds ±15 V and thermal design accommodates larger package.

Compared with STP130N10F7 and IXFH130N15T2, IRF135S203 uniquely balances 135 V rating, sub-8.4 mΩ on-resistance, and 180 nC gate charge in D2-Pak - making it optimal for space-constrained, high-efficiency 48–96 V motor and converter designs where thermal density and switching speed are jointly critical.

Availability

IRF135S203 is available at Aetrix Electronics and suitable for brushed motor drives, BLDC inverters, and synchronous rectifier circuits requiring stable component supply across automotive-grade production cycles and industrial OEM programs.

Supply support for IRF135S203 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader specializing in power management, sensor, and automotive ICs, with deep expertise in silicon and wide-bandgap power devices.

This device belongs to the StrongIRFET™ family - engineered specifically for high-current, high-reliability power conversion in motor control and industrial SMPS, emphasizing ruggedness, low RDS(on), and body-diode performance.

FAQ

What is the maximum junction temperature and thermal resistance of IRF135S203?

The IRF135S203 has a rated operating junction temperature range of –55°C to +175°C. Its junction-to-case thermal resistance (RθJC) is 0.34°C/W under standard test conditions, measured at approximately 90°C junction temperature. This value assumes direct thermal contact between the exposed drain tab and a flat, greased heatsink surface.

Does IRF135S203 support gate drive at 5 V logic levels?

No - IRF135S203 has a gate threshold voltage (VGS(th)) range of 2.0–4.0 V, but its RDS(on) specification (6.7 mΩ typ.) is guaranteed only at VGS = 10 V. At 5 V, RDS(on) rises significantly (>25 mΩ), increasing conduction loss and thermal stress; 10 V gate drive is required for full performance.

Can IRF135S203 replace IRF135B203 in existing TO-220 designs?

No - IRF135S203 uses the D2-Pak (TO-263AB) package with surface-mount leads and an exposed drain tab, while IRF135B203 uses the through-hole TO-220AB package. The footprints, thermal mounting, and mechanical retention are incompatible; redesign of PCB layout and heatsink interface is required.

What is the avalanche energy rating and how is it validated?

IRF135S203 is rated for 595 mJ single-pulse avalanche energy (EAS) under defined test conditions (L = 200 µH, RG = 50 Ω, IAS = 77 A, VGS = 10 V). This rating is thermally limited and validated per AN-1005 methodology, ensuring junction temperature remains below 175°C during the event - not a repetitive rating.

IRF135S203 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HEXFET®, StrongIRFET™
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tape & Reel (TR)
Product Status:
Last Time Buy
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
135 V
Current - Continuous Drain (Id) @ 25°C:
129A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
8.4mOhm @ 77A, 10V
Vgs(th) (Max) @ Id:
4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
270 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
9700 pF @ 50 V
FET Feature:
-
Power Dissipation (Max):
441W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TO263-3-2

IRF135S203 FAQ

1.How can I place an order for IRF135S203 through Aetrix?

Please submit a Request for Quotation (RFQ) for IRF135S203 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRF135S203 reliable?

The price and inventory of IRF135S203 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF135S203 is usually 5 days.

3.What payment methods are accepted for IRF135S203?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF135S203 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRF135S203?

IRF135S203 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRF135S203 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRF135S203?

For technical support, including IRF135S203 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF135S203 requirements.

6.How does Aetrix verify that IRF135S203 is sourced from the original manufacturer or authorized distributors?

All IRF135S203 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF135S203 meets industry standards.

7.What is the process for return or replacement of IRF135S203?

All IRF135S203 units undergo pre-shipment inspection (PSI). If there is an issue with IRF135S203, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRF135S203 part is unused and in its original packaging.

Return procedure for IRF135S203:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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