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Vishay Siliconix IRF540STRR

Part No.:
IRF540STRR
Manufacturer:
Vishay Siliconix
Category:
FETs, MOSFETs
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixIRF540STRR.pdf
Description:
MOSFET N-CH 100V 28A D2PAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:7,598

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Product details

Overview

IRF540STRR from Vishay Siliconix is a surface-mount N-channel power MOSFET in D2PAK (TO-263) package, rated for 100 V drain-source voltage, 28 A continuous drain current at TC = 25 °C, and 0.077 Ω RDS(on) at VGS = 10 V. It delivers fast switching, repetitive avalanche capability, and 175 °C maximum junction temperature-commonly used in DC-DC converters, motor drives, and uninterruptible power supplies.

For engineers reviewing the IRF540STRR datasheet, IRF540STRR pinout, IRF540STRR application, or IRF540STRR equivalent, key selection criteria include its 72 nC total gate charge, 230 mJ single-pulse avalanche energy, body diode reverse recovery time of 180–360 ns, thermal resistance RthJC = 1.0 °C/W, and suitability for high-current surface-mount power stages requiring ruggedness and paralleling capability.

Technical Context

This third-generation power MOSFET employs planar V-groove silicon technology optimized for low conduction loss and controlled switching behavior. Its dynamic dv/dt rating of 5.5 V/ns and built-in body diode with 2.5 V forward drop at 28 A support robust operation in inductive switching circuits.

The device features fully characterized gate charge components (Qgs = 11 nC, Qgd = 32 nC), defined safe operating area up to 100 V/28 A (single pulse), and linear derating of 1.0 W/°C above 25 °C case temperature-enabling precise thermal design in PCB-mounted applications.

Key Specifications

Parameter Value and Actual Design Meaning
VDS100 V - Maximum blocking voltage before breakdown; defines upper limit for DC bus or flyback clamp applications.
RDS(on) @ VGS = 10 V0.077 Ω - Conduction loss of ~22 W at 17 A; enables efficient high-current switching below 100 V.
Qg72 nC - Total gate charge determines driver strength requirement; impacts switching loss and gate drive loop stability.
ID (continuous, TC = 25 °C)28 A - Sustained current capability when mounted on heatsink; requires thermal interface design per RthJC = 1.0 °C/W.
EAS230 mJ - Single-pulse avalanche energy rating; allows safe operation during inductive turn-off transients without snubber.
TJ max175 °C - Maximum junction temperature; supports operation in industrial environments with margin over standard 150 °C limits.
dv/dt rating5.5 V/ns - Immunity to parasitic turn-on during high-speed voltage transitions; critical for half-bridge and synchronous rectifier use.

Pinout & Package

D2PAK (TO-263) surface-mount package with exposed drain tab for thermal and electrical connection; 3-terminal configuration (G, D, S); 15.88 mm × 10.67 mm footprint; 1.65 mm max height; RoHS-compliant lead-free and halogen-free construction.

Pin/Terminal Circuit Role Design Meaning
Gate (G)Control terminalReceives voltage-controlled signal to modulate channel conductivity; requires < ±20 V absolute rating and ≤100 nA leakage.
Drain (D)High-side power outputConnected to PCB thermal pad; carries full load current and dissipates heat via case-to-heatsink path; electrically tied to exposed metal tab.
Source (S)Reference node / return pathServes as common reference for gate drive and current sensing; internal source inductance (LS = 7.5 nH) affects switching waveform fidelity.

Key Features

Feature Design Value
Surface-mount D2PAK packageEnables automated assembly and high-power density layout; thermal pad supports >2.0 W dissipation on FR-4 PCB without external heatsink.
Repetitive avalanche ratedRated for 15 mJ repetitive avalanche energy-supports reliable operation in unclamped inductive loads without external protection.
Fast switching with low Qgd/Qg ratioQgd = 32 nC / Qg = 72 nC ≈ 44 % - Reduces Miller plateau duration and improves hard-switching efficiency.
Body diode with soft recoverytrr = 180–360 ns, Qrr = 1.3–2.8 μC - Minimizes voltage overshoot and EMI in freewheeling paths compared to standard recovery diodes.
175 °C operating temperatureExtends usable lifetime in sealed enclosures or high-ambient environments; enables derated operation at 125 °C ambient with 50 °C margin.

Applications

DC-DC Buck Converter Brushed DC Motor Drive

Use Scenario: High-efficiency 24–48 V input, 5–12 V output step-down converter delivering up to 20 A.

IC Role / Device Role / Timing Role: Primary high-side switch controlling duty cycle and power transfer; operates at 100–500 kHz with synchronous rectification.

Use Value: Low RDS(on) minimizes conduction loss; 72 nC Qg enables compatibility with standard gate drivers; avalanche rating protects against inductor saturation events.

Use Scenario: H-bridge control of 24 V brushed motors in industrial actuators or robotics with peak currents to 30 A.

IC Role / Device Role / Timing Role: Low-side or high-side switching element handling bidirectional current and PWM commutation at ≤20 kHz.

Use Value: Fast turn-off (tf = 43 ns) reduces shoot-through risk; body diode handles freewheeling current; 230 mJ EAS absorbs inductive kickback during abrupt stop commands.

Uninterruptible Power Supply (UPS) AC-DC PFC Front-End

Use Scenario: Battery backup in-line UPS with 100–200 W output, using line-frequency or high-frequency transformer isolation.

IC Role / Device Role / Timing Role: Output stage switch in offline half-bridge or push-pull topology; conducts during battery discharge phase.

Use Value: 100 V VDS accommodates 48 V battery + surge margin; 175 °C TJ ensures reliability under sustained overload; ease of paralleling supports higher power scaling.

Use Scenario: Active boost PFC stage in 110/230 V AC input SMPS, operating at 65–100 kHz with 380 V DC bus.

IC Role / Device Role / Timing Role: Boost switch handling discontinuous or continuous conduction mode; subjected to high dv/dt and reverse recovery stress.

Use Value: 5.5 V/ns dv/dt rating prevents false turn-on; soft-recovery body diode reduces EMI from diode reverse recovery; RDS(on) balances conduction vs. switching loss trade-off.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
IRF540NPbFSame die, TO-220 through-hole package; RthJA = 62 °C/W (vs. 40 °C/W PCB mount for IRF540STRR); no thermal pad.Better suited for prototyping or low-volume designs with heatsink mounting; lacks surface-mount automation compatibility.Select when manual assembly, mechanical heatsinking, or legacy board compatibility is required over PCB thermal performance.
STP55NF06L60 V VDS, 55 A ID, 0.018 Ω RDS(on); logic-level gate (VGS(th) = 1–2.5 V); lower Qg (65 nC) but reduced voltage rating.Optimized for 12–24 V systems only; unsuitable for 48 V+ or universal input AC-DC where 100 V rating is mandatory.Choose only for low-voltage, high-current applications where gate drive simplicity and lower conduction loss outweigh voltage headroom needs.

Compared with IRF540NPbF, IRF540STRR offers superior thermal performance in surface-mount layouts and eliminates through-hole assembly steps; versus STP55NF06L, it provides essential 100 V rating and avalanche ruggedness for industrial and off-line power, despite higher gate charge and on-resistance.

Availability

IRF540STRR is available at Aetrix Electronics and suitable for DC-DC converters, motor drives, and uninterruptible power supplies requiring stable component supply, long-term industrial lifecycle support, and RoHS-compliant manufacturing.

Supply support for IRF540STRR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix is a global leader in discrete semiconductors, specializing in power MOSFETs, diodes, and optoelectronics with emphasis on ruggedness, precision, and high-reliability packaging.

The IRF540STRR belongs to Vishay's third-generation surface-mount power MOSFET family, engineered for high-current, high-temperature industrial and power conversion applications where low on-resistance, fast switching, and avalanche survivability are critical.

FAQ

What is the maximum continuous drain current rating for IRF540STRR at 100 °C case temperature?

The IRF540STRR supports 20 A continuous drain current at TC = 100 °C, per its absolute maximum ratings table. This derating reflects thermal limitations of the D2PAK package under sustained high-power operation and must be validated against actual PCB layout and heatsinking conditions. The IRF540STRR maintains RDS(on) stability across this range due to its positive temperature coefficient.

Does IRF540STRR have a built-in body diode, and what are its key parameters?

Yes, the IRF540STRR integrates a monolithic body diode with VSD = 2.5 V at IS = 28 A and TJ = 25 °C, reverse recovery time trr = 180–360 ns, and Qrr = 1.3–2.8 μC. These values are measured under standardized conditions (IF = 17 A, dI/dt = 100 A/μs) and confirm suitability for freewheeling in hard-switched topologies without external diode supplementation.

Is IRF540STRR pin-compatible with IRF540NPbF?

No, IRF540STRR uses a D2PAK (TO-263) surface-mount package with three terminals (G, D, S) and an exposed drain thermal pad, while IRF540NPbF uses a TO-220 through-hole package with different pin spacing, mounting holes, and thermal interface. They share identical electrical specifications but require distinct PCB footprints and assembly processes.

What is the gate threshold voltage range for IRF540STRR, and how does it affect drive requirements?

The IRF540STRR has a gate threshold voltage VGS(th) of 2.0–4.0 V at ID = 250 μA. This standard-level gate requires ≥10 V for full enhancement (RDS(on) = 0.077 Ω), making it incompatible with 3.3 V or 5 V logic without level-shifting. Gate drive must supply sufficient current to charge 72 nC Qg within desired switching times while managing Miller capacitance effects.

Can IRF540STRR be paralleled for higher current capacity, and what design considerations apply?

Yes, the IRF540STRR is explicitly designed for ease of paralleling due to its positive temperature coefficient of RDS(on), which promotes current sharing. Key considerations include matched gate drive impedance (<5 Ω per device), symmetrical PCB layout with equal trace lengths, shared thermal plane, and individual gate resistors (≥10 Ω) to damp oscillation. The IRF540STRR's low Qgd/Qg ratio further enhances dynamic balance during switching transitions.

IRF540STRR Specifications

Product attributes
Attribute value
Manufacturer:
Vishay Siliconix
Series:
-
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
100 V
Current - Continuous Drain (Id) @ 25°C:
28A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
77mOhm @ 17A, 10V
Vgs(th) (Max) @ Id:
4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
72 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
1700 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
3.7W (Ta), 150W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
TO-263 (D2PAK)

IRF540STRR FAQ

1.How can I place an order for IRF540STRR through Aetrix?

Please submit a Request for Quotation (RFQ) for IRF540STRR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRF540STRR reliable?

The price and inventory of IRF540STRR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF540STRR is usually 5 days.

3.What payment methods are accepted for IRF540STRR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF540STRR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRF540STRR?

IRF540STRR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRF540STRR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRF540STRR?

For technical support, including IRF540STRR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF540STRR requirements.

6.How does Aetrix verify that IRF540STRR is sourced from the original manufacturer or authorized distributors?

All IRF540STRR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF540STRR meets industry standards.

7.What is the process for return or replacement of IRF540STRR?

All IRF540STRR units undergo pre-shipment inspection (PSI). If there is an issue with IRF540STRR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRF540STRR part is unused and in its original packaging.

Return procedure for IRF540STRR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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