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Infineon Technologies IRF7413ZTRPBFXTMA1

Part No.:
IRF7413ZTRPBFXTMA1
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixIRF7413ZTRPBFXTMA1.pdf
Description:
TRENCH <= 40V
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,938

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Product details

Overview

IRF7413ZTRPBFXTMA1 from Infineon Technologies is a 30V, 13A N-channel enhancement-mode HEXFET Power MOSFET in SO-8 package, optimized as a control FET in notebook processor power stages and synchronous rectifier in POL converters for computing and telecom systems, featuring 8.0 mΩ RDS(on) at VGS = 10 V, 2.3 Ω gate resistance, and 9.5 nC total gate charge.

For engineers reviewing the IRF7413ZTRPBFXTMA1 datasheet, IRF7413ZTRPBFXTMA1 pinout, IRF7413ZTRPBFXTMA1 application, or IRF7413ZTRPBFXTMA1 equivalent, key selection criteria include low RDS(on) for conduction loss reduction, ultra-low gate impedance for fast switching in high-frequency DC/DC topologies, avalanche-rated ruggedness for unclamped inductive load handling, and SO-8 thermal performance with RθJA = 50 °C/W.

Technical Context

This MOSFET operates as a high-side control switch in synchronous buck converters, where its 30V VDSS, 13A ID rating at 25°C, and 100% avalanche-tested capability support reliable operation under transient overvoltage and inductive energy recovery. Its gate threshold voltage (1.35–2.25 V) enables compatibility with 3.3 V and 5 V gate drivers.

The device integrates a body diode with 1.0 V forward voltage and 24 ns typical reverse recovery time, enabling efficient freewheeling in synchronous rectification. Its Qgd/Qgs1 ratio is minimized to suppress Cdv/dt turn-on during high dV/dt node transitions - critical for shoot-through prevention in 500 kHz–1 MHz POL designs.

Key Specifications

ParameterValue and Actual Design Meaning
VDSS30 V - supports input rails up to 24 V with margin for transient spikes in notebook CPU VRMs
RDS(on) max10 mΩ @ VGS = 10 V - enables <150 mW conduction loss at 13 A, critical for thermally constrained mobile platforms
Qg typ9.5 nC - determines gate drive power and switching speed; enables <12 ns turn-off delay at 1 A drive current
ID @ 25°C13 A continuous - rated for sustained current in high-density point-of-load converter output stages
RθJA50 °C/W - defines thermal rise above ambient in standard SO-8 PCB layout; limits power dissipation to ~1.6 W at 70°C ambient
EAS32 mJ - specifies single-pulse avalanche energy handling without failure, essential for robustness in unclamped inductive switching
VGS(th)1.35–2.25 V - ensures reliable turn-on with logic-level gate drivers while maintaining noise immunity

Pinout & Package

IRF7413ZTRPBFXTMA1 is housed in a surface-mount SO-8 package with exposed drain pad for enhanced thermal conduction. Pin numbering follows standard SO-8 top-view orientation (pin 1 at top-left corner).

Pin/TerminalCircuit RoleDesign Meaning
1, 2, 3, 4, 5, 7, 8Drain (D)Seven parallel drain terminals - reduce current density and package inductance; connected to internal die drain metallization and exposed pad
6Gate (G)Single gate input - accepts PWM control signal; low 2.3 Ω RG minimizes gate oscillation risk
Source (S)Source (S)Terminals 1–5 and 7–8 are internally tied to source; provides low-inductance return path for high di/dt switching currents

Key Features

FeatureDesign Value
Ultra-low gate impedanceRG = 2.3 Ω typ - reduces gate ringing and enables stable 1 MHz+ switching with minimal external gate resistor
Fully characterized avalanche100% tested EAS = 32 mJ - eliminates need for external snubbers in synchronous buck high-side switching
Low RDS(on) at 4.5 V10.5 mΩ max @ VGS = 4.5 V - supports direct drive from 5 V controllers without level-shifting
Lead-free and RoHS-compliantPb-free plating and halogen-free molding compound - meets IPC-J-STD-020 moisture sensitivity level 1 (MSL1)
Optimized Qgd/Qgs1 ratioQgd = 3.0 nC, Qgs1 = 3.0 nC - suppresses Cdv/dt induced turn-on during high dV/dt node transitions

Applications

Processor Voltage RegulatorGraphics Card POL Converter

Use Scenario: High-current, fast-transient CPU core supply in ultrabook platforms requiring <1 µs load-step response.

IC Role / Device Role: High-side control FET in synchronous buck stage, switching at 500 kHz–1 MHz with 3.3 V gate drive.

Use Value: 8.0 mΩ RDS(on) and 9.5 nC Qg jointly minimize both conduction and switching losses, enabling >92% efficiency at 10 A output.

Use Scenario: GPU core rail delivery in discrete graphics cards with tight thermal envelope and dynamic power management.

IC Role / Device Role: Synchronous rectifier FET in multiphase buck converter, operating with 100% duty-cycle capability during deep sleep states.

Use Value: Body diode VSD ≤ 1.0 V and Qrr = 16 nC reduce reverse recovery loss and cross-conduction risk during phase interleaving.

Telecom Baseband PowerNetworking ASIC Supply

Use Scenario: Point-of-load regulation for 5G baseband processors with burst-mode operation and strict EMI limits.

IC Role / Device Role: Low-noise control FET in valley-switching buck converter, leveraging low Crss (140 pF) to minimize capacitive coupling.

Use Value: Crss/Ciss ratio of 0.115 reduces gate drive sensitivity to switching node dV/dt, improving EMI performance in dense RF layouts.

Use Scenario: Multi-rail power delivery for high-speed SerDes and packet processing ASICs in enterprise switches.

IC Role / Device Role: Dual-function device acting as both high-side switch and integrated freewheeling path via body diode.

Use Value: 100% avalanche-tested ruggedness ensures survival during hot-swap events and cable discharge transients per IEC 61000-4-2 Level 4.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IRF7413PBFSame die, non-tape-and-reel packaging; RDS(on) identical but no MSL1 qualificationNot qualified for automated SMT assembly; requires manual placement or reflow profile adjustmentSelect when prototyping or low-volume builds where tape-and-reel logistics are unnecessary
Si7852DP-T1-GE330 V, 12 A, RDS(on) = 9.5 mΩ @ 10 V, Qg = 11.5 nC, SO-8 with different pinout (G/S/D vs D/G/S)Non-drop-in replacement due to gate-source pin swap; requires PCB redesignChoose only if higher Qoss tolerance (12 nC vs 5.6 nC) and lower Crss (100 pF) are prioritized over pin compatibility

Compared with IRF7413PBF, IRF7413ZTRPBFXTMA1 offers MSL1 reliability and tape-and-reel readiness for high-volume SMT lines; versus Si7852DP-T1-GE3, it delivers lower gate charge and guaranteed pinout compatibility but trades off slightly higher Crss - making it preferable for cost-sensitive, high-yield notebook VRM production.

Availability

IRF7413ZTRPBFXTMA1 is available at Aetrix Electronics and suitable for notebook processor VRMs, graphics card POL converters, and telecom baseband power supplies requiring stable component supply, long-term lifecycle assurance, and full traceability.

Supply support for IRF7413ZTRPBFXTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification to ISO 9001 and IATF 16949.

This device belongs to Infineon's HEXFET® Power MOSFET product line, engineered specifically for high-efficiency, high-frequency DC/DC conversion in space-constrained computing and communications infrastructure.

FAQ

What is the maximum junction temperature for continuous operation?

The IRF7413ZTRPBFXTMA1 has a specified TJ range of –55°C to +150°C. For continuous operation, the absolute maximum steady-state junction temperature is 150°C. Derating is required above 25°C ambient per the linear derating factor of 20 mW/°C beyond 25°C, based on RθJA = 50 °C/W. Thermal design must ensure peak TJ remains below 150°C under worst-case load and airflow conditions.

Is this MOSFET suitable for 3.3 V gate drive applications?

Yes - the device has a gate threshold voltage range of 1.35–2.25 V and guarantees RDS(on) ≤ 10.5 mΩ at VGS = 4.5 V. While not fully enhanced at 3.3 V, it delivers usable on-resistance (~15–18 mΩ) and sufficient transconductance for moderate-current, medium-frequency applications such as always-on bias rails or low-duty-cycle control paths.

Does IRF7413ZTRPBFXTMA1 include integrated ESD protection?

No - this is a discrete power MOSFET without on-die ESD protection circuitry. The gate oxide is rated for ±20 V VGS, and the device requires external gate protection (e.g., 10 Ω series resistor + 12 V TVS) in environments with handling or system-level ESD risk. Gate damage from static discharge is irreversible and not covered under warranty.

Can this part replace IRF7413ZPbF in existing designs?

Yes - IRF7413ZTRPBFXTMA1 is the tape-and-reel, MSL1-qualified successor to IRF7413ZPbF, sharing identical electrical specifications, SO-8 footprint, pinout, and thermal characteristics. The "XTMA1" suffix denotes Infineon's standard tape-and-reel packaging with moisture-sensitive level 1 compliance, making it directly substitutable in automated SMT production without layout or firmware changes.

IRF7413ZTRPBFXTMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HEXFET®
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
13A (Ta)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
10mOhm @ 13A, 10V
Vgs(th) (Max) @ Id:
2.25V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
14 nC @ 4.5 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
1210 pF @ 15 V
FET Feature:
-
Power Dissipation (Max):
2.5W (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-DSO-8-902

IRF7413ZTRPBFXTMA1 FAQ

1.How can I place an order for IRF7413ZTRPBFXTMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for IRF7413ZTRPBFXTMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRF7413ZTRPBFXTMA1 reliable?

The price and inventory of IRF7413ZTRPBFXTMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF7413ZTRPBFXTMA1 is usually 5 days.

3.What payment methods are accepted for IRF7413ZTRPBFXTMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF7413ZTRPBFXTMA1 transactions.

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IRF7413ZTRPBFXTMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRF7413ZTRPBFXTMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRF7413ZTRPBFXTMA1?

For technical support, including IRF7413ZTRPBFXTMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF7413ZTRPBFXTMA1 requirements.

6.How does Aetrix verify that IRF7413ZTRPBFXTMA1 is sourced from the original manufacturer or authorized distributors?

All IRF7413ZTRPBFXTMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF7413ZTRPBFXTMA1 meets industry standards.

7.What is the process for return or replacement of IRF7413ZTRPBFXTMA1?

All IRF7413ZTRPBFXTMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IRF7413ZTRPBFXTMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRF7413ZTRPBFXTMA1 part is unused and in its original packaging.

Return procedure for IRF7413ZTRPBFXTMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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