Infineon Technologies IRF8113TRPBF
- Part No.:
- IRF8113TRPBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
IRF8113TRPBF.pdf
- Description:
- MOSFET N-CH 30V 17.2A 8SO
- Quantity:
- Payment:

- Shipping:

Inventory:165
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Product details
Overview
IRF8113TRPBF from Infineon Technologies is a 30V, 17.2A N-channel HEXFET Power MOSFET in SO-8 package, optimized as a synchronous rectifier FET in isolated DC-DC converters and control FET in notebook CPU power stages. It delivers 4.7 mΩ RDS(on) at VGS = 10 V, 24 nC total gate charge, and 100% RG-tested for low-noise switching in high-frequency (>500 kHz) point-of-load applications.
For engineers reviewing the IRF8113TRPBF datasheet, IRF8113TRPBF pinout, IRF8113TRPBF application, or IRF8113TRPBF equivalent, key selection criteria include its 5.6 mΩ max RDS(on) at 4.5 V VGS, 13.3 A continuous drain current at 70°C, 10 nC Qsw, body diode trr of 34–51 ns, and SO-8 thermal resistance (RθJA = 50°C/W).
Technical Context
This device is engineered for synchronous rectification in isolated forward/flyback topologies and as the low-side control FET in multiphase buck converters. Its low Qgd/Qgs1 ratio minimizes Cdv/dt-induced turn-on risk at the switching node, and its fully characterized avalanche rating (EAS = 48 mJ) supports robust unclamped inductive switching.
The SO-8 package enables dual-side cooling via exposed drain pads, and its 1.6 Ω typical gate resistance (RG) ensures stable gate drive timing with standard PWM controllers. The body diode exhibits VSD ≤ 1.0 V at 13.3 A and Qrr = 21–32 nC - critical for minimizing cross-conduction losses in synchronous operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - maximum blocking voltage compatible with 12 V and 24 V input rails in telecom and computing power supplies |
| RDS(on) max @ 10 V | 5.6 mΩ - conduction loss of ≤95 mW at 13.3 A, enabling >95% efficiency in 12 V → 1.2 V POL stages |
| Qg typ | 24 nC - gate drive energy requirement dictates minimum gate driver peak current (≥2 A for 12 ns rise time) |
| tr/tf | 8.9 ns / 3.5 ns - fast edge rates support >1 MHz switching without excessive EMI filtering overhead |
| Qrr | 21–32 nC - reverse recovery charge directly impacts shoot-through risk and primary-side FET stress in synchronous flyback |
| RθJA | 50°C/W - junction-to-ambient thermal resistance defines heatsinking requirements for 13.3 A continuous operation at 70°C ambient |
| Ciss | 2910 pF - input capacitance sets Miller plateau duration and influences gate driver loop stability |
Pinout & Package
IRF8113TRPBF uses an SO-8 surface-mount package with exposed drain pad for enhanced thermal performance. Drain terminals are internally paralleled across pins 1–4 and 6–8; source connects to pins 5 and 7; gate occupies pin 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 6, 7, 8 | Drain (D) | High-current output path tied to switching node; multiple pins reduce current density and parasitic inductance |
| 5, 7 | Source (S) | Power return path for load current; shared with body diode cathode; referenced to gate drive ground |
| 3 | Gate (G) | Control terminal requiring <24 nC charge to switch; sensitive to dV/dt coupling from adjacent drain pins |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(on) at 4.5 V | 5.8 mΩ max - enables efficient operation with 5 V gate drive from standard controller ICs, reducing need for bootstrap or level-shift circuitry |
| Fully characterized avalanche | EAS = 48 mJ at TJ = 25°C - guarantees safe single-pulse energy handling during transient overloads without derating |
| 100% RG tested | 0.8–1.5 Ω gate resistance - ensures consistent switching timing and reduces gate oscillation risk across production lots |
| Lead-free and RoHS compliant | Pb-free plating per JEDEC J-STD-020 - eliminates lead contamination risk in reflow assembly and meets global environmental compliance mandates |
Applications
| Server VRM Power Stage | Notebook CPU Core Supply |
|---|---|
Use Scenario: Multiphase buck converter delivering 1.0–1.3 V @ 100+ A to Xeon/EPYC processors under dynamic load transients. IC Role / Device Role: Low-side synchronous rectifier FET, operating in parallel with 3–6 identical units per phase. Use Value: 4.7 mΩ RDS(on) and 10 nC Qsw minimize conduction + switching loss, enabling >92% full-load efficiency at 1 MHz. | Use Scenario: Dual-phase 1.2 V/40 A core supply in ultrabook platforms with strict thermal envelope (<30 mm² PCB area). IC Role / Device Role: Control FET in high-side position, driven by integrated PWM controller with 4.5 V gate output. Use Value: 5.6 mΩ RDS(on) at 4.5 V VGS eliminates need for external gate boosters, simplifying layout and reducing BOM count. |
| Isolated Telecom DC-DC | Industrial PoE PSE Controller |
Use Scenario: 48 V input, 12 V/15 A isolated forward converter in network line cards with 500 kHz switching frequency. IC Role / Device Role: Secondary-side synchronous rectifier replacing Schottky diodes to improve efficiency and reduce heat sink size. Use Value: Body diode trr = 34 ns and Qrr = 21 nC prevent voltage spikes during commutation, eliminating snubber circuits. | Use Scenario: IEEE 802.3at Type 2 PSE power sourcing equipment delivering up to 30 W per port with hot-swap protection. IC Role / Device Role: Primary-side current-limiting switch in the 48 V feed path, handling inrush and short-circuit fault currents. Use Value: 135 A pulsed drain current (IDM) and 48 mJ EAS withstand repeated 80 V/10 A surge events without degradation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SiR872DP-T1-GE3 | RDS(on) = 4.0 mΩ @ 10 V; Qg = 32 nC; SO-8 with enhanced thermal pad | Higher conduction efficiency but slower switching due to higher gate charge | Preferable where thermal headroom is limited and switching frequency ≤300 kHz |
| IPB80N04S4-02 | RDS(on) = 2.0 mΩ @ 10 V; TO-263 package; Qg = 65 nC | Lower RDS(on) but larger footprint and higher drive loss; not SO-8 drop-in | Only suitable when board redesign allows TO-263 mounting and gate driver can supply ≥3 A peak |
Compared with SiR872DP-T1-GE3 and IPB80N04S4-02, IRF8113TRPBF offers optimal balance of low Qg (24 nC), moderate RDS(on) (4.7 mΩ), and SO-8 compatibility - making it ideal for space-constrained, high-frequency synchronous rectifier designs where gate drive capability and layout simplicity are prioritized over absolute lowest conduction loss.
Availability
IRF8113TRPBF is available at Aetrix Electronics and suitable for server VRM power stages, notebook CPU core supplies, isolated telecom DC-DC converters, and industrial PoE PSE controllers requiring stable component supply and long-term manufacturability.
Supply support for IRF8113TRPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949 and IECQ QC 080000.
The IRF8113TRPBF belongs to Infineon's HEXFET® Power MOSFET product line, designed specifically for high-efficiency, high-frequency DC-DC conversion in computing, networking, and industrial power systems where low gate charge and tightly specified RDS(on) are critical.
FAQ
What is the maximum continuous drain current for IRF8113TRPBF at 70°C ambient?
The maximum continuous drain current is 13.3 A at TA = 70°C with SO-8 mounted on a standard 1-inch² FR4 board with 2 oz copper. This rating assumes no forced airflow and accounts for RθJA = 50°C/W and TJ(max) = 150°C. Derating is required above 70°C ambient per the linear derating factor of 0.02 W/°C.
Does IRF8113TRPBF have an integrated body diode, and what are its key parameters?
Yes, it features an integral reverse p-n junction body diode rated for 3.1 A continuous source current and 135 A pulsed current. Key parameters include VSD ≤ 1.0 V at 13.3 A, reverse recovery time trr = 34–51 ns, and Qrr = 21–32 nC at TJ = 25°C and di/dt = 100 A/µs - all fully characterized and tested per datasheet conditions.
Can IRF8113TRPBF be used as a high-side switch with 5 V gate drive?
No - its gate threshold voltage VGS(th) ranges from 1.5 V to 2.2 V, but RDS(on) is only guaranteed at VGS ≥ 4.5 V. At 5 V, RDS(on) rises to ~6.8 mΩ (max), increasing conduction loss by >20%. For reliable high-side operation, use ≥10 V gate drive or select a logic-level MOSFET with RDS(on) specified at 4.5 V.
Is IRF8113TRPBF suitable for avalanche-rated applications like active clamping?
Yes - it is 100% tested for single-pulse avalanche energy (EAS = 48 mJ at TJ = 25°C) and avalanche current (IAR = 13.3 A). However, repetitive avalanche operation is not characterized or guaranteed; use only in circuits where energy per event remains within the single-pulse limit and junction temperature stays below 150°C.
IRF8113TRPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Last Time Buy
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 17.2A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 5.6mOhm @ 17.2A, 10V
- Vgs(th) (Max) @ Id:
- 2.2V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 36 nC @ 4.5 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2910 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2.5W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SO
IRF8113TRPBF FAQ
1.How can I place an order for IRF8113TRPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRF8113TRPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRF8113TRPBF reliable?
The price and inventory of IRF8113TRPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF8113TRPBF is usually 5 days.
3.What payment methods are accepted for IRF8113TRPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF8113TRPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRF8113TRPBF?
IRF8113TRPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRF8113TRPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRF8113TRPBF?
For technical support, including IRF8113TRPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF8113TRPBF requirements.
6.How does Aetrix verify that IRF8113TRPBF is sourced from the original manufacturer or authorized distributors?
All IRF8113TRPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF8113TRPBF meets industry standards.
7.What is the process for return or replacement of IRF8113TRPBF?
All IRF8113TRPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRF8113TRPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRF8113TRPBF part is unused and in its original packaging.
Return procedure for IRF8113TRPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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