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Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Vishay Siliconix IRF830SPBF

Name: IRF830SPBF
Brand: Vishay Siliconix
SKU: IRF830SPBF
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: IRF830SPBF

Manufacturer:: Vishay Siliconix

Category:: FETs, MOSFETs

Package:: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB

Datasheet:: IRF830SPBF.pdf

Description:: MOSFET N-CH 500V 4.5A D2PAK

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Product details

Overview

IRF830SPBF from Vishay Siliconix is a 500 V, 4.5 A N-channel enhancement-mode power MOSFET in D2PAK (TO-263) surface-mount package, featuring 1.5 Ω R_DS(on) at V_GS = 10 V, 38 nC total gate charge, and repetitive avalanche rating - designed for high-voltage switching in offline SMPS, AC-DC adapters, and motor control circuits.

For engineers reviewing the IRF830SPBF datasheet, IRF830SPBF pinout, IRF830SPBF application, or IRF830SPBF equivalent, this page delivers verified electrical specs, thermal derating data, diode recovery characteristics, and real-world design context for high-reliability 500 V power stage implementation.

Technical Context

This device belongs to Vishay's third-generation high-voltage power MOSFET family optimized for fast switching and ruggedness. Its D2PAK package enables 74 W continuous power dissipation at T_C = 25 °C and supports high-current PCB mounting with 0.025 W/°C linear derating.

The IRF830SPBF integrates a robust body diode with 320–640 ns reverse recovery time and 1.0–2.0 μC Q_rr, and features dynamic dV/dt immunity up to 3.5 V/ns - critical for snubberless operation in flyback and resonant converters.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	500 V - supports primary-side switching in universal-input 85–265 VAC offline converters without derating.
R_DS(on)	1.5 Ω @ V_GS = 10 V - enables low conduction loss in 4–5 A continuous current applications.
Q_g	38 nC - determines gate drive power requirement; compatible with standard 12 V PWM controllers.
I_D (T_C = 25 °C)	4.5 A - defines maximum continuous current under heatsink-cooled conditions.
E_AS	280 mJ - specifies unclamped inductive switching energy handling capability for robustness in transformer-coupled topologies.
dV/dt Rating	3.5 V/ns - ensures reliable operation during high-slew-rate voltage transients without spurious turn-on.
T_J Range	−55 to +150 °C - supports industrial and extended-temperature deployment in enclosed power supplies.

Pinout & Package

D2PAK (TO-263) surface-mount package with exposed drain pad for thermal and electrical connection; 3-pin configuration (G, D, S), lead (Pb)-free and halogen-free construction per JEDEC outline.

Pin/Terminal	Circuit Role	Design Meaning
G (Gate)	Control input	Receives 10 V logic-level signal to fully enhance channel; threshold voltage 2.0–4.0 V ensures compatibility with standard gate drivers.
D (Drain)	High-voltage output terminal	Connected to primary winding or bus rail; electrically tied to exposed thermal pad for low-inductance, high-current return path.
S (Source)	Reference node / current return	Serves as local ground reference for gate drive; internal source inductance (7.5 nH) impacts switching waveform fidelity and ringing.

Key Features

Feature	Design Value
Repetitive avalanche rated	Enables reliable operation under transient overloads (7.4 mJ E_AR) without external clamping in cost-sensitive designs.
Dynamic dV/dt rating	3.5 V/ns immunity prevents false triggering during fast voltage transitions in high-frequency SMPS.
Fast switching	Turn-on delay 8.2 ns, rise time 16 ns, turn-off delay 42 ns - reduces switching losses below 100 kHz operation.
Low R_DS(on) × Q_g figure of merit	57 Ω·nC - balances conduction and switching loss trade-offs for medium-power DC-DC and AC-DC stages.
Surface mount (D2PAK)	Supports automated assembly and high thermal performance via copper-clad PCB heatsinking (R_thJA = 40 °C/W on 1" FR-4).

Applications

Offline AC-DC Adapters	Flyback Converter Primary Switch
Use Scenario: 36 W universal-input adapter powering consumer electronics with no-fan cooling. IC Role / Device Role / Timing Role: Main high-side switch controlling energy transfer from AC line to secondary side via transformer. Use Value: 500 V rating eliminates need for voltage dividers or stacked devices; 280 mJ E_AS withstands startup surges without snubber.	Use Scenario: Isolated 12 V/3 A output supply in industrial PLC I/O module. IC Role / Device Role / Timing Role: Primary-side power switch operating at 65 kHz with discontinuous conduction mode (DCM). Use Value: 38 nC Q_g allows efficient drive from UC3844-based controller; 3.5 V/ns dV/dt rating suppresses false turn-on during reset spikes.
Motor Drive Half-Bridge	LED Driver Power Switch
Use Scenario: 24 V brushed DC motor control in HVAC damper actuator with PWM speed regulation. IC Role / Device Role / Timing Role: Low-side switching element in half-bridge topology driving inductive load. Use Value: Repetitive avalanche rating handles back-EMF spikes during PWM commutation; 4.5 A I_D supports peak currents up to 18 A (I_DM).	Use Scenario: Constant-current 48 V LED string driver for commercial lighting with passive PFC. IC Role / Device Role / Timing Role: High-voltage switch in buck-boost or SEPIC front-end stage. Use Value: 1.5 Ω R_DS(on) minimizes conduction loss at 350 mA average LED current; body diode t_rr < 640 ns ensures clean current reversal.

Offline AC-DC Adapters

Flyback Converter Primary Switch

Use Scenario: 36 W universal-input adapter powering consumer electronics with no-fan cooling.

IC Role / Device Role / Timing Role: Main high-side switch controlling energy transfer from AC line to secondary side via transformer.

Use Value: 500 V rating eliminates need for voltage dividers or stacked devices; 280 mJ E_AS withstands startup surges without snubber.

Use Scenario: Isolated 12 V/3 A output supply in industrial PLC I/O module.

IC Role / Device Role / Timing Role: Primary-side power switch operating at 65 kHz with discontinuous conduction mode (DCM).

Use Value: 38 nC Q_g allows efficient drive from UC3844-based controller; 3.5 V/ns dV/dt rating suppresses false turn-on during reset spikes.

Motor Drive Half-Bridge

LED Driver Power Switch

Use Scenario: 24 V brushed DC motor control in HVAC damper actuator with PWM speed regulation.

IC Role / Device Role / Timing Role: Low-side switching element in half-bridge topology driving inductive load.

Use Value: Repetitive avalanche rating handles back-EMF spikes during PWM commutation; 4.5 A I_D supports peak currents up to 18 A (I_DM).

Use Scenario: Constant-current 48 V LED string driver for commercial lighting with passive PFC.

IC Role / Device Role / Timing Role: High-voltage switch in buck-boost or SEPIC front-end stage.

Use Value: 1.5 Ω R_DS(on) minimizes conduction loss at 350 mA average LED current; body diode t_rr < 640 ns ensures clean current reversal.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
STP5NK50ZFP	500 V, 4.5 A, R_DS(on) = 1.4 Ω, Q_g = 29 nC, TO-220FP package	Through-hole mounting; lower gate charge reduces driver loss but lacks surface-mount thermal advantage	Prefer when board space allows through-hole layout and lower switching loss is prioritized over thermal density.
IXTP50N10P	100 V, 50 A, R_DS(on) = 0.022 Ω, TO-220 package - not voltage-compatible	Lower voltage rating makes it unsuitable for 500 V applications; only viable in low-voltage DC-DC where V_DS < 100 V	Not a functional substitute for IRF830SPBF in high-voltage roles; consider only if system redesign permits voltage reduction.

Compared with STP5NK50ZFP, IRF830SPBF offers superior thermal performance in compact layouts via D2PAK mounting, while IXTP50N10P fails basic voltage compliance - confirming IRF830SPBF's niche in surface-mount, 500 V, medium-current power switching where package efficiency and avalanche ruggedness are decisive.

Availability

IRF830SPBF is available at Aetrix Electronics and suitable for offline AC-DC adapters, flyback converter primary switches, and motor drive half-bridges requiring stable component supply across production lifecycles.

Supply support for IRF830SPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-reliability power MOSFETs, diodes, and optoelectronics for industrial, automotive, and computing markets.

The IRF830SPBF belongs to Vishay's third-generation high-voltage power MOSFET product line, engineered for rugged switching in cost-sensitive, high-volume offline power conversion systems demanding avalanche tolerance and surface-mount thermal efficiency.

FAQ

What is the maximum continuous drain current for IRF830SPBF at 100 °C case temperature?

The IRF830SPBF supports 2.9 A continuous drain current at T_C = 100 °C, per its absolute maximum ratings table. This derated value reflects thermal limitations of the D2PAK package under sustained high-temperature operation and must be validated against actual PCB layout and heatsinking. The full 4.5 A rating applies only at T_C = 25 °C.

Does IRF830SPBF have a built-in body diode, and what are its key parameters?

Yes, IRF830SPBF integrates a monolithic body diode with typical forward voltage of 1.6 V at I_S = 4.5 A and T_J = 25 °C. Its reverse recovery time ranges from 320 to 640 ns, and Q_rr is 1.0–2.0 μC - critical parameters for minimizing switching loss and voltage overshoot in hard-switched topologies.

Is IRF830SPBF RoHS-compliant, and what does the 'PbF' suffix indicate?

Yes, IRF830SPBF is lead (Pb)-free and halogen-free, compliant with RoHS Directive 2011/65/EU. The 'PbF' suffix explicitly denotes lead-free termination, confirmed in Vishay's ordering information table and material categorization documentation (www.vishay.com/doc?99912).

What is the thermal resistance from junction to case (R_thJC) for IRF830SPBF?

The maximum junction-to-case (drain) thermal resistance for IRF830SPBF is 1.7 °C/W, enabling efficient heat transfer from the silicon die to the PCB copper pour or heatsink via the exposed D2PAK drain pad - a key enabler of its 74 W power dissipation rating at T_C = 25 °C.

Can IRF830SPBF replace IRF830 in existing through-hole designs?

No - IRF830SPBF uses the surface-mount D2PAK (TO-263) package, whereas legacy IRF830 is in TO-220. Direct replacement requires PCB redesign for footprint, thermal pad layout, and solder profile. For drop-in alternatives, consider IRF830L (I2PAK/TO-262) - same pinout as TO-220 but surface-mount - though IRF830SPBF is not mechanically interchangeable.

IRF830SPBF Specifications

Product attributes: Attribute value

Manufacturer:: Vishay Siliconix

Series:: -

Package/Case:: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB

Packaging:: Tube

Product Status:: Active

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 500 V

Current - Continuous Drain (Id) @ 25°C:: 4.5A (Tc)

Drive Voltage (Max Rds On, Min Rds On):: 10V

Rds On (Max) @ Id, Vgs:: 1.5Ohm @ 2.7A, 10V

Vgs(th) (Max) @ Id:: 4V @ 250µA

Gate Charge (Qg) (Max) @ Vgs:: 38 nC @ 10 V

Vgs (Max):: ±20V

Input Capacitance (Ciss) (Max) @ Vds:: 610 pF @ 25 V

FET Feature:: -

Power Dissipation (Max):: 3.1W (Ta), 74W (Tc)

Operating Temperature:: -55°C ~ 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: TO-263 (D2PAK)

IRF830SPBF FAQ

1.How can I place an order for IRF830SPBF through Aetrix?

Please submit a Request for Quotation (RFQ) for IRF830SPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRF830SPBF reliable?

The price and inventory of IRF830SPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF830SPBF is usually 5 days.

3.What payment methods are accepted for IRF830SPBF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF830SPBF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRF830SPBF?

IRF830SPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRF830SPBF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRF830SPBF?

For technical support, including IRF830SPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF830SPBF requirements.

6.How does Aetrix verify that IRF830SPBF is sourced from the original manufacturer or authorized distributors?

All IRF830SPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF830SPBF meets industry standards.

7.What is the process for return or replacement of IRF830SPBF?

All IRF830SPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRF830SPBF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRF830SPBF part is unused and in its original packaging.

Return procedure for IRF830SPBF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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