Vishay Siliconix IRF9Z10PBF
- Part No.:
- IRF9Z10PBF
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3
- Datasheet:
-
IRF9Z10PBF.pdf
- Description:
- MOSFET P-CH 60V 6.7A TO220AB
- Quantity:
- Payment:

- Shipping:

Inventory:364
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IRF9Z10PBF from Vishay Siliconix is a P-channel enhancement-mode power MOSFET in TO-220AB package, rated for -60 V VDS, 0.50 Ω RDS(on) at VGS = -10 V, and -6.7 A continuous drain current at TC = 25 °C. It delivers fast switching, repetitive avalanche capability, and 175 °C junction operation-used in DC-DC converters, motor control H-bridges, and high-side load switches.
For engineers reviewing the IRF9Z10PBF datasheet, IRF9Z10PBF pinout, IRF9Z10PBF application, or IRF9Z10PBF equivalent, key selection criteria include verified -60 V blocking, confirmed 0.50 Ω on-resistance at -10 V gate drive, documented 140 mJ single-pulse avalanche energy, and TO-220AB thermal performance with RthJC = 3.5 °C/W.
Technical Context
This device operates as a high-side switch in buck regulators and polarity-reversal circuits, leveraging its P-channel topology to eliminate bootstrap complexity. Its -4.5 V/ns peak diode recovery dV/dt rating and -5.5 V body diode forward voltage (at -6.7 A) support robust synchronous rectification and inductive load commutation.
The MOSFET features third-generation silicon design with optimized gate charge profile: Qg = 12 nC, Qgd = 5.1 nC, and Qgs = 3.8 nC-enabling predictable turn-on/turn-off timing (td(on) = 11 ns, tf = 31 ns) under standard 24 Ω gate drive conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | -60 V - Maximum reverse drain-source blocking voltage; defines safe operating range in high-side switch applications. |
| RDS(on) | 0.50 Ω @ VGS = -10 V - On-resistance directly determines conduction loss and thermal rise at 6.7 A load current. |
| Qg | 12 nC - Total gate charge sets minimum driver current requirement and switching transition time. |
| ID (cont.) | -6.7 A @ TC = 25 °C - Continuous current rating at heatsink temperature; derates linearly to -4.7 A at 100 °C case. |
| EAS | 140 mJ - Single-pulse avalanche energy rating; enables reliable unclamped inductive switching without external snubbers. |
| TJ max | +175 °C - Maximum junction temperature; supports operation in sealed enclosures or high-ambient industrial environments. |
| RthJC | 3.5 °C/W - Junction-to-case thermal resistance; determines heatsink sizing when mounted with greased flat interface. |
Pinout & Package
IRF9Z10PBF uses the industry-standard TO-220AB package with vertical lead orientation and isolated tab (drain-connected). The package provides low thermal resistance (RthJC = 3.5 °C/W), mechanical robustness, and compatibility with standard mounting hardware (6-32 or M3 screw, 10 lbf·in torque).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (Tab) | Main current-carrying terminal, electrically connected to metal tab | Must be electrically isolated from heatsink unless circuit design requires common-drain configuration; primary thermal path to heatsink. |
| Gate | Control electrode for channel formation | High-impedance input requiring < ±100 nA leakage; sensitive to ESD; driven with negative voltage relative to source for turn-on. |
| Source | Reference node for gate drive and current return path | Serves as circuit ground reference in high-side configurations; carries full load current and body diode reverse recovery current. |
Key Features
| Feature | Design Value |
|---|---|
| Repetitive avalanche rated | Rated for repeated -6.7 A IAR and 4.3 mJ EAR pulses-enables reliable operation in flyback, boost, and motor freewheeling without external protection. |
| Dynamic dV/dt rating | -4.5 V/ns peak diode recovery dV/dt-prevents spurious turn-on during fast voltage transients across inductive loads. |
| Fast switching | 11 ns turn-on delay and 31 ns fall time with 24 Ω gate resistor-reduces switching losses in 100–500 kHz SMPS designs. |
| Low RDS(on) × Qg figure of merit | 0.50 Ω × 12 nC = 6.0 Ω·nC-balances conduction and switching loss for medium-power P-channel applications. |
| 175 °C operating temperature | Enables use in automotive under-hood, industrial motor drives, and sealed power supplies where ambient exceeds 105 °C. |
Applications
| DC-DC Buck Converter High-Side Switch | H-Bridge Motor Control |
|---|---|
|
Use Scenario: High-side switch in non-synchronous buck regulator supplying 5 V/3 A to FPGA core logic. IC Role / Device Role / Timing Role: P-channel MOSFET providing controlled high-side conduction; replaces N-channel + bootstrap circuitry. Use Value: Eliminates bootstrap capacitor and high-side driver IC, reducing BOM count and layout area while maintaining -60 V input tolerance. |
Use Scenario: Upper-leg switch in brushed DC motor H-bridge driving 24 V/2 A bidirectional loads. IC Role / Device Role / Timing Role: High-side P-channel switch enabling direction reversal without level-shifting gate drivers. Use Value: Simplifies gate drive architecture and improves shoot-through immunity due to inherent slower turn-on vs. N-channel counterparts. |
| Reverse Polarity Protection | Hot-Swap Load Switch |
|
Use Scenario: Input protection circuit preventing damage from accidental battery reversal in 12 V portable equipment. IC Role / Device Role / Timing Role: P-channel MOSFET placed in series with positive supply rail; conducts only when VIN polarity is correct. Use Value: Achieves < 0.5 V forward drop at 6 A (vs. >1 V for Schottky diode), minimizing power loss and heat generation. |
Use Scenario: Controlled power-up sequencing for backplane modules in telecom shelf systems. IC Role / Device Role / Timing Role: High-side load switch managing inrush current via gate slew-rate control. Use Value: Leverages low Qg (12 nC) and predictable threshold (-2.0 to -4.0 V) to implement soft-start with RC gate network. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRF9530NPbF | VDS = -100 V, RDS(on) = 0.30 Ω @ -10 V, Qg = 80 nC - higher voltage rating but significantly higher gate charge. | Better suited for 48 V industrial bus protection; less optimal for 24 V/100 kHz SMPS due to slower switching. | Select when higher blocking voltage is required and gate drive strength permits 80 nC charge handling. |
| DMG2305UVT-7 | VDS = -20 V, RDS(on) = 0.045 Ω @ -4.5 V, SOT-23 package - lower voltage, much lower RDS(on), but limited to ≤ 4.2 A. | Targeted at low-voltage logic-level load switching (e.g., USB power delivery); not suitable for 24–60 V systems. | Choose for space-constrained, low-VDS, high-current digital load switching-not for IRF9Z10PBF's voltage or power class. |
Compared with IRF9530NPbF and DMG2305UVT-7, the IRF9Z10PBF occupies a mid-voltage, medium-power niche: it offers superior switching speed over the IRF9530NPbF and higher voltage capability than the DMG2305UVT-7, making it optimal for 24–48 V industrial DC-DC and motor control where thermal management and gate drive simplicity are prioritized.
Availability
IRF9Z10PBF is available at Aetrix Electronics and suitable for DC-DC converters, motor control circuits, and reverse polarity protection systems requiring stable component supply, RoHS-compliant packaging, and long-term industrial availability.
Supply support for IRF9Z10PBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in power MOSFETs, diodes, and optoelectronics with emphasis on ruggedness, reliability, and thermal performance.
The IRF9Z10PBF belongs to Vishay's third-generation power MOSFET family, engineered for commercial and industrial power conversion where fast switching, avalanche robustness, and ease of paralleling are critical.
FAQ
What is the maximum continuous drain current for IRF9Z10PBF at 100 °C case temperature?
The IRF9Z10PBF supports -4.7 A continuous drain current at TC = 100 °C, per its absolute maximum ratings table. This derating reflects thermal limits of the TO-220AB package and ensures junction temperature remains within the +175 °C maximum under sustained load. Designers must verify heatsink performance to maintain this case temperature under actual operating conditions. The IRF9Z10PBF datasheet specifies linear derating beyond 25 °C at 0.29 W/°C.
Is IRF9Z10PBF suitable for avalanche operation in unclamped inductive switching?
Yes, the IRF9Z10PBF is explicitly rated for repetitive avalanche operation with IAR = -6.7 A and EAR = 4.3 mJ, and single-pulse avalanche energy of 140 mJ. These values are measured under defined test conditions (VDD = -25 V, L = 6.23 mH, Rg = 25 Ω). The IRF9Z10PBF's ruggedized silicon design allows reliable energy absorption without external snubbers in flyback or relay-driving applications.
What is the gate-source threshold voltage range for IRF9Z10PBF?
The IRF9Z10PBF has a gate-source threshold voltage (VGS(th)) range of -2.0 V to -4.0 V, specified at VDS = VGS and ID = -250 μA. This means the device begins conducting significantly around -2.0 V and is fully enhanced near -4.0 V. For robust turn-on, a gate drive of -10 V is recommended to achieve the rated 0.50 Ω RDS(on). The IRF9Z10PBF is not a logic-level part and requires dedicated negative gate bias in most applications.
Does IRF9Z10PBF have a built-in body diode, and what are its key parameters?
Yes, the IRF9Z10PBF integrates a parasitic body diode inherent to its vertical P-channel MOSFET structure. Key diode parameters include: continuous forward current IS = -6.7 A, pulsed current ISM = -27 A, forward voltage VSD = -5.5 V at -6.7 A and 25 °C, and reverse recovery time trr = 80–160 ns. These values confirm suitability for freewheeling and synchronous rectification roles where moderate-speed recovery is acceptable. The IRF9Z10PBF body diode is not optimized for ultrafast recovery but is fully characterized for standard inductive load handling.
What is the thermal resistance from junction to case (RthJC) for IRF9Z10PBF?
The IRF9Z10PBF has a maximum junction-to-case thermal resistance (RthJC) of 3.5 °C/W, measured from die junction to the TO-220AB drain tab surface. This value assumes proper mounting with a flat, greased heatsink interface. It enables accurate junction temperature estimation using TJ = TC + (PD × RthJC). At 43 W maximum power dissipation, this yields ~150 °C temperature rise above case-well within the +175 °C limit. The IRF9Z10PBF's low RthJC supports compact thermal design in space-constrained industrial modules.
IRF9Z10PBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- -
- Package/Case:
- TO-220-3
- Packaging:
- Tube
- Product Status:
- Active
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 60 V
- Current - Continuous Drain (Id) @ 25°C:
- 6.7A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 500mOhm @ 4A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 12 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 270 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 43W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220AB
IRF9Z10PBF FAQ
1.How can I place an order for IRF9Z10PBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRF9Z10PBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRF9Z10PBF reliable?
The price and inventory of IRF9Z10PBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF9Z10PBF is usually 5 days.
3.What payment methods are accepted for IRF9Z10PBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF9Z10PBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRF9Z10PBF?
IRF9Z10PBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRF9Z10PBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRF9Z10PBF?
For technical support, including IRF9Z10PBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF9Z10PBF requirements.
6.How does Aetrix verify that IRF9Z10PBF is sourced from the original manufacturer or authorized distributors?
All IRF9Z10PBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF9Z10PBF meets industry standards.
7.What is the process for return or replacement of IRF9Z10PBF?
All IRF9Z10PBF units undergo pre-shipment inspection (PSI). If there is an issue with IRF9Z10PBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRF9Z10PBF part is unused and in its original packaging.
Return procedure for IRF9Z10PBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IRF9Z10PBF Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Comparator circuit design covering voltage thresholds, input limits, open-collector outputs, LM393 wiring, op-amp differences, hysteresis, timing, window detection and practical fault diagnosis.
Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
