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Vishay Siliconix IRFB16N50K

Part No.:
IRFB16N50K
Manufacturer:
Vishay Siliconix
Category:
FETs, MOSFETs
Package:
TO-220-3
Datasheet:
AetrixIRFB16N50K.pdf
Description:
MOSFET N-CH 500V 17A TO220AB
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,211

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Product details

Overview

IRFB16N50K from Vishay Siliconix is a 500 V, 17 A N-channel power MOSFET in TO-220 package, featuring 0.285 Ω RDS(on) at VGS = 10 V, 89 nC total gate charge, and 310 mJ single-pulse avalanche energy - designed for hard-switched SMPS and UPS output stages.

For engineers reviewing the IRFB16N50K datasheet, IRFB16N50K pinout, IRFB16N50K application, or IRFB16N50K equivalent, key selection criteria include its 500 V blocking rating, 280 W power dissipation at TC = 25 °C, 11 V/ns peak diode recovery dV/dt capability, and RoHS-compliant Pb-free variant IRFB16N50KPbF.

Technical Context

This MOSFET employs planar stripe silicon technology optimized for high-voltage switching with enhanced dynamic ruggedness. Its gate charge profile (Qg = 89 nC max, Qgd = 43 nC) supports efficient 100–500 kHz operation in flyback and forward converters while maintaining low conduction loss via 0.285 Ω RDS(on).

The device integrates a fully characterized body diode with trr = 490–730 ns and Qrr = 5710–8560 nC, enabling reliable unclamped inductive switching up to IAS = 17 A. Thermal resistance RthJC = 0.44 °C/W ensures effective heat transfer to heatsinks in high-power density designs.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 500 V - supports 400 V DC bus designs with 25 % safety margin for voltage transients
RDS(on) 0.285 Ω @ VGS = 10 V - enables ≤4.9 W conduction loss at 13 A continuous drain current
Qg 89 nC max - determines gate driver power requirement and switching speed in hard-switched topologies
EAS 310 mJ - specifies maximum single-pulse inductive energy the device can absorb without failure
ID (TC = 100 °C) 11 A - defines usable continuous current in thermally constrained enclosures with case temperature ≤100 °C
dV/dt (diode) 11 V/ns - quantifies robustness against parasitic turn-on during high-speed commutation of inductive loads
TJ Range –55 to +150 °C - allows operation in industrial and telecom power systems with wide ambient extremes

Pinout & Package

IRFB16N50K uses a standard TO-220AB package with isolated tab (drain-connected), 3-pin through-hole mounting, and 1.1 N·m screw torque rating. The case-to-sink thermal resistance is 0.50 °C/W with greased flat interface.

Pin/Terminal Circuit Role Design Meaning
G (Gate) Control electrode Receives 10 V logic-level drive; requires ≥27 nC Qgs to reach threshold and 43 nC Qgd to cross Miller plateau
D (Drain) High-side power terminal Connected to TO-220 tab; electrically isolated from mounting surface but thermally coupled - must be insulated if mounted to grounded heatsink
S (Source) Reference node / return path Serves as common reference for gate drive and current sensing; body diode anode is internally tied to source

Key Features

Feature Design Value
Low Qg/RDS(on) ratio 312 nC/Ω - reduces gate drive complexity and improves efficiency in 100–300 kHz SMPS designs
Fully characterized avalanche performance 310 mJ EAS, 17 A IAR - enables elimination of external snubbers in clamp or RCD circuits
Enhanced dV/dt ruggedness 11 V/ns rated diode recovery dV/dt - prevents false triggering during fast voltage transitions in bridge-leg configurations
Thermally optimized package RthJC = 0.44 °C/W - supports 280 W power dissipation with minimal junction-to-case temperature rise
RoHS-compliant Pb-free option IRFB16N50KPbF - meets EU Directive 2011/65/EU without exemption for leaded terminations

Applications

Server PSU Primary Switch Industrial UPS Inverter Stage

Use Scenario: High-efficiency 3.3 kW server power supply operating at 200 kHz with active clamp forward topology.

IC Role / Device Role / Timing Role: Main switching transistor handling 400 V DC input, conducting 17 A peak current per pulse, and sustaining repetitive 500 V blocking.

Use Value: Low RDS(on) minimizes conduction loss; high EAS withstands leakage inductance spikes during clamp reset.

Use Scenario: 10 kVA online UPS inverter module delivering clean 230 V AC output under battery backup mode.

IC Role / Device Role / Timing Role: Half-bridge switch in IGBT-driven H-bridge, switching at 8–16 kHz with synchronous rectification control.

Use Value: Robust body diode (trr = 490–730 ns) supports bidirectional current flow during dead-time; 11 V/ns dV/dt rating prevents shoot-through.

Telecom Rectifier Module EV Charger Front-End PFC

Use Scenario: -48 V telecom rectifier with boost PFC stage operating at 125 kHz and 3 kW output.

IC Role / Device Role / Timing Role: Boost switch subjected to 400 V DC link, 17 A peak inductor current, and high-frequency switching stress.

Use Value: Low Coss (240 pF typ) and Crss (26 pF) reduce switching loss; Qg = 89 nC enables use of cost-effective gate drivers.

Use Scenario: 11 kW on-board EV charger using interleaved totem-pole PFC with 65 kHz switching frequency.

IC Role / Device Role / Timing Role: High-side switch in bidirectional totem-pole configuration, requiring fast, low-loss switching and reverse conduction capability.

Use Value: Fully characterized Qrr (5710–8560 nC) and VSD (≤1.5 V) ensure predictable body diode behavior during zero-voltage switching transitions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage power switching applications.

Alternative Part Technical Difference Application Difference Selection Advice
STP16NF50 RDS(on) = 0.30 Ω (higher), Qg = 75 nC (lower), TO-220 package, same 500 V rating Lower gate charge eases drive but higher RDS(on) increases conduction loss above 10 A Prefer STP16NF50 when gate drive strength is limited and average load current stays below 12 A
IXTH16N50L RDS(on) = 0.27 Ω (slightly lower), Qg = 95 nC (higher), TO-247 package, 150 °C TJ max Larger TO-247 offers better thermal performance but requires PCB layout change Choose IXTH16N50L only when thermal headroom is critical and board space allows TO-247 footprint

Compared with STP16NF50 and IXTH16N50L, the IRFB16N50K delivers optimal balance of conduction loss, switching loss, and thermal resistance in TO-220 form factor - making it preferred for space-constrained 1–5 kW industrial power supplies where both efficiency and layout compatibility matter.

Availability

IRFB16N50K is available at Aetrix Electronics and suitable for switch mode power supplies, uninterruptible power systems, and high-frequency hard-switched circuits requiring stable component supply across production lifecycles.

Supply support for IRFB16N50K includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-reliability MOSFETs, diodes, and optoelectronics for power, signal, and sensing applications.

The IRFB16N50K belongs to Vishay's high-voltage Power MOSFET family engineered for rugged, high-efficiency switching in industrial and telecom power conversion - emphasizing avalanche robustness, low gate charge, and thermal stability.

FAQ

What is the maximum continuous drain current for IRFB16N50K at 100 °C case temperature?

The IRFB16N50K supports 11 A continuous drain current at TC = 100 °C, as specified in the Absolute Maximum Ratings table. This derating reflects thermal limits of the TO-220 package and ensures safe operation within the 150 °C maximum junction temperature. The IRFB16N50K must be mounted on an adequately sized heatsink to maintain case temperature at or below this threshold during sustained load conditions.

Does IRFB16N50K have a fully rated body diode for synchronous rectification?

Yes, the IRFB16N50K features a fully characterized intrinsic body diode with documented parameters: VSD ≤ 1.5 V at IS = 17 A and TJ = 25 °C, trr = 490–730 ns, and Qrr = 5710–8560 nC. These values are measured under controlled conditions and enable predictable performance in quasi-resonant or synchronous rectifier applications where the body diode conducts during dead time.

Is IRFB16N50K pin-compatible with IRFP150 or other legacy 500 V MOSFETs in TO-220?

No, IRFB16N50K is not pin-compatible with IRFP150. While both use TO-220 packages, the IRFB16N50K has different gate charge characteristics (Qg = 89 nC vs. IRFP150's 120 nC), RDS(on) (0.285 Ω vs. 0.055 Ω), and voltage rating (500 V vs. 100 V). Substitution would require full circuit revalidation due to mismatched switching behavior and conduction loss profiles.

What is the recommended gate resistor value for IRFB16N50K in a 200 kHz flyback converter?

For a 200 kHz flyback converter, a gate resistor of 8.8 Ω is validated in the IRFB16N50K datasheet (Fig. 10a/b), yielding td(on) = 20 ns and tr = 77 ns. This value balances switching speed against ringing and EMI. Lower values (e.g., 4.7 Ω) may increase dV/dt stress; higher values (e.g., 22 Ω) reduce EMI but raise switching losses - actual selection must consider driver capability and layout parasitics.

Can IRFB16N50K be used in avalanche mode for clamping without external components?

Yes, the IRFB16N50K is fully characterized for repetitive avalanche operation: IAR = 17 A and EAR = 28 mJ per pulse. Its 310 mJ single-pulse avalanche energy (EAS) allows safe clamping of inductive spikes in RCD or active clamp circuits. However, thermal management remains critical - avalanche duty cycle must stay below 2 % and junction temperature must not exceed 150 °C during operation.

IRFB16N50K Specifications

Product attributes
Attribute value
Manufacturer:
Vishay Siliconix
Series:
-
Package/Case:
TO-220-3
Packaging:
Tube
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
500 V
Current - Continuous Drain (Id) @ 25°C:
17A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
350mOhm @ 10A, 10V
Vgs(th) (Max) @ Id:
5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
89 nC @ 10 V
Vgs (Max):
±30V
Input Capacitance (Ciss) (Max) @ Vds:
2210 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
280W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TO-220AB

IRFB16N50K FAQ

1.How can I place an order for IRFB16N50K through Aetrix?

Please submit a Request for Quotation (RFQ) for IRFB16N50K on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRFB16N50K reliable?

The price and inventory of IRFB16N50K are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFB16N50K is usually 5 days.

3.What payment methods are accepted for IRFB16N50K?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRFB16N50K transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRFB16N50K?

IRFB16N50K orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRFB16N50K order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRFB16N50K?

For technical support, including IRFB16N50K datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRFB16N50K requirements.

6.How does Aetrix verify that IRFB16N50K is sourced from the original manufacturer or authorized distributors?

All IRFB16N50K products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFB16N50K meets industry standards.

7.What is the process for return or replacement of IRFB16N50K?

All IRFB16N50K units undergo pre-shipment inspection (PSI). If there is an issue with IRFB16N50K, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRFB16N50K part is unused and in its original packaging.

Return procedure for IRFB16N50K:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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