Infineon Technologies IRFH8325TRPBF
- Part No.:
- IRFH8325TRPBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerTDFN
- Datasheet:
-
IRFH8325TRPBF.pdf
- Description:
- MOSFET N-CH 30V 21A/82A PQFN
- Quantity:
- Payment:

- Shipping:

Inventory:3,667
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Product details
Overview
IRFH8325TRPBF from Infineon Technologies is a 30 V, 25 A N-channel enhancement-mode HEXFET Power MOSFET in PQFN 5×6 mm package, optimized as a synchronous rectifier in high-frequency buck converters. It delivers RDS(on) = 4.1 mΩ (typ) at VGS = 10 V and 5.0 mΩ (max) at VGS = 10 V, with low Qg = 15 nC (typ) and thermal resistance RθJC(bottom) = 2.3 °C/W for efficient PCB heat transfer.
For engineers reviewing the IRFH8325TRPBF datasheet, IRFH8325TRPBF pinout, IRFH8325TRPBF application, or IRFH8325TRPBF equivalent, key selection criteria include its low-profile PQFN package, gate threshold voltage of 1.8 V (typ), body diode reverse recovery charge Qrr = 25–38 nC, and suitability for 500 kHz+ switching in server VRMs and POL converters.
Technical Context
This MOSFET employs trench-gate silicon technology to achieve high current density and fast switching with minimal gate drive energy. Its low RDS(on) and 15 nC total gate charge enable reduced conduction and switching losses in synchronous rectification topologies.
The device integrates a robust intrinsic body diode with trr = 16–24 ns and Qrr = 25–38 nC, supporting zero-voltage switching (ZVS) transitions in high-efficiency DC-DC stages. Thermal design leverages bottom-side copper pad contact for direct PCB thermal coupling, not top-side heatsinking.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - Maximum drain-source blocking voltage for 12 V input rail applications with margin |
| RDS(on) @ VGS = 10 V | 4.1 mΩ (typ), 5.0 mΩ (max) - Enables ≤1.25 W conduction loss at 25 A continuous current |
| Qg | 15 nC (typ) - Reduces gate driver power and enables <500 ns turn-on with 1.8 Ω gate resistor |
| RθJC(bottom) | 2.3 °C/W - Allows >25 W power dissipation with 55 °C temperature rise to PCB under forced air |
| VGS(th) | 1.35–2.35 V - Ensures reliable turn-on with standard 3.3 V or 5 V logic-level gate drivers |
| Qrr | 25–38 nC - Limits reverse recovery loss during hard-switched synchronous rectification |
| ID @ TC(bottom) = 25°C | 25 A - Continuous current rating defined at case (PCB pad) temperature, not ambient |
Pinout & Package
PQFN 5×6 mm Outline "E" package with exposed bottom thermal pad and industry-standard 3-pin layout (Drain, Source, Gate). Pin 1 identifier marked on top surface; no top-side thermal interface required.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D (Drain) | Main current path output terminal | Internally connected to bottom thermal pad; must be soldered to large PCB copper area for thermal management |
| S (Source) | Reference node for gate drive and current sensing | Connected to source bonding wires; serves as return path for load current and gate driver loop |
| G (Gate) | Control input for channel modulation | High-impedance input requiring <15 nC charge; sensitive to ESD; routed away from noisy power traces |
Key Features
| Feature | Design Value |
|---|---|
| Low RθJC(bottom) | 2.3 °C/W - Enables direct PCB thermal coupling without heatsink, reducing system height and cost |
| Low-profile package | 1.2 mm max height - Supports ultra-thin VRM designs in space-constrained server and telecom modules |
| Industry-standard pinout | 3-pin D-S-G arrangement - Ensures board-level compatibility with alternative 30 V PQFN MOSFETs |
| RoHS & halogen-free | No lead, bromide, or halogen - Meets IPC-J-STD-609A Class 1 and JEDEC MSL1 consumer reliability requirements |
Applications
| Server Voltage Regulator Modules | Telecom Point-of-Load Converters |
|---|---|
Use Scenario: High-current, high-frequency (≥500 kHz) buck converter supplying CPU/GPU core voltage in 1U rack servers. IC Role / Device Role / Timing Role: Synchronous rectifier replacing Schottky diode to reduce conduction loss and improve efficiency above 12 A. Use Value: Achieves >92% efficiency at 25 A/1.0 V output due to 4.1 mΩ RDS(on) and low Qg-driven switching loss. | Use Scenario: Compact 48 V-to-12 V intermediate bus converter in 5G base station power shelves. IC Role / Device Role / Timing Role: Low-side switch in interleaved buck stage operating at 300–700 kHz with tight thermal constraints. Use Value: Enables 1.2 mm board thickness via PQFN package while maintaining 25 A continuous current capability at 70°C case temperature. |
| Industrial Motor Drive Gate Drivers | Automotive ADAS Power Supplies |
Use Scenario: Half-bridge high-side switch driver stage powering BLDC motor control ICs in factory automation PLCs. IC Role / Device Role / Timing Role: High-speed switching element in isolated gate driver output stage, handling 20 A pulsed loads. Use Value: Fast tr = 16 ns and tf = 7.1 ns support clean edge fidelity for precise PWM timing in closed-loop motor control. | Use Scenario: 12 V input, 3.3 V/5 V dual-output power supply for radar sensor ECUs in automotive ADAS systems. IC Role / Device Role / Timing Role: Primary synchronous rectifier in compact, thermally isolated buck regulator meeting AEC-Q101 stress requirements. Use Value: MSL1 qualification and -55°C to +150°C TJ range ensure reliability across vehicle cabin temperature extremes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SiR872DP-T1-GE3 | RDS(on) = 4.0 mΩ (min), Qg = 16.5 nC, same PQFN 5×6 package | Slightly higher gate charge increases driver loss; identical thermal footprint | Preferred when tighter RDS(on) tolerance is required over gate drive simplicity |
| DMTH3005LPS-13 | RDS(on) = 4.8 mΩ (max), Qg = 13.5 nC, same outline but different pin marking | Lower Qg eases gate drive design; slightly higher conduction loss at full load | Optimal for designs prioritizing switching loss reduction over peak current capability |
Compared with IRFH8325TRPBF, SiR872DP-T1-GE3 offers marginally lower RDS(on) but requires more gate drive energy, while DMTH3005LPS-13 trades 0.7 mΩ higher on-resistance for 1.5 nC lower Qg, favoring high-frequency operation with light-to-moderate loads.
Availability
IRFH8325TRPBF is available at Aetrix Electronics and suitable for server VRMs, telecom POL converters, industrial motor drive gate drivers, and automotive ADAS power supplies requiring stable component supply and long-term production continuity.
Supply support for IRFH8325TRPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with leadership in silicon and wide-bandgap power devices.
This part belongs to Infineon's OptiMOS™ 50 V/30 V low-voltage power MOSFET product line, engineered specifically for high-efficiency, high-density DC-DC conversion in computing and communications infrastructure.
FAQ
What is the maximum continuous drain current for IRFH8325TRPBF at 100°C case temperature?
At TC(bottom) = 100°C, the continuous drain current is 17 A per the Absolute Maximum Ratings table. This derating reflects thermal limits of the PQFN package's bottom-side thermal path and ensures junction temperature remains within the -55°C to +150°C operating range under sustained load.
Does IRFH8325TRPBF require a gate resistor for stability in synchronous buck applications?
Yes - a gate resistor (typically 1.0–2.2 Ω) is recommended to dampen ringing caused by parasitic inductance in the gate loop. The device's 1.1 Ω typical gate resistance and 15 nC Qg make it susceptible to oscillation without controlled turn-on/turn-off slew rates, especially at >300 kHz switching frequencies.
Can IRFH8325TRPBF be used in avalanche-rated circuits?
No - IRFH8325TRPBF is not characterized or guaranteed for repetitive avalanche operation. While single-pulse avalanche energy EAS is specified at 300 mJ (at IAS = 20 A), the datasheet does not define safe operating area (SOA) for repetitive unclamped inductive switching, and use in such conditions voids warranty.
Is the PQFN 5×6 mm package of IRFH8325TRPBF compatible with standard reflow profiles?
Yes - the device is qualified to JEDEC J-STD-020D MSL1 level and supports standard lead-free reflow profiles with peak temperatures up to 260°C. Its halogen-free, RoHS-compliant construction and robust copper clip interconnect ensure reliability through multiple thermal cycles without delamination or bond wire fatigue.
IRFH8325TRPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- 8-PowerTDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 21A (Ta), 82A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 5mOhm @ 20A, 10V
- Vgs(th) (Max) @ Id:
- 2.35V @ 50µA
- Gate Charge (Qg) (Max) @ Vgs:
- 32 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2487 pF @ 10 V
- FET Feature:
- -
- Power Dissipation (Max):
- 3.6W (Ta), 54W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PQFN (5x6)
IRFH8325TRPBF FAQ
1.How can I place an order for IRFH8325TRPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRFH8325TRPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRFH8325TRPBF reliable?
The price and inventory of IRFH8325TRPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFH8325TRPBF is usually 5 days.
3.What payment methods are accepted for IRFH8325TRPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRFH8325TRPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRFH8325TRPBF?
IRFH8325TRPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRFH8325TRPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRFH8325TRPBF?
For technical support, including IRFH8325TRPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRFH8325TRPBF requirements.
6.How does Aetrix verify that IRFH8325TRPBF is sourced from the original manufacturer or authorized distributors?
All IRFH8325TRPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFH8325TRPBF meets industry standards.
7.What is the process for return or replacement of IRFH8325TRPBF?
All IRFH8325TRPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRFH8325TRPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRFH8325TRPBF part is unused and in its original packaging.
Return procedure for IRFH8325TRPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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