Vishay Siliconix IRFIZ34GPBF
- Part No.:
- IRFIZ34GPBF
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3 Full Pack, Isolated Tab
- Datasheet:
-
IRFIZ34GPBF.pdf
- Description:
- MOSFET N-CH 60V 20A TO220-3
- Quantity:
- Payment:

- Shipping:

Inventory:1,652
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IRFIZ34GPBF from Vishay Siliconix is a 60 V, 20 A N-channel power MOSFET in TO-220 FULLPAK package, featuring 2.5 kVRMS isolation, 0.050 Ω RDS(on) at VGS = 10 V, and 175 °C maximum junction temperature. It serves as a high-reliability switching element in DC-DC converters, motor drives, and industrial power supplies where galvanic isolation and thermal robustness are critical.
For engineers reviewing the IRFIZ34GPBF datasheet, IRFIZ34GPBF pinout, IRFIZ34GPBF application, or IRFIZ34GPBF equivalent, key selection criteria include its isolated TO-220 FULLPAK construction, 3.6 °C/W junction-to-case thermal resistance, avalanche energy rating of 300 mJ, and compatibility with standard heatsink mounting via single screw or clip-enabling simplified thermal design in space-constrained industrial systems.
Technical Context
This device belongs to Vishay's third-generation high-voltage power MOSFET family optimized for fast switching and ruggedized operation. Its isolated TO-220 FULLPAK package integrates a high-dielectric molding compound that replaces external insulation hardware, delivering 2.5 kVRMS isolation and 4.8 mm sink-to-lead creepage distance without mica washers.
The IRFIZ34GPBF supports high dV/dt immunity (5.0 V/ns) and features low gate charge (Qg = 46 nC), enabling efficient gate drive in hard-switched topologies. Its body diode exhibits trr = 120–230 ns and Qrr = 0.70–1.4 μC, making it suitable for synchronous rectification and inductive load switching where reverse recovery behavior impacts efficiency and EMI.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 60 V - Maximum drain-source blocking voltage; defines safe operating range in 48 V bus and offline auxiliary supply applications. |
| RDS(on) | 0.050 Ω @ VGS = 10 V - Low conduction loss enables ≤1.2 W I²R dissipation at 12 A continuous current, reducing heatsink requirements. |
| Qg | 46 nC - Total gate charge determines gate driver power and switching speed; compatible with standard 1-A peak drivers at ≤100 kHz. |
| TJ(max) | +175 °C - Extended junction temperature rating allows operation in sealed enclosures or high-ambient environments without derating. |
| EAS | 300 mJ - Single-pulse avalanche energy rating supports unclamped inductive switching in relay drivers and solenoid controls. |
| RthJC | 3.6 °C/W - Low junction-to-case thermal resistance enables direct heatsink coupling and simplifies thermal interface design. |
| dV/dt | 5.0 V/ns - High peak diode recovery dV/dt capability prevents false turn-on during fast commutation in half-bridge configurations. |
Pinout & Package
IRFIZ34GPBF uses the TO-220 FULLPAK package: an isolated variant of TO-220 with integrated high-dielectric molding compound, 4.8 mm minimum creepage, and metal tab electrically isolated from drain. Mounting requires only one M3 screw or clip-no additional insulator needed.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (Tab) | Main current path output / heatsink interface | Electrically isolated metal tab serves as both drain terminal and thermal interface; rated for 2.5 kVRMS isolation from leads. |
| Source | Reference node for gate control and current return | Internal connection to substrate; forms common reference for gate drive and load current return path. |
| Gate | Control input for channel conduction | High-impedance MOS control terminal; requires 2.0–4.0 V threshold and ≤100 nA leakage at ±20 V bias. |
Key Features
| Feature | Design Value |
|---|---|
| Galvanic isolation | 2.5 kVRMS (60 s, 60 Hz) eliminates need for mica insulators or isolation pads in commercial-industrial mounting. |
| Thermal performance | 3.6 °C/W RthJC enables >42 W power dissipation with modest heatsinking-critical for compact power modules. |
| Avalanche ruggedness | 300 mJ single-pulse EAS ensures reliable operation under inductive switching stress without external snubbers. |
| High-temperature operation | Rated for continuous operation up to +175 °C junction temperature-supports designs in automotive engine compartments or sealed industrial cabinets. |
| Fast body diode | 120–230 ns reverse recovery time with low Qrr (0.70–1.4 μC) reduces switching losses in freewheeling paths. |
Applications
| DC-DC Converter Primary Switch | Motor Drive Half-Bridge Leg |
|---|---|
Use Scenario: Step-down conversion in 48 V telecom or industrial power supplies with forced-air or passive heatsinking. IC Role / Device Role / Timing Role: High-side switching element controlling energy transfer into output inductor; operates at 50–200 kHz. Use Value: Low RDS(on) (0.050 Ω) minimizes conduction loss; isolated tab simplifies heatsink integration without insulation hardware. | Use Scenario: Driving brushed DC motors or stepper phase windings in factory automation controllers. IC Role / Device Role / Timing Role: Low-side switch in half-bridge topology; handles bidirectional current during PWM commutation. Use Value: 175 °C TJ(max) sustains operation under stall conditions; 5.0 V/ns dV/dt rating prevents shoot-through during fast transitions. |
| Solenoid/Relay Driver | UPS Inverter Output Stage |
Use Scenario: Controlling high-current AC/DC solenoids in HVAC actuators or industrial valves. IC Role / Device Role / Timing Role: Unclamped inductive switch absorbing stored energy during turn-off via avalanche breakdown. Use Value: 300 mJ EAS rating eliminates need for external clamping diodes or RC snubbers in cost-sensitive designs. | Use Scenario: Output stage in line-interactive UPS inverters delivering 230 VAC from 48 VDC battery bank. IC Role / Device Role / Timing Role: Synchronous rectifier and switching device in full-bridge or push-pull configuration. Use Value: Fast body diode (trr = 120–230 ns) reduces reverse recovery loss; TO-220 FULLPAK isolation enhances safety in grounded-output systems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP60NF06 | 60 V, 60 A, RDS(on) = 0.018 Ω, non-isolated TO-220, higher current rating but no isolation. | Requires external insulation hardware for heatsink mounting; better for high-current, non-isolated PCB layouts. | Select STP60NF06 when higher current capacity is needed and isolation can be implemented externally. |
| IXTP30N10D2 | 100 V, 30 A, RDS(on) = 0.032 Ω, TO-220, no isolation, enhanced body diode softness. | Higher voltage margin suits 90 V input stages; lacks galvanic isolation, limiting use in safety-critical mounting. | Choose IXTP30N10D2 for 100 V systems requiring softer diode recovery, but verify insulation separately. |
Compared with STP60NF06 and IXTP30N10D2, the IRFIZ34GPBF uniquely delivers certified 2.5 kVRMS isolation in a standard TO-220 footprint-reducing BOM count and assembly steps where regulatory creepage or operator safety mandates reinforced insulation.
Availability
IRFIZ34GPBF is available at Aetrix Electronics and suitable for industrial motor drives, DC-DC converters, and solenoid control systems requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.
Supply support for IRFIZ34GPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in MOSFETs, diodes, and optoelectronics with emphasis on reliability, ruggedness, and application-specific optimization.
The IRFIZ34GPBF belongs to Vishay's high-voltage isolated MOSFET product line, engineered for industrial power switching where galvanic isolation, thermal resilience, and avalanche tolerance are mandatory-not optional.
FAQ
What is the maximum continuous drain current for IRFIZ34GPBF at 100 °C case temperature?
The IRFIZ34GPBF supports 14 A continuous drain current at TC = 100 °C, per its Absolute Maximum Ratings table. This derating reflects thermal limits imposed by its 3.6 °C/W RthJC and 175 °C TJ(max). At 25 °C case temperature, the rating rises to 20 A. Designers must verify actual case temperature under load to ensure safe operation of the IRFIZ34GPBF.
Does IRFIZ34GPBF require external insulation when mounted to a heatsink?
No, the IRFIZ34GPBF does not require external insulation when mounted to a heatsink. Its TO-220 FULLPAK package provides 2.5 kVRMS isolation between the drain tab and leads, eliminating the need for mica washers or silicone pads. This feature is confirmed in the product description and absolute maximum ratings section of the IRFIZ34GPBF datasheet.
What is the gate-source threshold voltage range for IRFIZ34GPBF?
The gate-source threshold voltage (VGS(th)) for IRFIZ34GPBF is specified as 2.0 V to 4.0 V at TJ = 25 °C, with VDS = VGS and ID = 250 μA. This range ensures reliable turn-on with standard 5 V or 10 V logic-level gate drivers while maintaining noise immunity. The IRFIZ34GPBF is not a logic-level MOSFET; gate drive must exceed 4 V to guarantee full enhancement.
Can IRFIZ34GPBF be used in avalanche mode repeatedly?
The IRFIZ34GPBF is rated for single-pulse avalanche energy (EAS) of 300 mJ, but repetitive avalanche operation is not characterized or guaranteed. The datasheet specifies EAS as a non-repetitive rating (note "a" in Absolute Maximum Ratings). For circuits subject to repeated inductive switching stress, designers should implement clamping or snubbing and verify thermal limits-relying solely on IRFIZ34GPBF's avalanche capability is not recommended.
What is the drain-source capacitance (Coss) of IRFIZ34GPBF at 25 V?
The drain-source capacitance (Coss) of IRFIZ34GPBF is 600 pF at VDS = 25 V, f = 1.0 MHz, as specified in the Dynamic Characteristics table. This value directly influences hard-switching losses and resonant behavior in flyback or LLC topologies. Coss decreases with increasing VDS, and designers should consult Figure 5 (Capacitance vs. VDS) in the IRFIZ34GPBF datasheet for full voltage dependence.
IRFIZ34GPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- -
- Package/Case:
- TO-220-3 Full Pack, Isolated Tab
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 60 V
- Current - Continuous Drain (Id) @ 25°C:
- 20A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 50mOhm @ 12A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 46 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1200 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 42W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220-3
IRFIZ34GPBF FAQ
1.How can I place an order for IRFIZ34GPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRFIZ34GPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRFIZ34GPBF reliable?
The price and inventory of IRFIZ34GPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFIZ34GPBF is usually 5 days.
3.What payment methods are accepted for IRFIZ34GPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRFIZ34GPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRFIZ34GPBF?
IRFIZ34GPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRFIZ34GPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRFIZ34GPBF?
For technical support, including IRFIZ34GPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRFIZ34GPBF requirements.
6.How does Aetrix verify that IRFIZ34GPBF is sourced from the original manufacturer or authorized distributors?
All IRFIZ34GPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFIZ34GPBF meets industry standards.
7.What is the process for return or replacement of IRFIZ34GPBF?
All IRFIZ34GPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRFIZ34GPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRFIZ34GPBF part is unused and in its original packaging.
Return procedure for IRFIZ34GPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IRFIZ34GPBF Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Comparator circuit design covering voltage thresholds, input limits, open-collector outputs, LM393 wiring, op-amp differences, hysteresis, timing, window detection and practical fault diagnosis.
Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

