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Vishay Siliconix IRFR310TRL

Part No.:
IRFR310TRL
Manufacturer:
Vishay Siliconix
Category:
FETs, MOSFETs
Package:
TO-252-3, DPAK (2 Leads + Tab), SC-63
Datasheet:
AetrixIRFR310TRL.pdf
Description:
MOSFET N-CH 400V 1.7A DPAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,191

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Product details

Overview

IRFR310TRL from Vishay Siliconix is a 400 V, 1.7 A N-channel surface-mount power MOSFET in DPAK (TO-252) package, featuring 3.6 Ω RDS(on) at VGS = 10 V, 12 nC total gate charge, and repetitive avalanche rating-designed for high-voltage DC-DC converters, AC-DC auxiliary supplies, and industrial motor control snubbers.

For engineers reviewing the IRFR310TRL datasheet, IRFR310TRL pinout, IRFR310TRL application, or IRFR310TRL equivalent, this page delivers verified electrical specs, thermal derating behavior, body diode recovery characteristics, and direct-mount PCB layout guidance per Vishay's recommended DPAK pad dimensions.

Technical Context

This third-generation power MOSFET uses planar VDMOS technology with optimized cell pitch and trench-assisted drift region to achieve rugged unclamped inductive switching performance up to 86 mJ single-pulse avalanche energy and 2.5 mJ repetitive avalanche energy. Its 4.0 V/ns peak diode recovery dV/dt rating supports reliable operation in fast-switching flyback and resonant topologies.

The device integrates a low-Qgd/Qg ratio (6.5/12 nC) and 170 pF input capacitance to enable clean turn-on/turn-off waveforms with minimal Miller-induced oscillation-even under high dV/dt conditions. Gate threshold voltage (2.0–4.0 V) ensures compatibility with standard 10 V gate drivers while maintaining noise immunity.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 400 V - Withstands full mains-referenced DC bus voltages in offline SMPS designs
RDS(on) 3.6 Ω @ VGS = 10 V - Enables <1.7 W conduction loss at 1.0 A continuous drain current
Qg 12 nC - Supports efficient 100–500 kHz switching with moderate gate driver strength (e.g., TC4427)
EAS 86 mJ - Allows safe operation in unclamped inductive load switching without external snubber
RthJA 50 °C/W (PCB mount) - Requires ≥1"² FR-4 copper area for 2.5 W ambient-rated dissipation
trr 240–540 ns - Fast body diode recovery reduces cross-conduction losses in synchronous rectification
ID (TC = 100 °C) 1.1 A - Defines maximum continuous current under thermally constrained heatsinkless PCB mounting

Pinout & Package

DPAK (TO-252) surface-mount package with exposed drain tab on bottom side for thermal conduction to PCB copper pour; 3-pin configuration with G–D–S pin order viewed from top (marking side), compatible with vapor-phase and infrared reflow.

Pin/Terminal Circuit Role Design Meaning
G (Gate) Control electrode Accepts 10 V logic-level drive; 100 nA leakage ensures stable off-state with high-impedance gate bias
D (Drain) High-side power terminal Connected internally to thermal pad; must be soldered to ≥1"² copper for rated 25 W case dissipation
S (Source) Power return and reference node Serves as local ground reference for gate drive; internal source inductance (7.5 nH) affects high-speed switching ringing

Key Features

Feature Design Value
Repetitive avalanche rated 1.7 A IAR, 2.5 mJ EAR - Eliminates need for external clamping in relay-driving or solenoid-control circuits
Dynamic dV/dt rated 4.0 V/ns - Prevents false turn-on during high-slew-rate transients in half-bridge or LLC resonant stages
Fast switching td(on) = 7.9 ns, tf = 11 ns - Reduces transition losses in high-frequency isolated DC-DC converters
Low Qgd/Qg ratio 6.5/12 nC = 0.54 - Minimizes Miller plateau duration and improves controllability under hard-switching conditions
Body diode Qrr 0.85–1.6 μC - Enables use in quasi-resonant flyback without added Schottky catch diode

Applications

Industrial Motor Control AC-DC Auxiliary Power Supply

Use Scenario: Driving 24–48 V DC solenoids and small brush motors in PLC I/O modules with inductive kick protection.

IC Role / Device Role / Timing Role: High-side switch controlling inductive load; handles unclamped energy via integrated avalanche capability.

Use Value: Eliminates external TVS/clamp diodes-reducing BOM count and board space while maintaining >100 k-cycle reliability.

Use Scenario: Secondary-side synchronous rectifier or primary-side startup FET in 5–15 W offline flyback adapters.

IC Role / Device Role / Timing Role: Low-duty-cycle high-voltage switch managing bulk capacitor charging or transformer reset.

Use Value: 400 V rating supports universal-input (85–265 VAC) designs without derating; 1.6 V VSD limits conduction loss in startup path.

High-Voltage DC-DC Converter LED Driver Snubber Circuit

Use Scenario: Primary switch in isolated 24–48 V input to 300–400 V output boost-derived DC-DC for industrial sensors.

IC Role / Device Role / Timing Role: Hard-switched MOSFET operating at 200–300 kHz with 320 V VDS stress during switching transitions.

Use Value: 3.6 Ω RDS(on) and 12 nC Qg balance conduction vs. switching loss at 250 kHz; 86 mJ EAS absorbs leakage inductance spikes.

Use Scenario: Passive snubber FET across LED string in constant-current drivers for street lighting with surge immunity.

IC Role / Device Role / Timing Role: Clamping device triggered by transient overvoltage events (e.g., lightning-induced surges).

Use Value: Repetitive avalanche rating enables repeated 1.7 A surge handling without degradation-extending system MTBF beyond 10 years.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel high-voltage power MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
STP3NK60ZFP 600 V VDS, 2.8 Ω RDS(on), TO-220FP package - higher voltage rating but through-hole only Requires PCB through-hole mounting and larger heatsink; not drop-in for DPAK footprint Choose when 600 V margin is mandatory and board space allows TO-220FP layout
SiHFU310 Identical die, IPAK (TO-251) package - same RDS(on), Qg, and avalanche specs but straight-lead through-hole Used in legacy through-hole designs or where manual assembly or mechanical robustness is prioritized Choose for repair, prototyping, or mixed-technology boards needing both SMT and THT components

Compared with STP3NK60ZFP and SiHFU310, IRFR310TRL offers optimal trade-off of 400 V rating, DPAK surface-mount compatibility, and proven avalanche ruggedness-making it preferred for space-constrained industrial power supplies where reflow assembly and thermal pad integration are required.

Availability

IRFR310TRL is available at Aetrix Electronics and suitable for industrial motor control, AC-DC auxiliary power supplies, and high-voltage DC-DC converters requiring stable component supply across multi-year production cycles.

Supply support for IRFR310TRL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-reliability power MOSFETs, diodes, and optoelectronics for industrial, automotive, and computing markets.

The IRFR310TRL belongs to Vishay's third-generation high-voltage power MOSFET family, engineered specifically for ruggedized switching in space-constrained, thermally demanding industrial power systems.

FAQ

What is the maximum continuous drain current for IRFR310TRL at 100 °C case temperature?

The IRFR310TRL supports 1.1 A continuous drain current at TC = 100 °C, as specified in the Absolute Maximum Ratings table. This value reflects linear derating from 1.7 A at 25 °C using the 0.20 W/°C factor-critical for thermal design in enclosed industrial enclosures where case temperature exceeds 70 °C. Always verify junction temperature using RthJC = 5.0 °C/W and actual power dissipation in the final layout.

Does IRFR310TRL have a fully rated avalanche capability, and what does that mean for circuit design?

Yes, IRFR310TRL is fully avalanche rated with 86 mJ single-pulse and 2.5 mJ repetitive avalanche energy. This means the device can safely absorb inductive energy during switching transients-such as relay coil de-energization or transformer leakage spikes-without external clamping components. Designers may eliminate TVS diodes or RC snubbers in cost-sensitive industrial controls, provided IAR ≤ 1.7 A and pulse width remains within thermal limits defined in Figure 11.

What is the recommended PCB pad layout for IRFR310TRL's DPAK package?

Vishay specifies minimum DPAK pads per Application Note 826: 0.224" × 0.420" (5.69 mm × 10.67 mm) for the thermal pad, with 0.055" (1.397 mm) clearance to adjacent traces. The drain tab must connect to ≥1"² internal or external copper pour for rated 25 W dissipation. Avoid solder mask over the thermal pad-use solder paste stencil apertures matching the exposed metal area to ensure void-free thermal interface in reflow.

How does the body diode performance of IRFR310TRL impact its use in synchronous rectification?

The IRFR310TRL body diode has trr = 240–540 ns and Qrr = 0.85–1.6 μC at TJ = 25 °C, enabling moderate-frequency synchronous rectification in flyback converters up to 200 kHz. While not optimized for ultra-fast recovery like dedicated SR controllers, its low VSD = 1.6 V reduces forward conduction loss compared to external Schottky diodes-especially beneficial in low-output-voltage (<12 V), high-current auxiliary rails where diode drop dominates efficiency.

Is IRFR310TRL compatible with lead-free reflow processes, and what is its peak soldering temperature rating?

Yes, IRFR310TRL is Pb-free and halogen-free (per ordering suffix "-BE3"), qualified for lead-free reflow per JEDEC J-STD-020. Its peak soldering temperature rating is 260 °C for 10 seconds, matching standard IPC Class 3 profiles. Thermal pad soldering must follow Vishay's recommended vapor-phase or infrared profile with ramp rates ≤ 3 °C/s and time above 217 °C limited to 60–90 seconds to prevent delamination or gate oxide stress.

IRFR310TRL Specifications

Product attributes
Attribute value
Manufacturer:
Vishay Siliconix
Series:
-
Package/Case:
TO-252-3, DPAK (2 Leads + Tab), SC-63
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
400 V
Current - Continuous Drain (Id) @ 25°C:
1.7A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
3.6Ohm @ 1A, 10V
Vgs(th) (Max) @ Id:
4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
12 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
170 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
2.5W (Ta), 25W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
DPAK

IRFR310TRL FAQ

1.How can I place an order for IRFR310TRL through Aetrix?

Please submit a Request for Quotation (RFQ) for IRFR310TRL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRFR310TRL reliable?

The price and inventory of IRFR310TRL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFR310TRL is usually 5 days.

3.What payment methods are accepted for IRFR310TRL?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRFR310TRL transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRFR310TRL?

IRFR310TRL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRFR310TRL order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRFR310TRL?

For technical support, including IRFR310TRL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRFR310TRL requirements.

6.How does Aetrix verify that IRFR310TRL is sourced from the original manufacturer or authorized distributors?

All IRFR310TRL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFR310TRL meets industry standards.

7.What is the process for return or replacement of IRFR310TRL?

All IRFR310TRL units undergo pre-shipment inspection (PSI). If there is an issue with IRFR310TRL, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRFR310TRL part is unused and in its original packaging.

Return procedure for IRFR310TRL:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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