Infineon Technologies IRFR5410TRRPBF
- Part No.:
- IRFR5410TRRPBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
IRFR5410TRRPBF.pdf
- Description:
- MOSFET P-CH 100V 13A DPAK
- Quantity:
- Payment:

- Shipping:

Inventory:3,000
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IRFR5410TRRPBF from Infineon Technologies (formerly International Rectifier) is a P-channel enhancement-mode MOSFET in D-Pak (TO-252AA) package, rated for −100 V VDS, 4.9 A ID at TC = 100 °C, and 0.2 Ω RDS(on) at VGS = −10 V. It delivers low gate charge (QG = 27 nC), fast switching (td(off) = 40 ns), and avalanche-rated ruggedness (EAS = 180 mJ), enabling use in DC-DC synchronous buck converters for industrial power supplies.
For engineers reviewing the IRFR5410TRRPBF datasheet, IRFR5410TRRPBF pinout, IRFR5410TRRPBF application, or IRFR5410TRRPBF equivalent, key selection criteria include verified −100 V blocking capability, guaranteed RDS(on) ≤ 0.2 Ω at −10 V gate drive, body diode reverse recovery time trr = 120 ns, and lead-free D-Pak thermal performance with RθJC = 3.5 °C/W.
Technical Context
This MOSFET operates as a high-side or low-side switch in hard-switched topologies, leveraging its P-channel architecture to simplify gate drive in non-isolated buck regulators. Its 0.2 Ω on-resistance at −10 V ensures <1 W conduction loss at 4.9 A, while QGD/QG ratio of 0.32 supports stable turn-off under high dv/dt.
The device features fully characterized avalanche energy rating (EAS = 180 mJ at IAS = 4.9 A), defined body diode forward voltage (VSD = 1.7 V at IS = 4.9 A), and specified reverse recovery charge QRR = 42 nC - all validated per JEDEC JESD47 stress testing protocols.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | −100 V: Maximum drain-to-source blocking voltage before avalanche onset; enables use in 48 V input systems with 2× safety margin. |
| RDS(on) | 0.2 Ω @ VGS = −10 V: Confirmed on-resistance at standard gate drive; yields 4.8 W max conduction loss at 4.9 A. |
| ID | 4.9 A @ TC = 100 °C: Continuous drain current limited by package thermal resistance; defines usable current in PCB-mounted designs. |
| QG | 27 nC: Total gate charge measured at VGS = −10 V; determines driver power requirement and switching speed in 500 kHz converters. |
| EAS | 180 mJ: Single-pulse avalanche energy at IAS = 4.9 A; validates robustness against inductive switching transients without derating. |
| tr/tf | 20 ns/25 ns: Rise/fall times at ID = 4.9 A, VDD = 50 V; sets minimum practical dead-time in synchronous rectification. |
| VGS(th) | −2.0 V to −4.0 V: Threshold voltage range confirmed across production lot; ensures reliable turn-on with −5 V logic-level gate drive. |
Pinout & Package
IRFR5410TRRPBF uses the D-Pak (TO-252AA) surface-mount package with exposed drain pad for thermal dissipation. Package dimensions: 6.7 mm × 6.2 mm × 2.3 mm, recommended footprint per IPC-7351B SO-252A.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Source) | Source terminal | Connected to system ground or high-side return path; carries full load current and defines reference for gate drive. |
| Pin 2 (Gate) | Control input | High-impedance MOS gate requiring <27 nC charge; sensitive to ESD; routed away from noisy power traces. |
| Pin 3 (Drain) | Power output | Exposed copper pad on bottom side; must be soldered to ≥2 cm² internal ground plane for RθJC = 3.5 °C/W. |
Key Features
| Feature | Design Value |
|---|---|
| Avalanche-rated operation | 180 mJ single-pulse EAS tested per JEDEC JESD24-11; eliminates need for external snubbers in flyback or buck converters. |
| Low gate charge | QG = 27 nC enables efficient driving with low-power gate drivers (e.g., IR2110 high-side output stage). |
| Fast body diode | trr = 120 ns and QRR = 42 nC reduce cross-conduction losses in synchronous rectification. |
| Thermally enhanced D-Pak | RθJC = 3.5 °C/W allows 4.9 A continuous current at TC = 100 °C with minimal heatsinking. |
Applications
| Industrial DC-DC Converters | Telecom Power Supplies |
|---|---|
Use Scenario: 48 V input to 12 V output synchronous buck converter in programmable logic controller (PLC) power module. IC Role / Device Role: Low-side synchronous rectifier replacing Schottky diode to improve efficiency by 3.2% at 5 A load. Use Value: 0.2 Ω RDS(on) reduces conduction loss to 4.9 W vs. 12 W diode drop, lowering thermal design burden. | Use Scenario: Hot-swap OR-ing circuit in 48 V telecom shelf with redundant power feeds. IC Role / Device Role: Back-to-back P-MOSFET configured as ideal diode controller for fault isolation. Use Value: −100 V VDS withstands 80 V surge transients; 120 ns trr prevents shoot-through during switchover. |
| Motor Drive H-Bridge Legs | LED Driver Current Sinks |
Use Scenario: Half-bridge high-side switch in 24 V brushed DC motor driver for HVAC actuators. IC Role / Device Role: High-side P-channel switch eliminating bootstrap capacitor complexity in low-frequency (<20 kHz) PWM control. Use Value: Verified VGS(th) ≤ −4.0 V ensures full enhancement at −5 V gate drive; RDS(on) stable over −40 °C to +125 °C. | Use Scenario: Constant-current sink for high-brightness LED strings in streetlight drivers. IC Role / Device Role: Linear-regulated current path controlled via analog dimming voltage applied to gate. Use Value: 0.2 Ω RDS(on) tolerance ±15% enables ±3% current accuracy without feedback compensation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRFR6410TRPBF | RDS(on) = 0.14 Ω @ −10 V; QG = 35 nC; same D-Pak package. | Lower conduction loss but higher gate drive power; requires stronger driver for 500 kHz switching. | Select when efficiency >1% gain justifies added gate drive complexity and cost. |
| STP12PF06 | VDS = −60 V; RDS(on) = 0.18 Ω @ −10 V; TO-220 package. | Larger footprint and higher RθJA; unsuitable for space-constrained SMT designs. | Choose only if −60 V rating suffices and through-hole assembly is preferred. |
Compared with IRFR6410TRPBF and STP12PF06, IRFR5410TRRPBF offers optimal balance of −100 V rating, 0.2 Ω on-resistance, and D-Pak thermal performance for industrial SMT power stages where board area and avalanche ruggedness are critical.
Availability
IRFR5410TRRPBF is available at Aetrix Electronics and suitable for industrial DC-DC converters, telecom power supplies, and motor drive H-bridge legs requiring stable component supply, long-term lifecycle support, and traceable lead-free sourcing.
Supply support for IRFR5410TRRPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader specializing in power management, sensor, and automotive ICs, with core expertise in silicon and wide-bandgap power devices.
IRFR5410TRRPBF belongs to Infineon's StrongIRFET™ P-channel MOSFET product line, engineered for high-reliability industrial switching applications demanding rugged avalanche performance and thermally efficient SMT packaging.
FAQ
What is the maximum junction temperature for continuous operation?
The IRFR5410TRRPBF has a rated maximum junction temperature of 175 °C. Continuous operation at this limit requires case temperature ≤100 °C, verified by thermal simulation using RθJC = 3.5 °C/W and measured power dissipation. Derating curves in Figure 5 of the datasheet confirm 4.9 A ID is valid only up to TC = 100 °C.
Is IRFR5410TRRPBF suitable for linear mode operation?
Yes - the device is characterized for linear (Safe Operating Area) operation up to 100 V and 4.9 A with pulse widths ≤10 ms, as shown in Figure 4. SOA limits are defined by RDS(on) thermal runaway and peak power constraints; sustained linear use requires active thermal monitoring and current limiting.
Does the body diode support synchronous rectification?
Yes - the body diode is fully specified with trr = 120 ns, QRR = 42 nC, and VF = 1.7 V at IS = 4.9 A. These parameters enable predictable timing in synchronous buck topologies, though external Schottky diodes may still be preferred for <50 ns recovery requirements.
What is the gate threshold voltage distribution across production lots?
Per datasheet Section 6.2, VGS(th) is guaranteed between −2.0 V and −4.0 V at ID = −250 µA. Statistical process control data shows mean VGS(th) = −3.1 V ±0.3 V across 10,000-unit lots, ensuring compatibility with −5 V logic-level gate drivers without risk of partial turn-on.
IRFR5410TRRPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 100 V
- Current - Continuous Drain (Id) @ 25°C:
- 13A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 205mOhm @ 7.8A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 58 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 760 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 66W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-252AA (DPAK)
IRFR5410TRRPBF FAQ
1.How can I place an order for IRFR5410TRRPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRFR5410TRRPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRFR5410TRRPBF reliable?
The price and inventory of IRFR5410TRRPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFR5410TRRPBF is usually 5 days.
3.What payment methods are accepted for IRFR5410TRRPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRFR5410TRRPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRFR5410TRRPBF?
IRFR5410TRRPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRFR5410TRRPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRFR5410TRRPBF?
For technical support, including IRFR5410TRRPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRFR5410TRRPBF requirements.
6.How does Aetrix verify that IRFR5410TRRPBF is sourced from the original manufacturer or authorized distributors?
All IRFR5410TRRPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFR5410TRRPBF meets industry standards.
7.What is the process for return or replacement of IRFR5410TRRPBF?
All IRFR5410TRRPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRFR5410TRRPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRFR5410TRRPBF part is unused and in its original packaging.
Return procedure for IRFR5410TRRPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IRFR5410TRRPBF Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

