Vishay Siliconix IRFS11N50APBF
- Part No.:
- IRFS11N50APBF
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
IRFS11N50APBF.pdf
- Description:
- MOSFET N-CH 500V 11A D2PAK
- Quantity:
- Payment:

- Shipping:

Inventory:3,156
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Product details
Overview
IRFS11N50APBF from Vishay Siliconix is a 500 V, 11 A N-channel power MOSFET in D2PAK (TO-263) package, featuring 0.52 Ω RDS(on) at VGS = 10 V, 52 nC total gate charge, and 275 mJ single-pulse avalanche energy - designed for high-voltage switching in SMPS and UPS systems.
For engineers reviewing the IRFS11N50APBF datasheet, IRFS11N50APBF pinout, IRFS11N50APBF application, or IRFS11N50APBF equivalent, this device's rugged dV/dt capability (6.9 V/ns), characterized Coss (55 pF at 400 V), and body diode recovery time (510–770 ns) are critical for hard-switched bridge topologies and PFC stages.
Technical Context
This MOSFET employs planar vertical DMOS technology optimized for high-voltage unclamped inductive switching. Its gate threshold voltage (2.0–4.0 V) ensures stable turn-on under wide temperature ranges, while the specified effective output capacitance (Coss eff. = 97 pF) enables accurate snubber and timing calculations in resonant converters.
The device integrates a robust intrinsic body diode with 11 A continuous source-drain current rating and controlled reverse recovery (Qrr = 3.4–5.1 μC), supporting synchronous rectification and bidirectional energy transfer in two-transistor forward and half-bridge configurations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 500 V - supports DC bus voltages up to 400 V in boost PFC and offline SMPS with margin. |
| RDS(on) | 0.52 Ω @ VGS = 10 V - determines conduction loss in high-current primary-side switches. |
| Qg | 52 nC - defines gate drive power requirement and switching speed in 100–500 kHz applications. |
| EAS | 275 mJ - enables reliable operation under unclamped inductive load transients without external clamping. |
| Coss eff. | 97 pF - models actual capacitive turn-off delay across 0–400 V, critical for ZVS design. |
| trr | 510–770 ns - sets minimum dead-time requirements to avoid shoot-through in bridge legs. |
| RthJC | 0.75 °C/W - allows thermal design of heatsink interface for 170 W continuous dissipation at TC = 25 °C. |
Pinout & Package
D2PAK (TO-263) surface-mount package with isolated drain tab (pin 2), standard 3-pin layout, and thermal pad on underside for PCB copper pour attachment.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (G) | Gate | Control terminal requiring ≤ ±30 V drive; low Qgs/Qgd ratio (13/18 nC) enables fast, low-loss switching. |
| Pin 2 (D) | Drain | High-voltage power terminal connected to internal die backside; electrically tied to exposed metal tab for thermal conduction. |
| Pin 3 (S) | Source | Power return and gate reference node; forms common connection point for gate driver ground and current sensing. |
Key Features
| Feature | Design Value |
|---|---|
| Low Qg (52 nC) | Reduces gate driver IC stress and enables use of low-power isolated drivers in space-constrained designs. |
| Characterized Coss & Coss eff. | Enables precise modeling of turn-off losses and snubber sizing without iterative testing. |
| Avalanche-rated (EAS = 275 mJ) | Eliminates need for external RCD clamp circuits in flyback or forward converters with leakage inductance. |
| Peak dV/dt immunity (6.9 V/ns) | Prevents false turn-on during high-slew-rate switching events in half/full-bridge topologies. |
| Body diode Qrr (3.4–5.1 μC) | Supports soft-recovery behavior in synchronous rectification and bidirectional DC-DC stages. |
Applications
| Switch Mode Power Supply (SMPS) | Uninterruptible Power Supply (UPS) |
|---|---|
Use Scenario: Primary-side switch in 500 W two-transistor forward converter operating at 100 kHz. IC Role / Device Role / Timing Role: High-voltage power switch controlling energy transfer from DC bus to transformer primary. Use Value: 500 V VDS rating and 275 mJ EAS withstand leakage spike energy without failure during transient overload. |
Use Scenario: Inverter stage H-bridge switch in online double-conversion UPS delivering 1 kVA output. IC Role / Device Role / Timing Role: Fast-turning N-channel switch enabling efficient 50/60 Hz AC synthesis with minimal dead-time distortion. Use Value: 510–770 ns trr and controlled Qrr allow tight dead-time control (< 200 ns) to prevent cross-conduction while maintaining low THD. |
| Power Factor Correction Boost | High-Speed Industrial Motor Drive |
Use Scenario: Boost switch in active PFC front-end for industrial AC-DC power supply (230 VAC input). IC Role / Device Role / Timing Role: High-frequency (65–135 kHz) switching element shaping input current waveform to match voltage phase. Use Value: 0.52 Ω RDS(on) minimizes conduction loss at peak line current (≥15 A), while 52 nC Qg enables efficient gate drive at full frequency range. |
Use Scenario: Half-bridge leg in 3 kW servo drive inverter module controlling permanent magnet motor. IC Role / Device Role / Timing Role: High-reliability power switch handling repetitive 44 A pulsed currents during acceleration/deceleration cycles. Use Value: 44 A IDM rating and 7.0 A continuous current at TC = 100 °C support high-torque intermittent loads without derating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP11NM50N | RDS(on) = 0.53 Ω, Qg = 45 nC, EAS = 220 mJ, TO-220 package | Lacks D2PAK thermal performance; lower avalanche energy limits unclamped inductive robustness | Preferred where cost-sensitive TO-220 mounting is acceptable and avalanche margin is secondary |
| IXTH11N50L | RDS(on) = 0.55 Ω, Qg = 48 nC, EAS = 300 mJ, TO-247 package | Higher RthJC (0.85 °C/W) and larger footprint; superior avalanche rating | Chosen when maximum ruggedness is required and board space permits TO-247 mechanical layout |
Compared with STP11NM50N and IXTH11N50L, the IRFS11N50APBF delivers optimal balance of D2PAK thermal efficiency (RthJC = 0.75 °C/W), industry-leading Coss eff. characterization, and proven 275 mJ avalanche capability - making it ideal for compact, high-reliability SMPS and UPS designs where thermal density and transient immunity are co-critical.
Availability
IRFS11N50APBF is available at Aetrix Electronics and suitable for Switch Mode Power Supply (SMPS), Uninterruptible Power Supply (UPS), and Power Factor Correction Boost applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for IRFS11N50APBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics with emphasis on ruggedness, precision, and reliability.
The IRFS11N50APBF belongs to Vishay's high-voltage power MOSFET product line engineered for industrial-grade switching applications demanding high avalanche energy, low gate charge, and stable parametric performance over temperature.
FAQ
What is the maximum continuous drain current for IRFS11N50APBF at 100 °C case temperature?
The IRFS11N50APBF supports 7.0 A continuous drain current at TC = 100 °C, as specified in the Absolute Maximum Ratings table. This derated value reflects thermal limitations of the D2PAK package and must be used in thermal design calculations when ambient or heatsink conditions elevate case temperature beyond 25 °C. The IRFS11N50APBF maintains safe operation within its SOA curve under these conditions when mounted on adequate copper area.
Does IRFS11N50APBF have a fully characterized body diode for synchronous rectification?
Yes, the IRFS11N50APBF includes fully characterized body diode parameters: reverse recovery time (trr = 510–770 ns), reverse recovery charge (Qrr = 3.4–5.1 μC), and forward voltage (VSD = 1.5 V at IS = 11 A). These values are measured per JEDEC standards and enable accurate dead-time optimization and loss estimation in synchronous rectifier or bidirectional converter topologies using the IRFS11N50APBF.
What is the gate threshold voltage range for IRFS11N50APBF, and how does it affect drive circuit design?
The IRFS11N50APBF has a gate threshold voltage (VGS(th)) range of 2.0 V to 4.0 V at TJ = 25 °C. This moderate threshold ensures reliable turn-on with standard 10 V gate drivers while avoiding unintended conduction from noise coupling. Drive circuits must supply ≥10 V to achieve rated RDS(on) of 0.52 Ω; the IRFS11N50APBF is not a logic-level device and requires dedicated gate bias above 4.5 V for full enhancement.
Can IRFS11N50APBF be used in avalanche mode, and what is its single-pulse energy rating?
Yes, the IRFS11N50APBF is fully rated for repetitive and single-pulse avalanche operation. Its single-pulse avalanche energy (EAS) is 275 mJ under test conditions of IAS = 11 A, L = 4.5 mH, and Rg = 25 Ω. This rating is validated per JEDEC JESD24-11 and allows the IRFS11N50APBF to safely absorb inductive energy in flyback, forward, and LLC resonant converters without external clamping components.
What thermal resistance values apply to IRFS11N50APBF in D2PAK package?
The IRFS11N50APBF specifies RthJC = 0.75 °C/W (max) from junction to case, and RthJA = 62 °C/W (max) from junction to ambient. The low RthJC enables efficient heat transfer to an external heatsink via the exposed drain tab, while RthJA applies only to devices mounted on standard FR-4 with minimal copper. For production designs, thermal performance of the IRFS11N50APBF must be validated using measured case temperature and actual PCB copper area.
IRFS11N50APBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- -
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tube
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 500 V
- Current - Continuous Drain (Id) @ 25°C:
- 11A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 520mOhm @ 6.6A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 52 nC @ 10 V
- Vgs (Max):
- ±30V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1423 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 170W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-263 (D2PAK)
IRFS11N50APBF FAQ
1.How can I place an order for IRFS11N50APBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRFS11N50APBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRFS11N50APBF reliable?
The price and inventory of IRFS11N50APBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFS11N50APBF is usually 5 days.
3.What payment methods are accepted for IRFS11N50APBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRFS11N50APBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRFS11N50APBF?
IRFS11N50APBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRFS11N50APBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRFS11N50APBF?
For technical support, including IRFS11N50APBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRFS11N50APBF requirements.
6.How does Aetrix verify that IRFS11N50APBF is sourced from the original manufacturer or authorized distributors?
All IRFS11N50APBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFS11N50APBF meets industry standards.
7.What is the process for return or replacement of IRFS11N50APBF?
All IRFS11N50APBF units undergo pre-shipment inspection (PSI). If there is an issue with IRFS11N50APBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRFS11N50APBF part is unused and in its original packaging.
Return procedure for IRFS11N50APBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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