Infineon Technologies IRFS7534TRLPBF
- Part No.:
- IRFS7534TRLPBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-263-7, D2PAK (6 Leads + Tab)
- Datasheet:
-
IRFS7534TRLPBF.pdf
- Description:
- MOSFET N CH 60V 195A D2PAK
- Quantity:
- Payment:

- Shipping:

Inventory:2,332
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Product details
Overview
IRFS7534TRLPBF from Infineon Technologies is a 60V, 2.0 mΩ typ. N-channel D2PAK-2 (TO-263) Power MOSFET optimized for high-current synchronous rectification and half/full-bridge motor drive topologies. It delivers 195A package-limited continuous drain current at 25°C, features 186 nC total gate charge, and supports avalanche energy up to 373 mJ (single-pulse), enabling robust operation in BLDC inverters and resonant DC/DC converters.
For engineers reviewing the IRFS7534TRLPBF datasheet, IRFS7534TRLPBF pinout, IRFS7534TRLPBF application, or IRFS7534TRLPBF equivalent, key selection criteria include RDS(on) vs. temperature stability, dV/dt ruggedness of the body diode, SOA compliance in unclamped inductive switching, and thermal resistance (RθJC = 0.51°C/W) for high-power PCB-mount designs.
Technical Context
This MOSFET employs HEXFET® silicon with enhanced body diode dI/dt capability (up to 1135 A/µs) and improved dynamic dV/dt ruggedness-critical for fast-switching bridge legs where commutation-induced voltage transients occur. Its fully characterized avalanche SOA and thermally limited EAS rating ensure reliable operation under repetitive unclamped inductive load conditions.
The device uses standard gate drive logic (VGS(th) = 2.1–3.7 V) and exhibits low Ciss (10,034 pF) and Coss (921 pF) at VDS = 25 V, supporting efficient high-frequency switching in hard- and soft-switched topologies including LLC resonant converters and OR-ing power supplies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 60 V - Maximum blocking voltage compatible with 48 V nominal bus systems and 12–24 V battery-powered inverters. |
| RDS(on) typ. | 2.0 mΩ at VGS = 10 V, ID = 100 A - Enables <1.0 W conduction loss at 100 A, reducing heatsink requirements in high-current motor drives. |
| ID (Package) | 195 A at TC = 25°C - Determined by wire-bond current limit, defining maximum safe DC output in TO-263 surface-mount applications. |
| Qg | 186 nC typ. - Requires ~1.9 µC gate drive energy per switch cycle at 10 V, informing gate driver selection for ≤100 kHz PWM operation. |
| EAS | 373 mJ (single-pulse) - Specifies maximum inductive energy absorption before junction overheating, critical for fault-tolerant BLDC phase-leg design. |
| RθJC | 0.51 °C/W - Enables direct thermal path to heatsink; 100 W dissipation raises junction only 51°C above case temperature. |
| VSD | 1.2 V at IS = 100 A - Low forward voltage of integrated body diode reduces reverse-conduction losses in synchronous rectifier mode. |
Pinout & Package
IRFS7534TRLPBF is housed in a D2PAK-2 (TO-263-2L) surface-mount package with exposed drain pad for thermal and electrical connection. The three terminals are arranged in standard D2PAK footprint: Gate (left lead), Drain (center pad + tab), Source (right lead).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Gate (G) | Control electrode | Receives 10 V logic-level signal to fully enhance channel; threshold voltage range 2.1–3.7 V ensures compatibility with 3.3 V and 5 V microcontrollers via gate driver. |
| Drain (D) | High-side power terminal | Connected to PCB copper pour or heatsink; electrically and thermally coupled to exposed metal tab-must be isolated from other potentials unless referenced to system ground. |
| Source (S) | Return path / reference node | Serves as local ground reference for gate drive; carries full load current and must be routed with low-inductance layout to minimize switching oscillation. |
Key Features
| Feature | Design Value |
|---|---|
| Enhanced body diode dV/dt capability | 9.2 V/ns at TJ = 175°C - Prevents false turn-on during high-speed commutation in half-bridge configurations. |
| Fully characterized avalanche SOA | Validated single-pulse EAS = 373 mJ and repetitive EAR = 775 mJ - Enables use in unclamped inductive switching without external snubbers. |
| Low Coss eff. (energy-related) | 892 pF - Reduces turn-off energy loss in resonant topologies, improving efficiency in LLC and ZVS converters. |
| Lead-free, RoHS-compliant construction | Meets IPC-J-STD-020 moisture sensitivity level 1 - Supports standard reflow profiles without baking or special handling. |
Applications
| Brushed Motor Drive | BLDC Inverter Stage |
|---|---|
Use Scenario: H-bridge control of 24–48 V DC brushed motors in power tools and industrial actuators. IC Role / Device Role / Timing Role: High-side and low-side switching element in dual-N configuration, operating at 10–20 kHz PWM frequency. Use Value: 2.0 mΩ RDS(on) minimizes I²R heating during stall conditions; 195 A rating supports peak torque currents >150 A. | Use Scenario: Three-phase inverter stage driving sensorless BLDC motors in e-bikes and HVAC blowers. IC Role / Device Role / Timing Role: Phase-leg switch with synchronous rectification enabled during freewheeling intervals. Use Value: Body diode VSD = 1.2 V at 100 A reduces conduction loss by ~30% versus external Schottky solutions in 10–50 kHz operation. |
| Synchronous Rectifier | OR-ing Power Supply |
Use Scenario: Secondary-side switching in 48 V input, 12 V output LLC resonant DC/DC converter for telecom PSUs. IC Role / Device Role / Timing Role: Low-side synchronous rectifier replacing Schottky diode, driven by transformer-coupled gate signal. Use Value: 2.0 mΩ on-resistance cuts conduction loss by >60% vs. 40 V Schottky at 80 A, improving full-load efficiency by 1.2–1.8%. | Use Scenario: Redundant 28 V DC power combining in avionics and server backplanes. IC Role / Device Role / Timing Role: Unidirectional power path switch with fast turn-off to prevent reverse current flow during source failure. Use Value: 9.2 V/ns dV/dt immunity prevents parasitic turn-on during hot-swap transients; 0.51 °C/W RθJC sustains 150 A continuous current with forced-air cooling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-current N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL220N6F7 | RDS(on) = 2.2 mΩ (typ.), Qg = 170 nC, DFN8 5×6 mm package with bottom-side thermal pad | Smaller footprint but lower avalanche rating (EAS = 220 mJ); no through-hole option | Select when board space is constrained and thermal interface to PCB is superior to heatsink mounting. |
| IXFH70N60X3 | RDS(on) = 12.5 mΩ (typ.), 600 V rating, TO-247 package, higher voltage margin | Designed for 400 V bus systems; unsuitable for 48 V high-current applications due to excessive conduction loss | Choose only if system requires 600 V blocking and lower current (<50 A) operation-no direct replacement for IRFS7534TRLPBF's 195 A capability. |
Compared with STL220N6F7, IRFS7534TRLPBF offers 10% lower RDS(on) and 2× higher avalanche energy, making it preferable for ruggedized motor drives; versus IXFH70N60X3, its 2.0 mΩ RDS(on) enables >5× higher current density in 48 V systems, justifying use despite lower voltage rating.
Availability
IRFS7534TRLPBF is available at Aetrix Electronics and suitable for brushed motor drives, BLDC inverters, synchronous rectifiers, and OR-ing power supplies requiring stable component supply across industrial, transportation, and telecom power systems.
Supply support for IRFS7534TRLPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs and discrete devices.
This device belongs to the StrongIRFET™ HEXFET® family, engineered specifically for high-efficiency, high-reliability power conversion in motor drives, UPS, and telecom infrastructure where low RDS(on), robust avalanche behavior, and thermal performance are critical.
FAQ
What is the maximum continuous drain current for IRFS7534TRLPBF at 100°C case temperature?
At TC = 100°C, the continuous drain current is 164 A (silicon-limited) per the Absolute Maximum Ratings table. This reflects thermal derating from the 195 A package limit at 25°C, governed by RθJC = 0.51°C/W and maximum junction temperature of 175°C.
Does IRFS7534TRLPBF support gate drive from a 3.3 V microcontroller directly?
No. With VGS(th) ranging from 2.1–3.7 V and requiring 10 V for full enhancement (RDS(on) = 2.0 mΩ), direct 3.3 V drive results in high RDS(on) (>20 mΩ) and excessive conduction loss. A gate driver IC or level-shifting circuit is mandatory for reliable switching.
How is the body diode recovery performance quantified for this MOSFET?
The body diode is characterized with trr = 46 ns (TJ = 25°C), Qrr = 71 nC, and peak recovery dv/dt = 9.2 V/ns at TJ = 175°C. These values are measured under IF = 100 A, VR = 51 V, and di/dt = 100 A/µs, confirming suitability for high-di/dt freewheeling in synchronous rectifier applications.
Is IRFS7534TRLPBF suitable for use in a Class D audio amplifier output stage?
While electrically capable of high-frequency switching, IRFS7534TRLPBF is not optimized for audio-class linearity or low gate charge variation across VGS. Its Qg = 186 nC and Ciss = 10,034 pF introduce significant Miller effect at >200 kHz, and lack of specified SOA in linear region makes it unsuitable for analog Class D output stages without extensive characterization.
IRFS7534TRLPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®, StrongIRFET™
- Package/Case:
- TO-263-7, D2PAK (6 Leads + Tab)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 60 V
- Current - Continuous Drain (Id) @ 25°C:
- 195A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 6V, 10V
- Rds On (Max) @ Id, Vgs:
- 2.4mOhm @ 100A, 10V
- Vgs(th) (Max) @ Id:
- 3.7V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 279 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 10034 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 294W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TO263-7
IRFS7534TRLPBF FAQ
1.How can I place an order for IRFS7534TRLPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRFS7534TRLPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRFS7534TRLPBF reliable?
The price and inventory of IRFS7534TRLPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFS7534TRLPBF is usually 5 days.
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IRFS7534TRLPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRFS7534TRLPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRFS7534TRLPBF?
For technical support, including IRFS7534TRLPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRFS7534TRLPBF requirements.
6.How does Aetrix verify that IRFS7534TRLPBF is sourced from the original manufacturer or authorized distributors?
All IRFS7534TRLPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFS7534TRLPBF meets industry standards.
7.What is the process for return or replacement of IRFS7534TRLPBF?
All IRFS7534TRLPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRFS7534TRLPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRFS7534TRLPBF part is unused and in its original packaging.
Return procedure for IRFS7534TRLPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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